FR2956558B1 - ELECTRONIC MODULE WITH ENHANCED THERMAL DISSIPATION - Google Patents
ELECTRONIC MODULE WITH ENHANCED THERMAL DISSIPATIONInfo
- Publication number
- FR2956558B1 FR2956558B1 FR1051185A FR1051185A FR2956558B1 FR 2956558 B1 FR2956558 B1 FR 2956558B1 FR 1051185 A FR1051185 A FR 1051185A FR 1051185 A FR1051185 A FR 1051185A FR 2956558 B1 FR2956558 B1 FR 2956558B1
- Authority
- FR
- France
- Prior art keywords
- electronic module
- thermal dissipation
- enhanced thermal
- enhanced
- dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1051185A FR2956558B1 (en) | 2010-02-18 | 2010-02-18 | ELECTRONIC MODULE WITH ENHANCED THERMAL DISSIPATION |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1051185A FR2956558B1 (en) | 2010-02-18 | 2010-02-18 | ELECTRONIC MODULE WITH ENHANCED THERMAL DISSIPATION |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2956558A1 FR2956558A1 (en) | 2011-08-19 |
FR2956558B1 true FR2956558B1 (en) | 2016-07-01 |
Family
ID=42370889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1051185A Active FR2956558B1 (en) | 2010-02-18 | 2010-02-18 | ELECTRONIC MODULE WITH ENHANCED THERMAL DISSIPATION |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2956558B1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016146848A2 (en) * | 2015-03-19 | 2016-09-22 | Commscope Connectivity Uk Limited | Thermally conductive closure for electronics |
USD835040S1 (en) | 2016-09-09 | 2018-12-04 | Corning Research & Development Corporation | 1×4 distribution point unit |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4899210A (en) * | 1988-01-20 | 1990-02-06 | Wakefield Engineering, Inc. | Heat sink |
DE10134187B4 (en) * | 2001-07-13 | 2006-09-14 | Semikron Elektronik Gmbh & Co. Kg | Cooling device for semiconductor modules |
DE10141697A1 (en) * | 2001-08-25 | 2003-03-06 | Bosch Gmbh Robert | Switching or control device |
US20040227230A1 (en) * | 2003-05-13 | 2004-11-18 | Ming-Ching Chou | Heat spreaders |
DE202004012318U1 (en) * | 2004-08-06 | 2005-12-15 | Krauss-Maffei Wegmann Gmbh & Co. Kg | Joint or distribution unit for CAN-bus system of military vehicle, has circuit board arranged in housing, which is constructed as flat housing, in such a way that board clamps between upper and lower parts when housing is assembled |
-
2010
- 2010-02-18 FR FR1051185A patent/FR2956558B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
FR2956558A1 (en) | 2011-08-19 |
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Legal Events
Date | Code | Title | Description |
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PLFP | Fee payment |
Year of fee payment: 7 |
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PLFP | Fee payment |
Year of fee payment: 8 |
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PLFP | Fee payment |
Year of fee payment: 9 |
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PLFP | Fee payment |
Year of fee payment: 11 |
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PLFP | Fee payment |
Year of fee payment: 12 |
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PLFP | Fee payment |
Year of fee payment: 13 |
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PLFP | Fee payment |
Year of fee payment: 14 |
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PLFP | Fee payment |
Year of fee payment: 15 |