WO2013076410A1

WO2013076410A1 - Adapter for microcircuit card between a large format and a small format of lesser thickness

Info

Publication number: WO2013076410A1
Application number: PCT/FR2012/052661
Authority: WO
Inventors: Olivier Bosquet; Ruben Rico
Original assignee: Oberthur Technologies
Priority date: 2011-11-22
Filing date: 2012-11-19
Publication date: 2013-05-30
Also published as: FR2982981A1; FR2982981B1

Abstract

Format adapter making it possible for a microcircuit card of small format to conform to a large format, the large format exhibiting a substantially plane form, exhibiting a large thickness (GE), whose extension along said plane is limited by a large contour, the small format exhibiting a substantially plane form, exhibiting a small thickness (PE), less than the large thickness (GE), whose extension along said plane is limited by a small contour, inscribed within the large contour, said adapter (5) comprising a substantially plane plate (6) whose extension along said plane is limited by an external limit (7) substantially identical to the large contour and by an internal limit (8) substantially identical to the small contour, characterized in that said plate (6) exhibits a thickness substantially equal to the small thickness (PE), and in that the adapter (5) further comprises a substantially plane heightener (9) of thickness substantially equal to the difference between the large thickness (GE) and the small thickness (PE), disposed parallel to the plate (6).

Description

ADAPTER FOR MICROCIRCUIT CARD BETWEEN A LARGE SIZE AND A SMALL FORMAT OF LOW THICKNESS.

The present invention relates to the field of microcircuit cards and more particularly to a format adapter able to compensate for a difference in thickness.

A microcircuit card typically comprises a support plate made of a rigid plastic sheet. In a housing made in the thickness of said plate is disposed a microcircuit, covered with a connector allowing, by means of a suitable reader, dialogue with said microcircuit.

Such a microcircuit card is used as secure memory in many areas: credit card, medical card, identity card or telephone card.

If the area occupied by the microcircuit and its connector remains substantially constant, the surface of the support plate framing it continues to shrink in order to accompany the miniaturization of equipment, such as mobile phones, using such microcircuit cards.

Thus, in the field of mobile telephony for example, a first form factor, 1FF, included a rectangular support plate of external dimensions 54 x 85, 6 mm. Quickly this format gave way to a smaller format: 2FF, with a rectangular support plate of external dimensions 15 x 25 mm, with a keying consisting of a cut corner. This format was followed by an even smaller format: 3FF, with a rectangular support plate of external dimensions 12 x 15 mm, also with a keying consisting of a cut corner.

With these smaller formats, appeared a distribution card. A distribution board is a larger support plate, for example in the 1FF format, which includes the format microcircuit card, 2FF or 3FF, smaller. The microcircuit card is then typically precut so that it can be detached, advantageously without special tools, from the distribution card.

These formats coexisting in time, it is still known to make adapters. Thus an adapter of a small format, for example 3FF, to a large format, for example 2FF, makes it possible to form a microcircuit card with a small format, 3FF in a large format, 2FF. Such an adapter is made in a support plate. Its extension is limited by an external limit substantially identical to the outline of the large format and by an internal limit substantially identical to the outline of the small format. It is able to accommodate a small microcircuit card in its internal limit. Said adapter is advantageously distributed with the microcircuit card within the same distribution card. The microcircuit card and the adapter can thus be presented spaced apart from one another or nested one inside the other.

For these formats, 1FF, 2FF, 3FF, the thickness of the support plate remains the same and is between 680 and 840 micrometers.

It appears today a new format even smaller than the previous ones. This format, named 4FF, for fourth form factor, includes a rectangular support plate of external dimensions 8.8 x 12.3 mm, also with a keying consisting of a cut corner. However, a novelty compared to the previous formats, is that the thickness of the support plate is reduced and must be between 600 and 700 micrometers.

The low overlap of the thickness tolerance ranges, limited to 20 μπι, taking into account the manufacturing tolerances achievable for the plastic materials typically used, does not make it possible to produce a single support plate simultaneously satisfying the thickness requirements of the previous formats, 1FF, 2FF, 3FF and new format, 4FF.

As before, the new 4FF format is brought to coexist in time with the old formats. It is therefore necessary to be able to make an adapter for conforming a microcircuit card of a small format, such as 4FF, in a large format, such as 1FF, 2FF, 3FF, including adapting a difference in thickness, between a large thickness a large format and a small thickness of a small format.

It is also desired to make a microcircuit card and its adapter or adapters in one and the same support plate, in order to achieve a distribution card including a microcircuit card, and its or adapters, material.

The present invention provides an advantageous solution to this problem.

The invention relates to a format adapter for conforming a small format microcircuit card in a large format, the large format having a substantially flat shape, having a large thickness, extension according to said limited plane by a large outline , the small format having a substantially flat shape, having a small thickness, smaller than the large thickness, of extension along said limited plane by a small contour, inscribed in the large outline, said adapter comprising a substantially planar extension plate according to said plane limited by an outer limit substantially identical to the large contour and an internal boundary substantially identical to the small contour, having a thickness substantially equal to the small thickness, and the adapter further comprising a substantially planar enhancer of thickness substantially equal to the difference between the great thickness and the small thickness, arranged parallel nt to the plate.

According to another characteristic of the invention, the booster is arranged on the opposite side to the microcircuit connector. According to another characteristic of the invention, the booster covers all or part of the surface between the outer limit and the inner limit.

According to another characteristic of the invention, the booster covers all or part of the surface inscribed in the internal limit.

According to another characteristic of the invention, the small format is defined by a small, substantially rectangular outline and a small thickness of between 600 and 700 μπι.

According to another characteristic of the invention, the large format is defined by a large substantially rectangular contour and a large thickness of between 680 and 840 μπι.

According to another characteristic of the invention, the booster has a thickness of between 10 and 170 μτη, preferably between 50 and 130 μι ^η .

According to another characteristic of the invention, the booster has a thickness strictly greater than 80 μπι.

The invention also relates to a method of manufacturing such an adapter, comprising the steps of: manufacturing a plate with a thickness substantially equal to the small thickness, manufacturing a booster in a thickness substantially equal to the difference between the great thickness and small thickness.

According to another characteristic of the invention, the step of manufacturing the booster comprises a deposit of material on the plate.

According to another characteristic of the invention, the step of manufacturing the booster comprises the steps of cutting the booster and assembly with the plate.

The invention also relates to a distribution card comprising a plate, comprising a precut microcircuit card in a small format, the small format having a substantially flat shape, having a small thickness, of limited extension by a small outline, a first pre-cut adapter for conforming said microcircuit card into a first large format, the first large format having a substantially planar shape, having a first large thickness, greater than the small thickness, of limited extension by a first large outline, exinscrit in the small outline, at least a second precut adapter for conforming said microcircuit card in a second large format, the second large format having a substantially flat shape, having a second large thickness, greater than the small thickness, limited extension by a second large outline, exinscribed in the small outline, said plate having a thickness substantially equal to the small thickness, and each adapter further comprising a substantially planar booster thickness substantially equal to the difference between the first, respectively second, large thickness and the little ep ailer, arranged parallel to the plate.

According to another characteristic of the invention, the microcircuit card is disposed in one of said adapters.

Other characteristics, details and advantages of the invention will emerge more clearly from the detailed description given below as an indication in relation to drawings in which:

Figure 1 shows comparatively different formats,

FIG. 2 presents a microcircuit card arranged in an adapter,

FIG. 3 shows an embodiment of an adapter, in perspective view,

FIG. 4 shows the adapter of FIG. 3, in cutaway view,

FIG. 5 presents another embodiment of an adapter, in perspective view,

FIG. 6 shows the adapter of FIG. 5, in cutaway view, - Figure 7 shows an embodiment of a distribution card.

As illustrated in FIG. 1, there are different microcircuit card formats 1. In all cases, a microcircuit card 1 is cut out of a substantially flat thin plate of plastic material. In all formats, a microcircuit card comprises on one of its faces a connector 3 for connecting with the microcircuit.

In order to allow a small format microcircuit card PF to be used in place of a large format microcircuit card GF, that is to say a larger format than the small format PF, it is necessary to make an adapter 5, adapted to be placed around the microcircuit card 1 so as to maintain it and to present a shape corresponding to the large format GF. Thus such an adapter 5 makes it possible to form a microcircuit card 1 of small format PF in a large GF format. An assembly comprising an adapter 5 and a small microcircuit card 1 PF, placed in the adapter 5, can be installed, for example in a card reader, instead of a large microcircuit card. GF format.

For this, an adapter 5, an embodiment of which is shown in FIGS. 2 and 3, makes a transition between a small format PF and a large format GF.

The small PF format is a card format. It is thus cut into a plate of substantially flat shape and of small thickness compared to its other dimensions, which is called small PE thickness. The extension of the small PF format according to the plane of said plate is limited by a small PC contour.

The large format GF is a card format. It is thus cut into a plate of substantially flat shape and of low thickness compared to its other dimensions. This thickness according to an important characteristic is however greater than the thickness PE of the small format PF. Also this thickness is named thick GE. The extension of the large format GF according to the plane of said plate is limited by a large contour GC. The small PC contour is such that it can fit into the large GC contour.

In order to allow adaptation of the small PF format to the large GF format, the adapter 5 comprises a first piece cut into a plate of substantially flat shape and of small thickness compared with its other dimensions, which is called plate 6 The extension of said plate 6 according to its main extension plane is limited by an outer limit 7 and an internal limit or cutout 8. The outer limit 7 substantially coincides with the large GC contour of the large format GF. The internal limit 8 is substantially coincident with the small PC contour of the small PF format. The term substantially comprises here the tolerances necessary for the realization and the proper functioning. The internal limit 8 is thus complementary to a small PF format, so as to be able to hold a card (or other adapter) in accordance with the small PF format. The outer limit 7 is on the contrary consistent with the definition of a large format GF, so that the adapter 5 can replace a large format card GF.

The relative positioning in the adapter 5 of the internal limit 8 relative to the outer limit 7 is determined by other constraints. Thus, in known manner, the position of the connector 3 of the microcircuit card 1 is defined relative to the small PC contour / internal boundary 8 by the small PF format. The definition of the position of the connector 3 relative to the large contour GC / external limit 7 is defined by the large format GF and makes it possible to determine the relative positioning of the internal limit 8 relative to the external limit 7.

FIG. 2 shows a microcircuit card 1, seen from the side of its connector 3, in place in an adapter 5. The microcircuit card 1 is of a small PF format. However, thus equipped with an adapter 5, the microcircuit card unit 1 and adapter 5 has the same dimensional interfaces as a large format microcircuit card GF.

It has been seen, according to an important feature of the technical problem that the adapter 5 is advantageously made of material with the microcircuit card 1. The microcircuit card 1, conforming to the small PF format, must have a thickness equal to the small thickness PR. Also, the plate 6 of the adapter 5 advantageously has a thickness equal to this same small thickness PE.

However, the assembly comprising the adapter 5 and the microcircuit card 1 PF small format, must conform to the large format GF and have, at least partially, a thickness equal to the great thickness GE.

For this, the adapter 5 further comprises a booster 9. This booster 9 is preferably substantially flat and has a thickness substantially equal to the difference between the large thickness GE and the small PE thickness. The booster 9 is arranged parallel to the plate 6. Thus constituted, the adapter 5 has a thickness substantially equal to the large thickness GE and thus conforms to the large format GF.

Said booster 9 is comprised in a thin plate of substantially flat shape and of small thickness compared with its other dimensions, arranged parallel to the plate 6.

According to an advantageous characteristic, the booster 9 is arranged facing the face of the adapter 5 which is on the opposite side to the microcircuit 3 of the microcircuit card 1 when said microcircuit card 1 is in place in the adapter 5. Thus, the microcircuit card 1 being disposed in the same plane as the adapter 5, has its connector 3 on an outer face of the assembly comprising the adapter 5 and the card to microcircuit 1. Also when said set is placed in a card reader, the remausseur 9, disposed on the other side of said assembly, contributes to press said connector 3 against the reading means.

The booster 9 may have an extension in the plane of the thin plate that can be any. However, an extension outside the outer limit 7 is of little interest.

The booster 9 covers the entire area between the outer limit 7 and the inner limit 8. This surface corresponds to one of the faces of the adapter 5. The booster 9 can cover this entire surface and thus provide a large thickness GE on all said surface.

FIG. 4, which shows a sectional view of the adapter 5 of FIG. 3, illustrates an embodiment where the booster 9 covers the entire surface of the adapter 5, ie the area between the outer limit 7 and the internal limit 8.

According to an alternative embodiment, the booster

9 may cover only a limited portion of the face of the adapter 5. Indeed, a large format card GF is intended to be inserted in a card reader. Such a card reader usually includes a reduced introduction interface with two slides. To ensure proper positioning of the adapter 5 in said card reader it may be sufficient that the thickness of the adapter 5 is equal to the large thickness GE in the area facing said slides. Such a partial coverage embodiment is not illustrated.

According to an alternative embodiment, more particularly illustrated in FIGS. 5 and 6, the surface covered by the booster 9 can still extend to the surface inscribed in the internal boundary 8. Thus the booster 9 comes wholly or partly to cover the surface of the microcircuit card 1.

Figures 5 and 6 show an embodiment where the recovery of the microcircuit card 1, small PF format, is partial. The booster 9 includes a saving 11 where the microcircuit card 1 is not covered.

Such an adapter 5 can be made according to an advantageous manufacturing method. Such a manufacturing method comprises the steps of manufacturing a plate 6 to a thickness substantially equal to the small thickness PE, and manufacturing a booster 9.

The step of manufacturing the plate 6 comprises all the steps, known to those skilled in the art, for shaping an adapter 5 and, if appropriate, a microcircuit card 1, as well as any cutouts or pre-cuts, which will make it possible to detach said adapter 5 and said microcircuit card 1.

The step of manufacturing a booster 9 contributes to giving it a thickness substantially equal to the difference between the large thickness GE and the small thickness PE.

This may, according to a first embodiment, be achieved by a deposition of material on said plate 6. Such a deposit is advantageous in that it uses a liquid or pasty material, easy to implement, and which then solidifies . This material may be any material capable of being deposited on a plate 6 of plastics material. However, such an embodiment restricts the surface covered by the booster 9 to the sole surface of the plate 6 / adapter 5, excluding the surface covering the microcircuit card 1.

According to another embodiment, the manufacture of the booster is performed by cutting the booster 9, for example in a sheet material and then proceeding to its assembly with the plate 6. The sheet material can be flexible or rigid. However, it should have some crush resistance in order to achieve the final GE thickness. The material may be a sheet of the same plastic material as the plate 6. The material may still be PET. The assembly is advantageously carried out by means of an adhesive. Thus the booster 9 can easily be removed from the adapter 5 and / or the microcircuit card 1 if it is not used. Advantageously, this adhesive makes it possible to replace later the booster 9 on the adapter 5 if necessary.

This second embodiment advantageously allows for a booster which covers, at least partially, the surface covering the internal limit 8 where is housed the microcircuit card 1. This promotes the retention of the microcircuit card 1 in place in the adapter 5 and contributes to ensuring the support of the connector 3 against the reading means.

According to a preferred embodiment, the small PF format is a 4FF format defined by a small rectangular PC contour and dimensions 8.8 x 12.3 mm and a small PE thickness between 600 and 700 um.

It can then be made an adapter 5 for each large format. The large format GF can be defined by one of the formats prior to the 4FF format. A large format GF can thus be a format 3FF defined by a large contour GC substantially rectangular and dimensions 12 x 15 mm and a large thickness GE between _, 680 and 840 μτ. A large format GF can still be a format 2FF defined by a large contour GC substantially rectangular and dimensions 15 x 25 mm and a large thickness GE between 680 and 840 μπκ A large format GF can still be a format 1FF defined by a GC large outline substantially rectangular and dimensions 54 x 85.6 mm and a large thickness GE between 680 and 840 μπι. Other formats for the large format GF are still possible. We can quote the normalized format 40 x 66 mm or the standardized format 33 x 66 mm.

So that the adapter assembly 5 plus microcircuit card 1 has, at least over a portion of its surface, a thickness corresponding to the great thickness GE of the large format GF, the booster 9 has a thickness between 10 and 170 μτη. In order to take account of manufacturing tolerances, it is possible to reduce this thickness to a range between 50 and 130 μπι. According to a preferred embodiment, this thickness is advantageously strictly greater than 80 μm. According to a preferred embodiment, this thickness is advantageously strictly greater than 160 μm.

The invention further relates to a distribution card 12. An embodiment of such a distribution card 12 is illustrated in FIG. 7. A distribution card 12 is a plate 13 of plastic material in which at least one card is arranged. The first function of such a distribution card 12 is to allow the dispenser to deliver a set large enough to be handled easily, while the microcircuit card 1 is of smaller and smaller dimensions.

A distribution card 12 thus comprises a microcircuit card 1 of small format PF. This microcircuit card 1 is advantageously pre-cut, by any technique known to those skilled in the art, so that it can simply be detached from the plate 13 of the distribution card 12 without tools. Advantageously, the space available on the distribution card 12 is used to integrate all the means useful for the use of such a microcircuit card 1.

Thus a first adapter 15 may be arranged in the plate 13. Such an adapter 15 has a large external contour GC1 corresponding to a first large format GF1. The microcircuit card 1 can advantageously be disposed in said adapter 14. Likewise at least one second adapter 16 can be arranged in the plate 13. Such an adapter 16 has a large external contour GC2 corresponding to a second large format GF2. Each of the adapters 15, 16 comprises a booster (not visible), advantageously arranged on the opposite side to the connector 3 of the microcircuit card 1. Each booster has a thickness adapted to the thickness of the format of its adapter 5. Thus if the first large format GF1 has a thickness GE1, the booster of the first adapter 15 has a thickness GE1 - PE . Similarly, if the second large format GF2 has a thickness GE2, the booster of the second adapter 16 has a thickness GE2 - PE.

Each of the adapters 15, 16 is advantageously pre-cut in order to be easily detached from the plate 13. The plate 13 itself can also form an adapter.

As illustrated in FIG. 7, the microcircuit card 1 is in the 4FF format. The adapter 15 makes it possible to adapt from a 4FF format to a 3FF format, both in extension and in thickness. The adapter 16 makes it possible to adapt from a 4FF format to a 2FF format, both in extension and in thickness. Plate 13 makes it possible to adapt to a 1FF format.

Thus, depending on the format of the card reader, the same distribution card 12 can provide several formats. If the microcircuit card 1 is detached alone, by breaking the precut at the periphery of the microcircuit card 1, it can be used in a reader 4FF. If the microcircuit card 1 is detached together with the adapter 15, by breaking the pre-cut at the periphery of the adapter 15, without necessarily breaking the pre-cut at the periphery of the microcircuit card 1, said assembly can be used in a 3FF reader. If the microcircuit card 1 is detached alone, by breaking the pre-cut at the periphery of the microcircuit card 1, the adapter 16 is detached by breaking the precut at the periphery of the adapter 16, the microcircuit card 1 can to be implemented in the internal cutout present in the adapter 16. The assembly comprising the microcircuit card 1 and placed in place and the adapter 16 can be used in a 2FF reader. Without any manipulation, the plate 13 can be used directly in a 1FF reader.

According to an advantageous embodiment, the various adapters 15, 16 are arranged in the plate 13 symmetrically relative to the center of the plate 13, so that the connector 3 of the microcircuit card 1 is found positioned at the same position relatively at the corner of said plate 13.

It is still possible to have other adapters in the space available on the plate 13.

Claims

1. A format adapter for conforming a small format (PF) microcircuit card (1) to a large format (GF), the large format (GF) having a substantially flat shape, having a large thickness (GE), d extension according to said limited plane by a large outline (GC), the small format (PF) having a substantially flat shape, having a small thickness (PE), less than the great thickness (GE), of extension according to said limited plane by a small contour (PC), inscribed in the large outline (GC), said adapter (5) comprising a plate (6) substantially plane of extension according to said plane limited by an outer limit (7) substantially identical to the large contour ( GC) and an internal limit (8) substantially identical to the small contour (PC), characterized in that said plate (6) has a thickness substantially equal to the small thickness (PE), and in that the adapter (5) ) still includes a substantially planar booster (9) of thickness substantially equal to the difference between the large thickness (GE) and the small thickness (PE), arranged parallel to the plate (6).

2. The adapter of claim 1, wherein the booster (9) is disposed on the opposite side to the connector (3) microcircuit.

3. An adapter according to claim 1 or 2, wherein the booster (9) covers all or part of the surface between the outer limit (7) and the inner limit (8).

4. An adapter according to claim 3, wherein the booster (9) covers all or part of the surface inscribed in the inner boundary (8).

Adapter according to any one of the claims at 4, where the small format (FF) is defined by a small contour (PC) substantially rectangular and a small thickness (PE) between 600 and 700 μτ ^η .

6. An adapter according to any one of claims 1 to 5, wherein the large format (GF) is defined by a large outline (GC) substantially rectangular and a large thickness (GE) between 680 and 840 μιτι.

7. An adapter according to any one of claims 1 to 6, wherein the booster (9) has a thickness of between 10 and 170 m, preferably between 50 and 130 ym.

8. The adapter of claim 7, wherein the booster (9) has a thickness strictly greater than 80 μπι.

9. A method of manufacturing an adapter (9) according to any one of the preceding claims, characterized in that it comprises the following steps:

- manufacture of a plate (6) with a thickness substantially equal to the small thickness (PE),

manufacturing a booster (9) in a thickness substantially equal to the difference between the large thickness (GE) and the small thickness (PE).

10. The manufacturing method according to claim 9, wherein the step of manufacturing the booster (9) comprises a deposition of material on the plate (6).

11. The manufacturing method according to claim 9 or 10, wherein the step of manufacturing the booster (9) comprises the steps of cutting the booster (9) and assembly with the plate (6).

12. A distribution board comprising a plate (13), comprising a microcircuit card (14) precut in a small format (PF), the small format (PF) having a substantially flat shape, having a small thickness (PE), of limited extension limited by a small contour (PC), a first adapter (15) pre-cut, for conforming said microcircuit card (1) in a first large format (GF1) , the first large format (GF1) having a substantially planar shape, having a first large thickness, greater than the small thickness, of limited extension by a first large contour (GC1), exinscribed to the small contour (PC), at least one second adapter (16) pre-cut to conform said microcircuit card (14) in a second large format (GF2), the second large format (GF2) having a substantially planar shape, having a second large thickness, greater than the small thickness, extension limited by a second large contour (GC2), exinscrit small contour (PC), characterized in that said plate (13) has a thickness substantially equal to the small thickness, and in that each adapter (15, 16) further comprises a substantially plane booster thickness substantially equal to the difference between the first, respectively second, greater thickness and the smallest thickness, arranged parallel to the plate (13).

The distribution board according to claim 12, wherein the microcircuit card (1) is disposed in one of said adapters (15, 16).