FR3007193B1 - Materiau semi-conducteur incluant des zones d'orientations cristallines differentes et procede de realisation associe - Google Patents
Materiau semi-conducteur incluant des zones d'orientations cristallines differentes et procede de realisation associeInfo
- Publication number
- FR3007193B1 FR3007193B1 FR1355677A FR1355677A FR3007193B1 FR 3007193 B1 FR3007193 B1 FR 3007193B1 FR 1355677 A FR1355677 A FR 1355677A FR 1355677 A FR1355677 A FR 1355677A FR 3007193 B1 FR3007193 B1 FR 3007193B1
- Authority
- FR
- France
- Prior art keywords
- semiconductor material
- material including
- making same
- different crystalline
- crystalline orientations
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02428—Structure
- H01L21/0243—Surface structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02502—Layer structure consisting of two layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02513—Microstructure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Recrystallisation Techniques (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1355677A FR3007193B1 (fr) | 2013-06-18 | 2013-06-18 | Materiau semi-conducteur incluant des zones d'orientations cristallines differentes et procede de realisation associe |
TW103121104A TW201511090A (zh) | 2013-06-18 | 2014-06-18 | 包含不同結晶取向區之半導體材料及其相關製造方法 |
US14/900,088 US9882087B2 (en) | 2013-06-18 | 2014-06-18 | Semiconductor material including different crystalline orientation zones and related production process |
EP14731271.4A EP3011586A1 (fr) | 2013-06-18 | 2014-06-18 | Materiau semi-conducteur incluant des zones d'orientations cristallines differentes et procede de realisation associe |
PCT/EP2014/062847 WO2014202679A1 (fr) | 2013-06-18 | 2014-06-18 | Materiau semi-conducteur incluant des zones d'orientations cristallines differentes et procede de realisation associe |
US15/865,065 US10497833B2 (en) | 2013-06-18 | 2018-01-08 | Semiconductor material including different crystalline orientation zones and related production process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1355677A FR3007193B1 (fr) | 2013-06-18 | 2013-06-18 | Materiau semi-conducteur incluant des zones d'orientations cristallines differentes et procede de realisation associe |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3007193A1 FR3007193A1 (fr) | 2014-12-19 |
FR3007193B1 true FR3007193B1 (fr) | 2016-12-09 |
Family
ID=49546503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1355677A Expired - Fee Related FR3007193B1 (fr) | 2013-06-18 | 2013-06-18 | Materiau semi-conducteur incluant des zones d'orientations cristallines differentes et procede de realisation associe |
Country Status (5)
Country | Link |
---|---|
US (2) | US9882087B2 (fr) |
EP (1) | EP3011586A1 (fr) |
FR (1) | FR3007193B1 (fr) |
TW (1) | TW201511090A (fr) |
WO (1) | WO2014202679A1 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180358221A1 (en) * | 2017-06-07 | 2018-12-13 | Macom Technology Solutions Holdings, Inc. | Reduction of wafer bow during growth of epitaxial films |
KR102404060B1 (ko) * | 2018-01-11 | 2022-06-02 | 삼성전자주식회사 | 캐패시터를 갖는 반도체 소자 및 그 형성 방법 |
CN112133632A (zh) * | 2020-09-16 | 2020-12-25 | 深圳市汇芯通信技术有限公司 | 减少高电子迁移率晶体管hemt应力的方法及hemt |
EP4044216A1 (fr) * | 2021-02-16 | 2022-08-17 | Siltronic AG | Procédé pour tester la robustesse de contrainte d'un substrat semi-conducteur |
CN113281921A (zh) * | 2021-05-07 | 2021-08-20 | 三明学院 | 一种一阶电光效应硅调制器及其制备工艺 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2860248B1 (fr) * | 2003-09-26 | 2006-02-17 | Centre Nat Rech Scient | Procede de realisation de substrats autosupportes de nitrures d'elements iii par hetero-epitaxie sur une couche sacrificielle |
KR100773555B1 (ko) * | 2006-07-21 | 2007-11-06 | 삼성전자주식회사 | 저결함 반도체 기판 및 그 제조방법 |
US9105472B2 (en) * | 2010-04-13 | 2015-08-11 | Namiki Seimitsu Houseki Kabushiki Kaisha | Single-crystal substrate,single-crystal substrate having crystalline film,crystalline film,method for producing single-crystal substrate having crystalline film,method for producing crystalline substrate,and method for producing element |
US9224904B1 (en) * | 2011-07-24 | 2015-12-29 | Ananda Kumar | Composite substrates of silicon and ceramic |
-
2013
- 2013-06-18 FR FR1355677A patent/FR3007193B1/fr not_active Expired - Fee Related
-
2014
- 2014-06-18 TW TW103121104A patent/TW201511090A/zh unknown
- 2014-06-18 WO PCT/EP2014/062847 patent/WO2014202679A1/fr active Application Filing
- 2014-06-18 US US14/900,088 patent/US9882087B2/en active Active
- 2014-06-18 EP EP14731271.4A patent/EP3011586A1/fr not_active Withdrawn
-
2018
- 2018-01-08 US US15/865,065 patent/US10497833B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW201511090A (zh) | 2015-03-16 |
US20160149083A1 (en) | 2016-05-26 |
FR3007193A1 (fr) | 2014-12-19 |
WO2014202679A1 (fr) | 2014-12-24 |
US10497833B2 (en) | 2019-12-03 |
US9882087B2 (en) | 2018-01-30 |
US20180219129A1 (en) | 2018-08-02 |
EP3011586A1 (fr) | 2016-04-27 |
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Legal Events
Date | Code | Title | Description |
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PLFP | Fee payment |
Year of fee payment: 3 |
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PLFP | Fee payment |
Year of fee payment: 4 |
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PLFP | Fee payment |
Year of fee payment: 5 |
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PLFP | Fee payment |
Year of fee payment: 6 |
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ST | Notification of lapse |
Effective date: 20200206 |