FR2978598B1 - Installation et procede de traitement d'un objet par des generateurs de plasma - Google Patents
Installation et procede de traitement d'un objet par des generateurs de plasmaInfo
- Publication number
- FR2978598B1 FR2978598B1 FR1156975A FR1156975A FR2978598B1 FR 2978598 B1 FR2978598 B1 FR 2978598B1 FR 1156975 A FR1156975 A FR 1156975A FR 1156975 A FR1156975 A FR 1156975A FR 2978598 B1 FR2978598 B1 FR 2978598B1
- Authority
- FR
- France
- Prior art keywords
- installation
- processing
- plasma generators
- generators
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/3442—Applying energy to the substrate during sputtering using an ion beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32357—Generation remote from the workpiece, e.g. down-stream
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32366—Localised processing
- H01J37/32376—Scanning across large workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32422—Arrangement for selecting ions or species in the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32899—Multiple chambers, e.g. cluster tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
- Plasma Technology (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1156975A FR2978598B1 (fr) | 2011-07-29 | 2011-07-29 | Installation et procede de traitement d'un objet par des generateurs de plasma |
US14/234,849 US20140231242A1 (en) | 2011-07-29 | 2012-07-25 | Tool and process for treating an object by plasma generators |
BR112014002263A BR112014002263A2 (pt) | 2011-07-29 | 2012-07-25 | instalação e processo de tratamento de um objeto por geradores de plasma |
CN201280038054.6A CN103890898A (zh) | 2011-07-29 | 2012-07-25 | 采用等离子体发生器处理对象的工具和方法 |
MX2014001141A MX2014001141A (es) | 2011-07-29 | 2012-07-25 | Herramienta y proceso para tratar un objeto por generadores de plasma. |
EP12740944.9A EP2737515A1 (fr) | 2011-07-29 | 2012-07-25 | Installation et procédé de traitement d'un objet par des générateurs de plasma |
PCT/EP2012/064577 WO2013017495A1 (fr) | 2011-07-29 | 2012-07-25 | Installation et procédé de traitement d'un objet par des générateurs de plasma |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1156975A FR2978598B1 (fr) | 2011-07-29 | 2011-07-29 | Installation et procede de traitement d'un objet par des generateurs de plasma |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2978598A1 FR2978598A1 (fr) | 2013-02-01 |
FR2978598B1 true FR2978598B1 (fr) | 2014-04-25 |
Family
ID=46598499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1156975A Expired - Fee Related FR2978598B1 (fr) | 2011-07-29 | 2011-07-29 | Installation et procede de traitement d'un objet par des generateurs de plasma |
Country Status (7)
Country | Link |
---|---|
US (1) | US20140231242A1 (fr) |
EP (1) | EP2737515A1 (fr) |
CN (1) | CN103890898A (fr) |
BR (1) | BR112014002263A2 (fr) |
FR (1) | FR2978598B1 (fr) |
MX (1) | MX2014001141A (fr) |
WO (1) | WO2013017495A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6584927B2 (ja) * | 2015-11-13 | 2019-10-02 | 住友重機械イオンテクノロジー株式会社 | イオン注入装置、およびイオン注入装置の制御方法 |
US10558192B2 (en) | 2016-06-03 | 2020-02-11 | William Wilder | Movable gantry system configured to interface with jigs of different sizes |
WO2020001774A1 (fr) * | 2018-06-28 | 2020-01-02 | Applied Materials, Inc. | Procédé de traitement de surface pour un film polymère |
CN110890266B (zh) * | 2019-11-29 | 2022-09-23 | 广州立景创新科技有限公司 | 音圈马达表面处理方法和设备 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5273609A (en) * | 1990-09-12 | 1993-12-28 | Texas Instruments Incorporated | Method and apparatus for time-division plasma chopping in a multi-channel plasma processing equipment |
US5296272A (en) * | 1990-10-10 | 1994-03-22 | Hughes Aircraft Company | Method of implanting ions from a plasma into an object |
DE19643865C2 (de) * | 1996-10-30 | 1999-04-08 | Schott Glas | Plasmaunterstütztes chemisches Abscheidungsverfahren (CVD) mit entfernter Anregung eines Anregungsgases (Remote-Plasma-CVD-Verfahren) zur Beschichtung oder zur Behandlung großflächiger Substrate und Vorrichtung zur Durchführung desselben |
US5883374A (en) * | 1997-03-27 | 1999-03-16 | Advanced Micro Devices, Inc. | Scanning system for identifying wafers in semiconductor process tool chambers |
US20040040833A1 (en) * | 2002-08-27 | 2004-03-04 | General Electric Company | Apparatus and method for plasma treating an article |
CN1943002A (zh) * | 2004-05-27 | 2007-04-04 | 通用电气公司 | 对物件进行等离子体处理的装置和方法 |
FR2899242B1 (fr) * | 2007-04-05 | 2010-10-22 | Quertech Ingenierie | Procede de durcissement par implantation d'ions d'helium dans une piece metallique |
CN101545582B (zh) * | 2009-05-05 | 2011-01-05 | 浙江大学 | 半导体激光器阵列光束整形照明系统 |
EP2474642B1 (fr) * | 2009-10-08 | 2016-03-02 | Fujikura, Ltd. | Procédé de pulvérisation cathodique assistée par faisceau d'ions. |
-
2011
- 2011-07-29 FR FR1156975A patent/FR2978598B1/fr not_active Expired - Fee Related
-
2012
- 2012-07-25 WO PCT/EP2012/064577 patent/WO2013017495A1/fr active Application Filing
- 2012-07-25 US US14/234,849 patent/US20140231242A1/en not_active Abandoned
- 2012-07-25 CN CN201280038054.6A patent/CN103890898A/zh active Pending
- 2012-07-25 EP EP12740944.9A patent/EP2737515A1/fr not_active Withdrawn
- 2012-07-25 MX MX2014001141A patent/MX2014001141A/es unknown
- 2012-07-25 BR BR112014002263A patent/BR112014002263A2/pt not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20140231242A1 (en) | 2014-08-21 |
FR2978598A1 (fr) | 2013-02-01 |
BR112014002263A2 (pt) | 2017-02-21 |
MX2014001141A (es) | 2014-02-27 |
CN103890898A (zh) | 2014-06-25 |
WO2013017495A1 (fr) | 2013-02-07 |
EP2737515A1 (fr) | 2014-06-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20160331 |