FR2999322A1 - Lamination plate for laminating module of smart card e.g. micro-SIM, has thermally insulating element to thermally protect microchip of module when plate body is heated and module is placed in position on lamination surface - Google Patents

Abstract

The plate (40) has a plate body (53) including a thermally conductive lamination surface (54) and a cavity (56) opening into the lamination surface. A thermally insulating element (60) is placed in the bottom of the cavity so that a microchip of a module engaged in the cavity is thermally protected by the thermally insulating element when the plate body is heated and the module is placed in position on the lamination surface. The thermally insulating element is removably inserted at the bottom of the cavity. Independent claims are also included for the following: (1) a lamination unit (2) a method for manufacturing a lamination plate.

Description

BACKGROUND OF THE INVENTION The present invention relates to a lamination plate for rolling a part such as a chip card module for example and more particularly to a lamination plate capable of transferring an adhesive to a module by an operation. hot lamination. As represented in FIGS. 1A and 1B, a smart card such as smart card 1 is generally formed from a support 2 (typically made of plastic) having a cavity 4. During an embedding step, a module 6 comprising a support 8 and an electronic chip 10 is inserted into the cavity 4 so that external contacts 14 present on the module 6 are flush with the surface of the card 1. Once the inserting operation carried out, the card 1 is able to communicate with the outside (with a reader for example) via the external contacts 14 of the module 6. FIG. 2 is a sectional view showing schematically an example in which the module 6 has been inserted in the cavity 4 of the card 1 during the inserting step. The cavity 4 here has a rim 4a step-shaped, this flange being disposed over all or part of the periphery of the cavity 4. The module 6 is positioned in the cavity 4 so that a peripheral portion of its support 8 is placed on the flange 4a of the cavity 4, an adhesive 18 being disposed at the bonding interface between the flange 4a and the support 8 to maintain the module 6 in the cavity 4.

In this example, the support 8 (generally PCB type ("Printed Circuit Board")) has on its front face (ie the face facing the outside of the card 1) the external contacts 14 (sometimes called "flat contact"). in English). On the rear face of the support 8 (i.e. the face facing the cavity 4) is glued the electronic chip 10 with the aid of a suitable glue 12. Contact wires 16 provide the electrical connection between the chip 10 and the pads of the external contacts 14. The chip 10 is here engaged in the cavity 4 so as to be surrounded by the rim 4a of the cavity 4, the active face 10a of the chip being facing the bottom of the cavity 4. A coating resin 20 (epoxy type for example) can be provided to make the connection between the module 6 and the bottom of the cavity 4 so as to completely embed the 10 and the son of contact 16. The present architecture of the module 6 and the arrangement of this module in the card 1 are only examples of implementation, other alternatives being conceivable by those skilled in the art. On the other hand, smart cards generally conform to a format whose dimensions are standardized. Credit cards, for example, generally conform to the ISO ID-1 format defined by ISO 7816 (equivalent to the "1FF" format). SIM cards generally conform to the 2FF ("Mini-SIM") or 3FF ("Micro-SIM") format. These three formats 1FF, 2FF and 3FF each impose a map thickness of about 0.76 mm (millimeters). As the Applicant has observed, the more recent introduction of the 4FF format has created new manufacturing problems, in particular because this format requires a smaller thickness of the board (i.e., a thickness of 0.67 mm). It has indeed been necessary to reduce the thickness e cards and the thickness e2 of the modules so that they can integrate (be inserted) properly in 4FF cards. When the 4FF format is used, the reduced thickness e2 of the modules is for example of the order of 400 to 550 pm (micrometers), preferably 500 pm. As illustrated in FIG. 2 for example, a solution for reducing the thickness e2 of a module such as the module 6 has been to reduce the thickness of the support 8 only in the zone underlying the electronic chip 10. However, following the hot lamination operation for the transfer of the adhesive 18 to the module 6 prior to the inserting step, the applicant observed that the modules 6 of reduced thickness e2 had abnormal deformations. Under the effect of the thermal stresses induced during the lamination step (typically of the order of 150 to 160 ° C.), a curvature or bending deformation occurs in particular on the modules whose thickness e2 has been reduced to fit the new 4FF card format. More generally, the Applicant has observed the appearance of this problem of curving when any piece of limited thickness is hot rolled at higher or lower temperatures. There is therefore today a need for a solution for hot rolling parts of any thickness (especially of small thickness) while avoiding the particular problem of trimming described above. In particular, there is a need to avoid shaping the modules described above during hot lamination for the transfer of an adhesive before the inserting step. OBJECT AND SUMMARY OF THE INVENTION To this end, the present invention relates to a lamination plate for rolling a module, said lamination plate comprising a plate body, the plate body comprising a thermally conductive lamination surface and at least one cavity opening on the surface, wherein at least one thermally insulating member is disposed at the bottom of said at least one cavity so that when the plate body is heated and a laminating module is placed in the lamination position on the surface of the lamination, a portion of the module engaged in the cavity is partially thermally protected from said heating by the thermally insulating member. The presence, if necessary, of a plurality of cavities on the lamination plate makes it possible to laminate a plurality of rolling parts collectively while hot. Each thermally insulating member disposed at the bottom of a cavity advantageously advantageously thermally protects at least part of a rolling module during heating of the plate body. The plate body (and in particular the lamination surface on which the module is disposed) conducts the heat but each thermally insulating member acts as a thermal protection for the laminating module or modules which are arranged in the lamination position. Thanks to the lamination plate of the invention, the heat exposure of the workpiece is reduced during the hot lamination which avoids or reduces the curve phenomena described above.

The invention makes it possible in particular to transfer adhesive to a workpiece, such as a smart card module for example, by avoiding the risk of deformation due to thermal stresses imposed during lamination. The invention also makes it possible to hot roll a part without an adhesive being present between the part and the lamination plate.

According to a particular embodiment, said at least one thermally insulating member is removably inserted at the bottom of said cavity. It is thus possible to replace or easily clean each thermally insulating member. According to a particular embodiment, the lamination plate comprises at least one slot or groove in which is positioned said thermally insulating member. This slot or groove advantageously allows to center the position of each thermally insulating member to be positioned adequately at the bottom of at least one cavity. According to a particular embodiment, the plate body comprises a first plate mounted on a second plate, the first and second plates being thermally conductive, the first plate comprising the lamination surface and the cavity, the thermally insulating member being disposed between the first and second plates so as to be disposed at the bottom of said cavity. The formation of the plate body in two separate plates mounted on top of one another facilitates the removal, if appropriate, of each thermally insulating member and further facilitates the cleaning of the thermally insulating members and the lamination plate. In a particular embodiment, the first plate is in thermal contact with the second plate.

In a particular embodiment, the second plate comprises at least one groove in which is housed the thermally insulating member, the member being partially covered by said first plate. According to a particular embodiment, the thermally insulating member is disposed at the bottom of the cavity so as to face the portion of the module (i.e. said portion engaged in the cavity) when the module is in the lamination position. In a particular embodiment, the member thermally is located in the center of the bottom of the cavity. In a particular embodiment, the thermally insulating member covers the entire bottom of the cavity. It is thus possible to minimize the exposure of the module to the rise in temperature during the hot lamination. In a particular embodiment, the thermally insulating member covers at least 75% of the total surface of the bottom of the cavity. According to a particular embodiment, the lamination plate comprises means for centering the insulating member vis-à-vis the plate body.

According to a particular embodiment, the plate body is formed of stainless steel (made of Z30C13 for example). Other materials whose heat-conducting properties are equivalent could be used. In a particular embodiment, the lamination plate comprises a polarizer. The inclusion of this polarizer makes it possible in particular to avoid possible errors in orientation of the first plate vis-à-vis the second plate. This keying device may comprise, for example, two screws serving, if necessary, removable fixing means for the first plate on the second plate, these screws being positioned asymmetrically in the lamination plate. According to a particular embodiment, the thermally insulating member is made of polytetrafluoroethylene (PETF).

Other materials having equivalent thermal resistances could be used, such as, for example, Epoxy glass, polyetheretherketone (PEEK), ethylene polynaphthalate (PEN), polyamide, polyetherimide (PET) or polyphenylene sulfide ( PPS). According to a particular embodiment, the portion of the module engaged in the cavity is an electronic chip. According to a particular embodiment, the lamination plate further comprises means for heating the plate body. The invention further relates to a lamination unit comprising a lamination plate as defined above and a backing plate, the lamination unit being configured to roll the module between the lamination plate and the backplate. The lamination unit may further comprise means for heating the body of the lamination plate. According to a particular embodiment, an adhesive is placed on the laminating surface of the lamination plate so that the adhesive is at the interface between the lamination surface and the module when the latter is in the lamination position. Correlatively, the invention relates to a method of manufacturing a laminating plate for rolling a module, the method comprising: - providing a plate body comprising a thermally conductive lamination surface and at least one cavity opening on the surface method of laminating, the method further comprising: positioning at least one thermally insulating member at the bottom of said at least one cavity such that when the plate body is heated and a laminating module is placed in a lamination position on the lamination surface, a portion of the module engaged in said cavity is partially thermally protected from heating by the thermally insulating member. The advantages and variants described above in relation to the laminating plate apply in the same way to the lamination plate obtained from the manufacturing method of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS Other features and advantages of the present invention will emerge from the description given below, with reference to the accompanying drawings which illustrate an embodiment having no limiting character. In the figures: FIGS. 1A and 1B already described represent, in a schematic manner, a smart card known to those skilled in the art; - Figure 2 already described is a sectional view schematically showing a module inserted in a known manner in a card; - Figure 3 shows schematically a lamination system and a lamination unit according to a particular embodiment of the invention; - Figures 4A, 4B and 4C show, schematically, a lamination plate according to a first embodiment of the invention; FIGS. 5A and 5B schematically represent a module in the lamination position on a lamination plate according to the first embodiment; FIG. 5C is a sectional view showing more precisely the configuration of the lamination unit illustrated in FIG. 3; - Figure 6, schematically, a lamination plate according to a second embodiment of the invention; and FIG. 7 represents, in the form of a flowchart, the main steps of a manufacturing method according to a particular embodiment of the invention.

DETAILED DESCRIPTION OF SEVERAL EMBODIMENTS The present invention relates to a lamination plate for rolling a part such as a chip card module for example and more particularly to a lamination plate capable of transferring an adhesive onto a module by a hot lamination operation.

In this document, examples of implementation of the invention are described in the context of the lamination of a module, this module having for example the architecture of the module 6 described above. As explained below, however, the present invention is more generally applicable to all parts or elements that can be laminated with a lamination plate according to the invention.

In addition, this document describes implementation examples in which the lamination plate according to the invention is used for hot rolling (ie with heating of the lamination plate at a predetermined temperature) a part in order to transfer to the latter. an adhesive. It will be understood, however, that the lamination plate of the invention may be used more generally for any lamination operation in which the lamination plate is heated (hot lamination).

As explained previously with reference to FIGS. 1A, 1B and 2, the applicant observed the appearance of deformations resulting in an abnormal curve of the module 6 following a hot lamination step intended to transfer an adhesive 18 to a peripheral portion of the face BACKGROUND OF THE MEDIUM 8. An exemplary implementation of this adhesive transfer step is now described in more detail with reference to FIG. 3 which schematically shows a lamination system 30 according to a particular embodiment of the invention. invention. The system 30 here comprises a set of displacement means (here rollers A to K) and cutting means 48. The system 30 further comprises a lamination unit 45 according to a particular embodiment of the invention, this unit 45 comprising a lamination plate 40 according to the invention and a backplate 44 and heating means 42. Alternatively, the lamination means may be placed outside the lamination unit. According to another variant, the lamination plate of the invention may comprise the heating means.

More specifically, the film 32 transports modules to the lamination unit 45 under the action of the rollers A and B. The modules considered in this example are in accordance with the module 6 described above. The modules 6 are in the lamination unit 45 so that their rear face (chip side 10) is facing the lamination plate 40 and their front face (external contact side 14) is opposite the counter. Furthermore, an adhesive tape 34 comprising adhesive 34a and a protective paper 34b is moved under the action of the rollers C, E and F to be cut in particular patterns by the cutting means 48. This cutting includes in particular the formation in the adhesive tape 34 orifices 35 whose shape and object will be described later. Once cut, the adhesive tape 34 is conveyed into the lamination unit 45 under the action of the roller G. The film 32 and the adhesive tape 34 are positioned in alignment opposite each other between the plate 40 and the backplate 44, the adhesive tape 34 being placed between the film 32 and the lamination plate 40 (the protective paper 34b of the adhesive film 34 being opposite to the lamination plate 40). During the hot lamination step, the lamination plate 40 is heated to a predetermined temperature (between 150 and 160 ° C for example) using the heating means 42 (corresponding for example to a thermal resistance) of the lamination unit 45 of the invention. The hot lamination of the film 32 and the adhesive tape 34 between the lamination plate 40 and the backing plate 44 makes it possible to transfer part of the adhesive 34a of the adhesive tape 34 to the rear face of the modules 6. This lamination step will be described in more detail later with reference to Figure 5. Once a portion of the adhesive 34a has been transferred to the modules 6, the latter are transferred via the film 36 to a packaging machine (not shown) under the action of the roller H.

The phenomenon of shading observed by the applicant is explained by the small thickness e2 of the module 6 (and more particularly of its support 8 at the level of the chip 10), this small thickness being here required in order to be able to integrate the module 6 in a card 1 of 4FF format for example. The reduction of the thickness e2 of the modules 6 leads to a reduction in the resistance of these modules to thermal stresses during the step of transferring the adhesive by hot lamination. The mechanical stress generated by the rise in temperature in the lamination unit 45 is therefore at the origin of the deformation problem observed by the applicant. The present invention relates in particular to a lamination plate to overcome this problem of exposure of the workpiece to the thermal stresses during lamination. A lamination plate 40 according to a first embodiment of the invention is now described with reference to Figures 4A, 4B and 4C. The lamination plate 40 comprises a plate body 53, the latter comprising a first plate 52 mounted on a second plate 50. Fastening means 62 (screws, locks and / or clips, for example, or any other locking system). appropriate fixation) make it possible to fix the first plate 52 in position on the second plate 50. The first plate 50 is preferably removably attached to the second plate 52.

The fixing means 62 comprise for example two screws positioned asymmetrically in the body 53 of the lamination plate 40. In this example, these screws pass right through the thickness of the first plate 52 and the second plate 50. The asymmetrical position of the screws which is adopted here allows the operators to avoid any errors of orientation when mounting the first plate on the second plate. These asymmetrical screws then act as foolproof.

These screws are for example countersunk. The number, position and specifications of these screws 62 can of course be adapted as needed. It will be understood that the lamination plate according to the invention may comprise a polarizer taking a shape other than the two asymmetrical screws described above. In this embodiment, the first plate 52 and the second plate 50 are both thermally conductive. They may be metal, especially stainless steel (Z30C13 for example). The first and second plates can be formed of the same material or different materials.

In this example, the plates 50 and 52 are in thermal contact with each other. However, it is not mandatory that the second plate 50 be thermally conductive. In a variant, only the first plate 52 is thermally conductive. The heating of the lamination plate 40 is then done directly by the first plate 52. Still in the embodiment considered here, the plate body 53 (more precisely the first plate 52 in this example) comprises a lamination surface 54 thermally conductive and a plurality of cavities 56 opening on this surface 54. The number of cavities may correspond to any integer greater than or equal to 1. The plate body 53 (including the lamination surface 54) preferably has a coefficient of thermal conduction CT1 such as CT1 W.rn-1.K-1). In accordance with the present invention, thermally insulating members 60a and 60b (collectively numbered 60) are disposed at the bottom of the cavities 56 so that when the plate body 53 is heated and a laminating module 6 is placed in the lamination position. on the lamination surface 54, a portion of the module 6 (ie the chip 10 in this case) engaged in one of the cavities 56 is partly thermally protected from the heating. Each thermally insulating member of the invention preferably has a thermal conduction coefficient CT2 such that CT2 1 W. m-1.K-1. This coefficient CT2 may be identical for all members 60, although this is not mandatory. Of course, it will be understood that the number of thermally insulating members 60 may correspond to any integer greater than or equal to 1, this number being in particular a function of the number and arrangement of the cavities 56 present on the lamination surface 54 of the plate body 53 .

The shape and dimensions of each thermally insulating member 60 may further be adapted according to the specifications of the lamination plate 40. In this example, the thermally insulating members 60 are made of PETF and have a thickness of, for example, between 0.2. and 5 mm, preferably 1.5 mm. As already indicated above, other materials than PETF having equivalent thermal resistances could be used, such as, for example, Epoxy glass, polyetheretherketone (PEEK), ethylene polynaphthalate (PEN), polyamide, Polyetherimide (PEI) or polyphenylene sulfide (PPS). In this first embodiment, the thermally insulating members 60 are positioned in grooves 66 formed in the second plate 50. The thermally insulating members 60 are in this example partially covered by the first plate 52. The grooves 66 here provide the centering and the correct positioning of the members 60 vis-à-vis the plate body 53 and, in particular, vis-à-vis the first plate 52. Other means of centering the thermally insulating members 60 may however be envisaged (screws, stops etc.). In this first embodiment, each thermally insulating member 60 is thus disposed between the first plate 52 and the second plate 50 so as to be disposed at the bottom of at least one cavity 56. The retention of the members 60 is here ensured by the plates 50 and 52 in contact on either side of the members 60. The plate body 53 comprises in this example an optional centering pin 64 (located here on the rear face of the second plate 50) for correctly positioning the lamination plate 40 in the lamination unit 45.

Fig. 5A is a sectional view schematically showing the module 6 in the lamination position on the lamination plate 40 according to the first embodiment. Figure 5B shows a top view of the configuration shown in Figure 5A.

FIG. 5C represents a more detailed view of the lamination unit 45 during a lamination operation of a module 6. For the sake of simplicity, certain details of the module 6 have been deliberately omitted in FIG. 5C. More specifically, in this example, the module 6 described above is positioned on the front face of the plate body 53, that is to say on the lamination surface 54 of the first plate 52. In this particular case, the module 6 is not in direct contact with the plate body 53 since an adhesive 70 is here disposed at the interface between the support 8 of the module 6 and the lamination surface 54. The adhesive 70 corresponds, for example, to the adhesive 34a present in the adhesive tape 34, as shown in FIG. 3. In this example, the adhesive 70 is disposed on the entire laminating surface 54 of the first plate 52.

However, it will be understood that the presence of such an adhesive is not always required according to the use that is made of the laminating plate of the invention. Alternatively, the workpiece may be arranged in direct contact with the plate body 53, no adhesive being present at the interface. The laminating plate of the invention may for example be used for hot rolling a workpiece without using an adhesive at the interface between the lamination plate and the workpiece in question. When the module 6 is in the lamination position, the chip 10 is engaged in the cavity 56. During the lamination operation previously described with reference to FIG. 3, the plate body 53 is heated, for example at a temperature between 150 and 160 ° C. The temperature reached must allow the adhesive 70 to transfer at least partially to the rear face of the module 6 (in this example, the adhesive is transferred to a peripheral portion of the rear face of the support 8). In this example, the heating of the plate body 53 is achieved by means of heating means 42 included in the lamination unit 45. These heating means can here be configured to directly heat the first plate 50 and / or indirectly via the second plate 52. The hot lamination is performed here by pressing the workpiece and the adhesive between the lamination plate of the invention and a counter-plate, as shown for example in Figure 5C. The lamination makes it possible to transfer to the module 6 at least a portion of the adhesive 70, namely the part 70a which flows on the rear face of the support 8. Once the transfer of adhesive has been carried out, the module 6 provided with the The adhesive may be embedded in a card as explained above with reference to FIGS. 1A, 1B and 2. As indicated above, the adhesive 70 corresponds, for example, to the adhesive tape 34 previously described. In this case, the adhesive tape 34 entering the lamination unit 45 has orifices 35 whose dimensions and positions are in correspondence with the dimensions and positions of the cavities 56, these orifices being previously formed by the cutting means 48. In this way, the chip 10 of the module 6 can then engage, through a corresponding orifice 35 of the adhesive tape 34, in the cavity 56 when the module 6 is in the lamination position on the lamination surface 54.

The presence of a plurality of cavities 56 on the lamination plate 40 advantageously makes it possible to laminate a plurality of parts collectively while hot.

The thermally insulating member (60a in this example) disposed at the bottom of the cavity 56 advantageously advantageously thermally protects at least part of the module 6 to be rolled during heating of the plate body. Only the plate body 53 (and in particular the lamination surface 54 on which the module 6 is placed) thermally conducts heat to the adhesive 70 and, to some extent, to the module 6. The member 60a advantageously serves as thermal protection for the chip 10 which is here disposed in the cavity 56 when the module 6 is in the lamination position. Thanks to the lamination plate of the invention, the heat exposure of the workpiece is reduced during the hot lamination which avoids or reduces the curve phenomena described above. The invention makes it possible in particular to transfer adhesive to a workpiece, such as a smart card module for example, by avoiding the risk of deformation due to thermal stresses imposed during lamination.

The invention also makes it possible to hot roll a part without an adhesive being present between the part and the lamination plate. Understand that it is possible to adapt the specifications (dimensions, thickness, material ...) of each thermally insulating member according to the degree of thermal protection that is desired.

In particular, the thermally insulating member may advantageously cover the entire bottom of a cavity of the invention. In a particular embodiment, the thermally insulating member covers at least 75% of the total surface of the bottom of the cavity. The thermally insulating member is preferably arranged so as to cover at least the portion of the bottom of the cavity facing the portion of the workpiece which is engaged in the cavity in question. In a particular embodiment, the thermally insulating member is disposed at the bottom of the cavity facing the part of the workpiece engaged in the cavity (namely the portion 10 corresponding to the chip in this example). In a particular embodiment, the thermally insulating member is disposed in the center of the bottom of the cavity. The construction of the plate body into two separate plates mounted on each other facilitates the removal of each thermally insulating member where appropriate and further facilitates the cleaning of the thermally insulating members and the lamination plate.

A lamination plate 80 according to a second embodiment of the invention is now described with reference to FIG. 6.

The plate body 83 of the lamination plate 80 differs mainly from the plate body 53 in that it is unitary (monoblock). In other words, the plate body 83 is not formed by two plates mounted on one another. The plate body 83 thus comprises cavities 86 similar to the cavities 56 described in the first embodiment. These cavities 86 each open to the lamination surface 85 of the plate body 83. The plate body 83 further differs from the plate body 53 in that it has two slots (or chambers) 82a and 82b (collectively noted 82). which longitudinally traverse the entire length of the plate body 83 so as to communicate with the cavities 86. These slots 82 are configured so that they can each receive a thermally insulating member 84a or 84b (collectively 84). These members 84 may have characteristics in terms, in particular, of thermal conduction identical to those of thermally insulating members 60 previously described with reference to the first embodiment.

The number of slots naturally depends on the number of thermally insulating members that is provided with the lamination plate. In this second embodiment, the thermally insulating members 84 may advantageously be inserted into the cavities 82 so as to be disposed at the bottom of the cavities 86. The laminating plate 80 may be used in an identical manner to the lamination plate 40 of the first embodiment. The lamination plate 80 may be provided with fastening means allowing, if necessary, to hold the members 84 in position in the slots 82. On the other hand, it will be understood that the lamination plate according to the invention can be used to laminate all types of module or part, such a module can for example take the form of the module 6 smart card described above. An example of a method of manufacturing a lamination plate according to the invention is now briefly described with reference to FIG. 7. In a first step E2, a plate body is formed (or supplied), this body plate comprising a thermally conductive lamination surface and at least one cavity opening on the surface in question. Here we will take the example where only a cavity is present on the lamination surface. The manufacturing techniques used are well known to those skilled in the art and will therefore not be described in more detail in this document. The plate body may for example be unitary or be formed of a first plate mounted on a second plate, as described above.

Positioning (E4) thereafter the thermally insulating member at the bottom of the cavity so that when the plate body is heated and a workpiece (such as a module such as, for example, a smart card module) is placed in the lamination position on the lamination surface, a portion of the module engaged in the cavity is partially thermally protected from heating by the thermally insulating member. Those skilled in the art will understand that the embodiments and variants described above with reference to the lamination plate, the lamination unit and the manufacturing method are only non-limiting examples of implementation of the invention. . In particular, the skilled person may consider combinations among the variants and embodiments described above to meet a particular need.

Claims (15)

REVENDICATIONS1. A laminating plate (40; 80) for laminating a module (6), comprising a plate body (53; 83), said plate body comprising a thermally conductive lamination surface (54; 85) and at least one cavity (56; 86) opening onto said surface, characterized in that at least one thermally insulating member (60; 84) is disposed at the bottom of said at least one cavity (56; 86) so that when the plate body (53; 83) is heated and a laminating module (6) is placed in the lamination position on said lamination surface (54; 85), a portion (10) of the module (6) engaged in said cavity (56; 86) is partially thermally protected from said heating by the thermally insulating member (60; 84). 2. Plate according to claim 1, wherein the thermally insulating member (60; 84) is removably inserted at the bottom of said cavity. 3. Plate according to claim 1 or 2, comprising at least one slot (82) or groove (66) in which is positioned said thermally insulating member. 20 A plate according to any one of claims 1 to 3, the plate body (53; 83) comprising a first plate (52) mounted on a second plate (50), said first and second plates being thermally conductive, the first plate (52) comprising said lamination surface (54) and said cavity (56), said thermally insulating member (60) being disposed between the first and second plates so as to be disposed at the bottom of said cavity (56). The plate of claim 4, wherein the first plate (52) is in thermal contact with the second plate (50). 30 6. Plate according to claim 4 or 5, the second plate (50) comprising at least one groove (66) in which is housed the member (60) thermally insulating, said member being partially covered by said first plate (52). 35 7. Plate according to one of claims 1 to 6, the member (60; 84) thermally insulating being disposed at the bottom of the cavity (56; 86) so as to be in register with said portion (10) of the module (6). when the module is in the lamination position. A plate according to any one of claims 1 to 7, wherein the thermally insulating member (60; 84) covers the entire bottom of the cavity (56; 86). The plate of any one of claims 1 to 8, wherein the plate body (53; 83) is formed of stainless steel. The plate of any one of claims 1 to 9, wherein said thermally insulating member (60; 84) is made of PETF. 11. Plate according to any one of claims 1 to 10, wherein said portion (10) of the module (6) engaged in the cavity is an electronic chip. 12. Plate according to any one of claims 1 to 11, further comprising heating means (42) of said plate body. A lamination unit (45) comprising a lamination board (40; 80) according to any one of claims 1 to 12 and a backplate (44), said lamination unit being configured to roll said module (6). between said lamination plate (40; 80) and said counterplate (44). The lamination unit (45) of claim 13, wherein an adhesive (70) is disposed on the lamination surface (54; 85) so that it is at the interface between the lamination surface and the module (6). ) when the latter is in a lamination position. A method of manufacturing a laminating plate (40; 80) for laminating a module (6), the method comprising: - providing a plate body (53; 83) comprising a lamination surface (54; 85) thermally conductive and at least one cavity (56; 86) opening on said surface, the method being characterized in that it comprises: - the positioning of at least one member (60; 84) thermally insulating at the bottom of said at least one cavity (56; 86) so that when the plate body (53; 83) is heated and a module (6) to be rolled is placed in the lamination position on said lamination surface, a portion (10) the module (6) engaged in said cavity (56; 86) is partially thermally protected from said heating by the thermally insulating member (60; 84).