FR2999322B1 - LAMINATION PLATE WITH THERMAL INSULATION - Google Patents
LAMINATION PLATE WITH THERMAL INSULATIONInfo
- Publication number
- FR2999322B1 FR2999322B1 FR1261959A FR1261959A FR2999322B1 FR 2999322 B1 FR2999322 B1 FR 2999322B1 FR 1261959 A FR1261959 A FR 1261959A FR 1261959 A FR1261959 A FR 1261959A FR 2999322 B1 FR2999322 B1 FR 2999322B1
- Authority
- FR
- France
- Prior art keywords
- lamination
- thermal insulation
- cavity
- plate body
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003475 lamination Methods 0.000 title abstract 4
- 238000009413 insulation Methods 0.000 title 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/34—Inserts
- B32B2305/342—Chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2425/00—Cards, e.g. identity cards, credit cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
Abstract
La présente invention concerne une plaque de lamination (40) pour laminer un module, comprenant un corps de plaque (53), ce corps de plaque comprenant une surface de lamination (54) thermiquement conductrice et au moins une cavité (56) débouchant sur cette surface, dans laquelle un membre (60) thermiquement isolant est disposé au fond de chaque cavité (56) de sorte que lorsque le corps de plaque (53) est chauffé et qu'un module à laminer est placé en position de lamination sur la surface de lamination (54), une portion du module engagée dans la cavité (56) est en partie protégée thermiquement du chauffage par le membre (60) thermiquement isolant.The present invention relates to a lamination plate (40) for laminating a module, comprising a plate body (53), said plate body comprising a thermally conductive lamination surface (54) and at least one cavity (56) opening into this. surface, in which a thermally insulating member (60) is disposed at the bottom of each cavity (56) so that when the plate body (53) is heated and a laminate module is placed in the laminate position on the surface lamination (54), a portion of the module engaged in the cavity (56) is partially thermally protected from heating by the thermally insulating member (60).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1261959A FR2999322B1 (en) | 2012-12-12 | 2012-12-12 | LAMINATION PLATE WITH THERMAL INSULATION |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1261959A FR2999322B1 (en) | 2012-12-12 | 2012-12-12 | LAMINATION PLATE WITH THERMAL INSULATION |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2999322A1 FR2999322A1 (en) | 2014-06-13 |
FR2999322B1 true FR2999322B1 (en) | 2014-12-26 |
Family
ID=48170591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1261959A Active FR2999322B1 (en) | 2012-12-12 | 2012-12-12 | LAMINATION PLATE WITH THERMAL INSULATION |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2999322B1 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL129813A (en) * | 1996-11-12 | 2003-03-12 | Nagraid Sa | Method for making cards and cards obtained by this method |
EP1436773A1 (en) * | 2001-10-09 | 2004-07-14 | NagraID S.A. | Electronic module with protective bump |
DE102005058101B4 (en) * | 2005-12-05 | 2019-04-25 | Smartrac Ip B.V. | Chip card and method for producing a chip card |
FR2948796A1 (en) * | 2009-07-28 | 2011-02-04 | Ask Sa | RADIOFREQUENCY IDENTIFICATION DEVICE MEDIUM FOR A HYBRID CARD AND METHOD FOR MANUFACTURING THE SAME |
-
2012
- 2012-12-12 FR FR1261959A patent/FR2999322B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
FR2999322A1 (en) | 2014-06-13 |
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Legal Events
Date | Code | Title | Description |
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PLFP | Fee payment |
Year of fee payment: 4 |
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PLFP | Fee payment |
Year of fee payment: 5 |
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PLFP | Fee payment |
Year of fee payment: 6 |
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PLFP | Fee payment |
Year of fee payment: 8 |
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PLFP | Fee payment |
Year of fee payment: 9 |
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PLFP | Fee payment |
Year of fee payment: 10 |
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PLFP | Fee payment |
Year of fee payment: 11 |
|
CA | Change of address |
Effective date: 20230206 |
|
CD | Change of name or company name |
Owner name: IDEMIA FRANCE, FR Effective date: 20230206 |
|
PLFP | Fee payment |
Year of fee payment: 12 |