FR3007122A1 - COOLING OF ELECTRONIC AND / OR ELECTRICAL COMPONENTS BY PULSE CALODUC AND THERMAL CONDUCTION ELEMENT - Google Patents

Abstract

A cooling system (10) for a device having electronic and / or electrical components (100) to be cooled comprises an oscillating heat pipe (11) having a tube in which a coolant circulates in a pulsating manner. The tube is wound to form a coil (12). The system (10) comprises at least one heat conduction element (13) in contact with the components (100) and in contact with a main surface (12a) of the coil (12). The thermal conduction element (13) is in contact on a part of said main surface (12a) so that the oscillating heat pipe (11) has at least one hot part of evaporation of the coolant located at the zone of contact between the coil (12) and the thermal conduction element (13) and used to evacuate heat from the components (100) and at least a cold part of condensation of the heat transfer fluid located outside the contact zone between the coil (12) and the heat conducting element (13) and serving to dissipate the heat absorbed by the oscillating heat pipe (11).

Description

BACKGROUND OF THE INVENTION The invention relates to a cooling system for a device comprising electronic and / or electrical components to be cooled, the system comprising an oscillating heat pipe. comprising a tube in which a coolant circulates in a pulsating manner, the tube being wound so as to form a coil.

The invention also relates to a device comprising electronic and / or electrical components to be cooled and at least one such cooling system. State of the art It has already been imagined, like the solutions described in documents US7926982, US20090147522 and US20090194254, to cool light emitting diode electronic components by the use of a cooling system including at least one heat pipe. at least one cold part of which is in heat exchange with a convection cold source. They implement a heat exchange means by convection with the cold source, transmitting the heat captured by at least one thermal conduction tube transmitting them laterally to a plurality of cooling radiators in thermal convection with air. The cold source unfortunately requires the use of forced convection. On the other hand, the direction of circulation of the heat pipe is important. This results in a difficulty of implementation of mass industrialization. All of these systems are complex and expensive to build and assemble.

In addition, the use of two-phase thermosyphons leads to a very degraded or non-existent operation, when the heat source in heat exchange with the hot part of the heat pipes is located higher than the cold source.

It is also known to use heat pipes with a capillary structure that can to some extent operate in a configuration where the hot source is higher than the cold source. Nevertheless, this solution requires expensive capillary structures and has performances intrinsically limited by the capillary.

OBJECT OF THE INVENTION The object of the present invention is to provide a cooling system that overcomes the disadvantages listed above.

In particular, an object of the invention is to provide such a cooling system that is inexpensive to produce and assemble, simple, having good performance, and regardless of the relative positions occupied by the hot and cold sources that are in exchange thermal with the cooling system. These objects can be reached by a cooling system for a device comprising electronic and / or electrical components to be cooled, the system comprising an oscillating heat pipe having a tube in which a coolant circulates in a pulsating manner, the tube being wound so as to forming a coil, the system comprising at least one heat conducting element in contact with the components and in contact with a main surface of the coil, the heat conducting element is in contact on a portion of said main surface so that the heat pipe oscillating at least one hot evaporating portion of the heat transfer fluid located at the contact zone between the coil and the heat conducting element and serving to evacuate heat from the components and at least a cold portion of condensation of the heat transfer fluid located outside the contact zone between the coil and the conductor element thermal ion and used to dissipate the heat absorbed by the oscillating heat pipe. Preferably, the zone of said main surface of the coil in contact with the thermal conduction element is flat and parallel to at least one plane in which the coolant circulates.

The tube may be wound in a main plane so as to form a planar coil and said main surface of the coil may be flat and parallel to said main plane. The planar coil may be shaped to be one of the following types: parallel turns, spiral spirals, circular spiral turns. In one embodiment, the thermal conduction element is constituted by at least one plate fixed on said main surface of the coil and on which the components are fixed.

The plate is preferably formed in a material having a thermal conductivity greater than 150 W-m-1-K-1. In one embodiment, the oscillating heat pipe comprises a hot portion located in a central zone of the coil and two cold portions located in lateral zones of the coil and disposed on either side of the hot portion. Each cold part of the oscillating heat pipe can in particular be in thermal contact by natural or forced convection with air. The cooling system may comprise heat exchange fins between the coils of the coil at least at the level of said at least one cold part.

The tube is preferably an extruded multiport tube delimiting parallel channels. It can be expected that a fraction of the total amount of coolant circulating in the tube circulates in each of said channels. Alternatively, it can be made so that the total amount of coolant circulating in the tube circulates in at least one of said channels, preferably located on the side of the thermal conduction element.

The channels can be independent of one another and do not communicate with each other fluidically. Alternatively, several of said channels may be interconnected with each other, in particular at their ends, so as to form a serpentine-shaped duct wound in a direction perpendicular to said main surface. In another embodiment, the tube comprises only one channel, preferably wound in a plane manner, disposed on the side of the heat conduction element, and optionally stiffened by a stiffening core.

A device comprising electronic and / or electrical components to be cooled can therefore comprise at least one such cooling system cooling said components in contact with the thermal conduction element in contact with the main surface of the coil. The components are preferably chosen from at least one electronic circuit, a thyristor type electronic power component or an insulated gate bipolar transistor, a lighting device comprising power LEDs, a photovoltaic device, a battery, a battery combustible. BRIEF DESCRIPTION OF THE DRAWINGS Other advantages and features will emerge more clearly from the following description of particular embodiments of the invention given as non-restrictive examples and shown in the accompanying drawings, in which: FIGS. and 2 are perspective views of a first example of a cooling system according to the invention; FIG. 3 is a detail view of the multiport tube used in FIGS. 1 and 2; FIGS. 4 and 5 are views. in perspective, respectively in the assembled and exploded state, of a second example of a cooling system according to the invention, - Figures 6 to 8 show in perspective three possible embodiments for the arrangement of the cold parts of the heat pipe. oscillating, - Figures 9 and 10 show a third example of a cooling system according to the invention, respectively in perspective and in view from below, - FIGS. 11 and 12 show a fourth example of cooling system according to the invention, respectively in perspective and in view from below, - Figures 13 to 15 show in perspective respectively fifth, sixth and seventh examples of cooling systems according to the invention. and Figures 16 to 20 illustrate five possible embodiments for the organization of the coil wound tube.

DESCRIPTION OF PREFERRED EMBODIMENTS OF THE INVENTION Referring to FIGS. 1 to 20, a cooling system 10 for a device that itself comprises electronic and / or electrical components 100 to be cooled comprises an oscillating heat pipe 11 comprising a tube in which a coolant heat transfer fluid for example acetone at 50% of the total internal volume of the tube) flows in a pulsating manner. The tube is wound so as to form a coil 12. This oscillating heat-exchange type 11 is also known by the name of "pulsed heat pipe" or under the acronym "PHP" for "pulsating heat pipe" in English terminology. In the oscillating heat pipe 11, the tube is partially filled with heat transfer fluid, in particular of heat transfer nature, which naturally takes the form of a succession of vapor bubbles and liquid plugs.

This phase separation results mainly from surface tension forces. When the oscillating heat pipe 11 is heated in a hot part and cooled in a cold part, the resulting temperature differences generate both temporal and spatial pressure fluctuations, which are themselves associated with the generation and growth of vapor bubbles. in the evaporator and their implosion in the condenser. These fluctuations act as a pumping system to transport liquid and vapor bubbles between hot and cold parts. The components 100 are chosen in particular from at least one electronic circuit, a thyristor type electronic power component or a bipolar insulated gate transistor, a lighting device comprising light-emitting diodes, a photovoltaic device, a battery, a battery fuel or any other power system.

To facilitate the understanding of the rest of the description, an orthonormal reference is associated with the oscillating heat pipe 11 with a longitudinal direction X, a lateral direction Y perpendicular to the direction X and a vertical direction Z perpendicular to the plane defined by the directions X and Y The cooling system 10 also comprises at least one heat conduction element 13 in contact with the components 100 and in contact with a main surface 12a of the coil 12.

Thus, the device as such comprises the electronic and / or electrical components 100 to be cooled and at least one such cooling system 10 for cooling these components 100 which are then in contact with the thermal conduction element 13, which the latter being in contact with the main surface 12a of the coil 12. In the example illustrated in FIGS. 4 and 5, the components 100 comprise, for example, an electronic printed circuit 101 of the "MPCB" type (for "Metal Printed Circuit Board" in terminology anglosaxonne) equipped with light-emitting diodes 102, a collimator device 103 and a cover 104. In FIG. 2, only the circuit 101 and the diodes 102 are shown. The heat conduction element 13 is preferably constituted by at least one plate or base fixed on the main surface 12a of the coil 12 and on which the components 100 are fixed. Thus, the plate is fixed to the main surface 12a by brazing, welding, bonding, or any equivalent means and adapted to the desired function. The circuit 101 is fixed to the plate for example by means of fixing screws. A thermal interface material (thermal grease, thermal conductive polymer or any equivalent solution) may be interposed between the plate and the circuit 101. Preferably, each plate is formed in a material having a thermal conductivity greater than 150 Wm-1.K -1. The plate is advantageously metallic: it may preferably consist of aluminum or an alloy of aluminum or copper. Thus, the first example according to FIGS. 1 to 3, the second example according to FIGS. 4 and 5, the third example according to FIGS. 9 and 10, the fifth example according to FIG. 13 and the sixth example according to FIG. 14 correspond to a cooling system 10 in which a single metal plate is in contact with the main surface 12a of the coil 12, in a particular single area thereof. The fourth example according to FIGS. 11 and 12 and the seventh example according to FIG. 15 correspond to a cooling system 10 in which several plates are in contact with the main surface 12a of the coil 12, in different zones thereof.

Preferably and as illustrated in all system examples 10, the tube is wound in a main plane so as to form a planar coil 12. The main plane is oriented along the longitudinal X and lateral Y directions so that any vector normal to this plane is parallel to the vertical direction Y. Thus, in this embodiment, the tube comprises two opposite main surfaces 12a and 12b, which are outer surfaces of the tube and forming the slice of the heat pipe. Each of the two main surfaces 12a and 12b is advantageously flat and oriented in the main plane formed along the X and Y directions. These two surfaces are interconnected by a lateral surface defining the thickness of said tube. Among the two main surfaces 12a and 12b, a lower main surface 12a is defined, part of which is intended to be in contact with the heat conduction element 13 and an upper main surface 12b. The thermal conduction element could be in contact with the upper main surface 12b.

In the illustrated example, on the opposite side to the thermal conduction element 13 in the Z direction, the coil 12 thus comprises the upper main surface 12b, which is also flat and oriented in a plane (X, Y). The thickness of the coil 12 corresponds to the shift in the Z direction between the main surfaces 12a and 12b. It is possible to use a tube of any kind allowing a pulsed circulation of the coolant, for example according to CN10818999. But unlike this document where 'supply of heat and cooling of the oscillating heat pipe are performed respectively at both ends of the coil through a convective exchange with hot and cold gases, the solution described here provides a thermal conduction with the hot source to cool at the level of a main surface of the tube. It remains possible, however, for the tube to be wound so as to form a coil 12 of left shape. In particular, the plate has significantly greater dimensions in the X and Y directions than in the Z direction. It is for example of parallelepipedal shape. It comprises two opposite faces in the direction Z respectively in mechanical contact with the main surface 12a of the coil 12 and with the components 100, here the circuit 101.

Thus, it follows from the foregoing that the area of the main surface 12a of the coil 12 in contact with the heat conduction element 13 is flat (preferably even in the case of a left-hand coil) and parallel to at least a plane in which the heat transfer fluid circulates inside the tube. Indeed, it will be detailed later that the tube may advantageously be constituted by an extruded multiport tube delimiting channels 14 (Figure 3) parallel to each other, in each of which pulsed circulates a fraction of the total amount of coolant flowing in the tube. The winding of the tube is carried out so that each channel 14 extends in a plane (X, Y) so that the fraction of heat transfer fluid circulating there flows in a plane (X, Y). These flow planes are all parallel and offset in pairs, in particular along the direction Z. The zone of the main surface 12a of the coil 12 in contact with the thermal conduction element 13 is parallel to these planes in which the heat transfer fluid circulate separately. The extruded multiport tube is organized in such a way that the channels 14 are all shifted in pairs in the same direction, in particular in the direction Z. The tube then has the general shape of a ribbon and the channels 14 are distributed along the width of this ribbon.

The width of this ribbon is directed in the direction Z. Depending on its length, the ribbon is wound in the aforementioned main plane to form the coil 12. All the channels 14 are parallel and stacked in the direction Z.

With reference to FIGS. 16 and 17, the channels 14 may be independent of one another and may not communicate with one another fluidically with respect to the coolant. Figure 16 corresponds to an embodiment in which each channel 14 has the form of an open loop. Thus, each channel 14 constitutes an individual oscillatory heat pipe forming an open loop. Alternatively, the embodiment according to Figure 17 provides that each channel 14 has the form of a closed loop. Thus, each channel 14 constitutes an individual oscillatory heat pipe forming a closed loop. With reference to FIGS. 18 to 20, several of the channels 14, or even all the channels 14 delimited by the multiport tube, are interconnected with one another, in particular at their ends, so as to form a coil-shaped conduit wound in one direction. perpendicular to the main surface 12a, that is to say in the direction Z in the illustrated example. FIG. 18 corresponds to an embodiment in which this duct has the form of an open loop while the embodiment according to FIG. 19 provides that this duct has the shape of a closed loop. Finally, the embodiment of Figure 20 provides that at both ends of the multiport tube, all channels 14 are interconnected by a common collector 16 to all channels. It is possible to provide that only one of the ends of the multiport tube is equipped with such a collector 16. The common collector 16 is intended to allow paralleling of all the channels. In general, the selection and implementation of an embodiment chosen from those of FIGS. 16 to 20 depend on the design of end plugs intended to be butted at the ends of the tube so as to arrange the channels 14 of FIG. the desired manner according to the selected embodiment.

When the coil 12 is of advantageously flat shape for reasons of ease of winding and bulk, it is preferably shaped so as to be among one of the following types: with parallel turns, with spirals in a square spiral, with turns circular spiral.

Thus, the first example according to FIGS. 1 to 3, the second example according to FIGS. 4 and 5, the fifth example according to FIG. 13, the sixth example according to FIG. 14 and the seventh example according to FIG. 10 in which the coil 12 is shaped so as to have turns parallel to each other, for example in the longitudinal direction X. The third example according to Figures 9 and 10 corresponds to a cooling system 10 in which the coil 12 is shaped so as to present spirals square spirals. An advantage of this configuration is the fact of being able to provide a spacing between the turns having a lower value than in the configuration with parallel turns. This makes it possible to avoid too small radii of curvature on the multiport tube, which is detrimental to the performance of the oscillating heat pipe 11. Moreover, since the spacing between the turns is smaller, it is possible to obtain a more compact assembly because more surface is developed for convection with air. There is a minimum value of the spacing between the turns, known to those skilled in the art, below which it is however necessary not to go down so as not to slow down the natural convection. In addition, the volume in the center of the spiral can be used to house the control electronics of the diodes 102. Finally, the fourth example according to Figures 11 and 12 corresponds to a cooling system 10 in which the coil 12 is shaped so to present circular spiral turns. It has the same advantages as the example with spiral spirals. Moreover, the radius of curvature of the multiport tube being further increased, the performance is improved compared to the example with spiral spirals square.

The organization of the turns within the coil 12 can however be any such that the illustrated examples are in no way limiting the scope of the solution. It is recalled that the heat conduction element 13 is constituted in particular by one or more plates. In general, by these provisions, the heat conduction element 13 is in contact via said at least one plate on a part only of the main surface 12a so that the oscillating heat pipe 11 has: - at least one hot part of evaporation of the heat transfer fluid located at the contact zone between the coil 12 and the heat conduction element 13 and serving to remove heat from the components, and at least a cold part of condensation of the coolant located outside the contact zone between the coil 12 and the heat conduction element 13 and serving to dissipate the heat absorbed by the oscillating heat pipe 11.

In particular, the oscillating heat pipe 11 comprises a hot part at each platen in contact with the main surface 12. The hot part corresponds, at each platen, to the serpentine surface 12 delimited in the plane (X, Y) by the contour of the contact surface between said plate and the main surface 12a. Each cold part is formed on the other hand outside the contact areas between the (the) plate (s) and the main surface 12a. Depending on the organization of the coil 12, the number and the position of each plate, the oscillating heat pipe 11 may comprise one or more cold parts. Thus, the first example according to FIGS. 1 to 3, the second example according to FIGS. 4 and 5, the third example according to FIGS. 9 and 10 and the sixth example according to FIG. 14 each correspond to a cooling system 10 in which the oscillating heat pipe 11 comprises a single hot portion (at the contact surface between the single plate and the main surface 12a) located in a central zone of the coil 12 in the X direction and two cold parts located in the lateral zones of the coil 12 offset between them in the X direction and arranged on either side of the hot part in this direction X. Each hot and cold part extends over the entire width of the oscillating heat pipe 11 in the lateral direction Y. However, it could be envisaged for example that the hot part is arranged only on part of the width of the heat pipe in the lateral direction Y. On each side of the central hot part ale, the oscillating heat pipe 11 forms loops which are in natural convection in the air so as to constitute the two cold parts. The fourth example according to FIGS. 11 and 12 corresponds to a cooling system 10 in which the oscillatory heat pipe 11 comprises four hot parts (at the level of the contact surface between the four plates and the main surface 12a) distributed angularly in the plane ( X, Y) around the circular spiral and four cold parts delimited two by two by the hot parts. It goes without saying that the number of plates may be different from four.

The fifth example according to FIG. 13 corresponds to a cooling system 10 in which the oscillating heat pipe 11 comprises a single hot part (at the level of the contact surface between the single plate and the main surface 12a) located in a lateral zone of the coil 12 in the X direction and only one cold part located in the other lateral zone of the coil 12 in the X direction. Each hot and cold part extends over the entire width of the oscillating heat pipe 11 in the lateral direction Y. However, it could be envisaged, for example, that the hot part is arranged only over part of the width of the oscillating heat pipe 11 in the lateral direction Y. The seventh example according to FIG. 15 corresponds to a cooling system 10 in which the oscillating heat pipe 11 comprises three hot parts (at the contact surface between the three plates constituting the heat conduction element 13 and the surf Principal ace 12a). The three hot parts extend over the entire width of the oscillating heat pipe 11 in the lateral direction Y. The three plates are spaced apart from each other in the direction X so as to delimit two cold parts. On each lateral side of the heat pipe oscillating in the X direction, the two plates are spaced from the lateral edges of the coil 12 so as to delimit two additional cold parts. Thus, the oscillating heat pipe 11 comprises an alternation of four cold parts and three hot parts. It goes without saying that the number of plates may be different from three. In all system examples 10, each cold part of the oscillating heat pipe 11 is in thermal contact by natural or forced convection with air. It is in this way that the oscillating heat pipe 11 removes the heat previously collected from the components 100. The cooling system 10 may comprise an air movement device, such as a fan not shown. With reference to Figures 7 and 8, the system 10 may optionally include heat exchange fins 15 arranged between the turns of the coil 12 so as to connect them in pairs. Such heat exchange fins 15 may be arranged at least at the level of said at least one cold part, or possibly at the level of said at least one hot part. They are for example formed of aluminum. FIG. 6 shows the case where such heat exchange fins 15 are absent between the turns of the coil 12. These heat exchange fins 15, fixed to the outer walls of the tube between two adjacent turns, make it possible to increase the surface area. exchange in natural or forced convection of each cold part 20 provided with such fins. They can be accordion and fixed between the turns of the coil 12 in the manner shown in Figures 7 and 8. They can be rectangular, triangular or any other known and adapted form. The heat exchange fins 15 may be corrugated, perforated, offset, louvers .... More generally, they may have any other means for improving the heat exchange coefficient with the air in order to increase the heat transfer in natural or forced convection. In addition, the use of fins 15 makes it possible to increase the compactness of the cooling system by increasing the exchange surface with air.

The solution described above has the advantage of being inexpensive to produce and assemble, to be simple while having good performance, and regardless of the relative positions occupied by the hot and cold sources that are in heat exchange with the 10. In other words, the cooling system 10 described above has good performance irrespective of the spatial orientation of the oscillatory heat pipe 11 (to which the reference (X, Y, Z) is bound) in an absolute reference. Thus, for example, the cooling performance is very good even in the case illustrated in Figures 2 and 4 where the components 100 to be cooled, constituting the heat source in thermal coupling with the hot part of the pulsed heat pipe, is arranged spatially in an absolute benchmark above the cold parts of the pulsed heat pipe that are in thermal coupling with the air by natural or forced convection.

An example of application is detailed below for the cooling of a luminaire comprising 25 light-emitting diodes 102. Each component supplied with a current of 700 mA dissipates a heat power of 1.5 W for a luminous flux of about 220 lumens. For all 25 diodes 102, the thermal power to be dissipated is 37.5 W for a light output of 5500 lumens. In this example, it will be relevant to choose a cooling system 10 having the following parameters: - number of turns: between 2 and 20 '- heat transfer fluid: acetone, methanol, ammonia, n-heptane, tetrafluoroethane, fluorocarbons, thickness of fins 15: between 0.1 and 0.3 mm, internal diameter of the channels 14: between 0.5 and 4 mm, height of the multiport tube: between 10 and 100 mm, space between the turns of the coil 12: included between 2 and 30 mm, - space between the fins 15: between 1 and 15 mm. The plate has a dimension of 40 to 90 mm along the X and Y axes (width and length) and from 2 to 10 mm along the Z axis (thickness). The length of each cold part of the tube is between 20 and 200 mm and the width of each cold part of the tube is between 40 and 200 mm. The implementation of the device can provide the following steps: extrusion of the multiport tube, manufacture of the coil 12, manufacture of the metal plate, manufacture of the end plugs to be put in place at the ends of the multiport tube, and assembly. components 100, - brazing of the assembly, - filling of the heat pipe oscillating 11 with the heat transfer fluid, - placement of the diodes 102 on the circuit 101, - setting up the collimator device 103, - fixing the circuit 102 equipped with diodes 102 and the collimator device 103 on the plate, for example by means of fixing screws. Modelings have shown that it could be advantageous to provide that the total amount of coolant circulating in the tube can circulate only in at least one of said channels 14, preferably located on the side of the thermal conduction element.

Alternatively, the tube may comprise only one channel, preferably wound plane in the X, Y plane disposed on the side of the thermal conduction element. The tube is optionally stiffened by a stiffening core, in particular a solid core directed along Z on the side opposite to the thermal conduction element with respect to the single channel.

Claims (17)

REVENDICATIONS1. Cooling system (10) for a device comprising electronic and / or electrical components (100) to be cooled, the system (10) comprising an oscillating heat pipe (11) having a tube in which a coolant circulates in a pulsating manner, the tube being wound so as to form a coil (12), characterized in that the system (10) comprises at least one heat conducting element (13) in contact with the components (100) and in contact with a main surface (12a) of the coil (12), the thermal conduction element (13) being in contact on a part of said main surface (12a) so that the oscillating heat pipe (11) has at least one hot part of evaporation of the coolant located at the level of the contact zone between the coil (12) and the heat conduction element (13) and serving to evacuate heat from the components (100) and at least a cold part of condensation of the coolant located in deho rs of the contact zone between the coil (12) and the heat conduction element (13) and serving to dissipate the heat absorbed by the oscillating heat pipe (11). 2. Cooling system (10) according to claim 1, characterized in that the area of said main surface (12a) of the coil (12) in contact with the heat conduction element (13) is flat and parallel to at least a plane in which the heat transfer fluid circulates. Cooling system (10) according to one of claims 1 or 2, characterized in that the tube is wound in a main plane so as to form a plane coil (12) and in that said main surface (12a) of coil (12) is flat and parallel to said main plane. Cooling system (10) according to claim 3, characterized in that the planar coil (12) is shaped so as to be one of the following types: with parallel turns, with spirals in a square spiral, with turns in circular spiral. 5. Cooling system (10) according to one of claims 1 to 4, characterized in that the heat conduction element (13) is constituted by at least one plate fixed on said main surface (12a) of the coil (12). ) and on which the components (100) are fixed. 6. Cooling system (10) according to claim 5, characterized in that the plate is formed in a material having a thermal conductivity greater than 150 W.m-1.K-1. 7. Cooling system (10) according to one of claims 1 to 6, characterized in that the oscillatory heat pipe (11) comprises a hot part located in a central zone of the coil (12) and two cold parts located in zones side of the coil (12) and disposed on either side of the hot part. 8. Cooling system (10) according to one of claims 1 to 7, characterized in that each cold part of the oscillating heat pipe (11) is in thermal contact by natural or forced convection with air. 9. Cooling system (10) according to one of claims 1 to 8, characterized in that it comprises heat exchange fins (15) between the turns of the coil (12) at least at the level of said at least a cold part. 10. Cooling system (10) according to one of claims 1 to 9, characterized in that the tube is a multiport extruded tube delimiting parallel channels (14). 11. Cooling system (10) according to claim 10, characterized in that a fraction of the total amount of coolant circulating in the tube flows in each of said channels (14). Cooling system (10) according to claim 10, characterized in that the total quantity of coolant circulating in the tube flows in at least one of said channels (14), preferably located on the side of the heat conduction element. . 13. Cooling system (10) according to one of claims 10 to 12, characterized in that the channels (14) are independent of each other and do not communicate with each other fluidically. 14. Cooling system (10) according to claim 10 to 12, characterized in that several of said channels (14) are interconnected with each other, in particular at their ends, so as to form a coil-shaped duct wound in one direction ( Z) perpendicular to said main surface (12a). 15. Cooling system (10) according to one of claims 1 to 9, characterized in that the tube comprises only one channel, preferably wound in a plane manner, disposed on the side of the thermal conduction element, and possibly stiffened by a stiffening core. Device comprising electronic and / or electrical components (100) to be cooled and at least one cooling system (10) according to any one of the preceding claims cooling said components (100) in contact with the thermal conduction element ( 13) in contact with the main surface (12a) of the coil (12). 17. Device according to claim 16, characterized in that the components (100) are chosen from at least one electronic circuit, a thyristor type electronic power component or a bipolar insulated gate transistor, a lighting device comprising diodes. electroluminescent power, a photovoltaic device, a battery, a fuel cell.