FR3028665B1 - Assemblage d'un composant plan sur un support plan - Google Patents
Assemblage d'un composant plan sur un support plan Download PDFInfo
- Publication number
- FR3028665B1 FR3028665B1 FR1461139A FR1461139A FR3028665B1 FR 3028665 B1 FR3028665 B1 FR 3028665B1 FR 1461139 A FR1461139 A FR 1461139A FR 1461139 A FR1461139 A FR 1461139A FR 3028665 B1 FR3028665 B1 FR 3028665B1
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- FR
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- Prior art keywords
- support
- component
- plan
- assembly
- perimeter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
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- H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L2224/83193—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
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- H01L33/58—Optical field-shaping elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Automatic Assembly (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Ce procédé d'assemblage d'un composant plan sur un support plan (16), comprend : - la définition, sur le support (16), d'un périmètre (52) centré sur une position souhaitée du composant et apte à encadrer le composant lorsque ce dernier est positionné sur le support (16) dans sa position souhaitée ; - la réalisation, sur le périmètre (52), d'au moins une première paire de butées (54) et d'une deuxième paire de butées (54) ; - le report dans le périmètre (52) du composant sur le support (16); et - la fixation du composant sur le support (16) La formation d'au moins une butée (54) sur le support (16) comprend la fixation d'un filsur le périmètre (52) de manière à former au moins une boucle (54) faisant saillie du support (16).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1461139A FR3028665B1 (fr) | 2014-11-18 | 2014-11-18 | Assemblage d'un composant plan sur un support plan |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1461139A FR3028665B1 (fr) | 2014-11-18 | 2014-11-18 | Assemblage d'un composant plan sur un support plan |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3028665A1 FR3028665A1 (fr) | 2016-05-20 |
FR3028665B1 true FR3028665B1 (fr) | 2021-11-26 |
Family
ID=52737204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1461139A Active FR3028665B1 (fr) | 2014-11-18 | 2014-11-18 | Assemblage d'un composant plan sur un support plan |
Country Status (1)
Country | Link |
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FR (1) | FR3028665B1 (fr) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9147665B2 (en) * | 2007-11-06 | 2015-09-29 | Fairchild Semiconductor Corporation | High bond line thickness for semiconductor devices |
JP5217013B2 (ja) * | 2008-01-11 | 2013-06-19 | 日産自動車株式会社 | 電力変換装置およびその製造方法 |
CN102859671A (zh) * | 2010-12-03 | 2013-01-02 | 富士电机株式会社 | 半导体器件以及半导体器件的制造方法 |
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2014
- 2014-11-18 FR FR1461139A patent/FR3028665B1/fr active Active
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Publication number | Publication date |
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FR3028665A1 (fr) | 2016-05-20 |
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