FI20095860A - The electronic device - Google Patents

The electronic device Download PDF

Info

Publication number
FI20095860A
FI20095860A FI20095860A FI20095860A FI20095860A FI 20095860 A FI20095860 A FI 20095860A FI 20095860 A FI20095860 A FI 20095860A FI 20095860 A FI20095860 A FI 20095860A FI 20095860 A FI20095860 A FI 20095860A
Authority
FI
Finland
Prior art keywords
electronic device
electronic
Prior art date
Application number
FI20095860A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI122621B (en
FI20095860A0 (en
Inventor
Tero Peltola
Mikko Silvennoinen
Joni Hietala
Original Assignee
Perlos Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perlos Oyj filed Critical Perlos Oyj
Priority to FI20095860A priority Critical patent/FI122621B/en
Publication of FI20095860A0 publication Critical patent/FI20095860A0/en
Priority to CN201080036722.2A priority patent/CN102484662B/en
Priority to PCT/FI2010/050633 priority patent/WO2011020946A2/en
Priority to EP10765466A priority patent/EP2467996A2/en
Publication of FI20095860A publication Critical patent/FI20095860A/en
Application granted granted Critical
Publication of FI122621B publication Critical patent/FI122621B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14688—Coating articles provided with a decoration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005—Conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/105—Mechanically attached to another device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
FI20095860A 2009-08-20 2009-08-20 Electronic device and housing part FI122621B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI20095860A FI122621B (en) 2009-08-20 2009-08-20 Electronic device and housing part
CN201080036722.2A CN102484662B (en) 2009-08-20 2010-08-16 Cover comprising a flexible connecting element for an electronic device
PCT/FI2010/050633 WO2011020946A2 (en) 2009-08-20 2010-08-16 Electronic device
EP10765466A EP2467996A2 (en) 2009-08-20 2010-08-16 Cover comprising a flexible connecting element for an electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20095860 2009-08-20
FI20095860A FI122621B (en) 2009-08-20 2009-08-20 Electronic device and housing part

Publications (3)

Publication Number Publication Date
FI20095860A0 FI20095860A0 (en) 2009-08-20
FI20095860A true FI20095860A (en) 2011-02-21
FI122621B FI122621B (en) 2012-04-30

Family

ID=41050686

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20095860A FI122621B (en) 2009-08-20 2009-08-20 Electronic device and housing part

Country Status (4)

Country Link
EP (1) EP2467996A2 (en)
CN (1) CN102484662B (en)
FI (1) FI122621B (en)
WO (1) WO2011020946A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102104640A (en) * 2009-12-18 2011-06-22 索尼爱立信移动通讯股份有限公司 Illumination housing cover for mobile communication equipment
JP5314773B2 (en) * 2012-02-10 2013-10-16 ホシデン株式会社 Component module
US9297675B2 (en) 2013-10-04 2016-03-29 Tactotek Oy Illuminated indicator structures for electronic devices
DE102014106585A1 (en) 2014-05-09 2015-11-12 Leonhard Kurz Stiftung & Co. Kg Multilayer body and method for its production
EP3124197B1 (en) * 2015-07-31 2017-12-20 C.R.F. Società Consortile per Azioni Method for manufacturing a component for a motor-vehicle interior
DE102015222190B4 (en) * 2015-11-11 2019-03-28 Itt Manufacturing Enterprises Llc Connector and motor or valve cover member comprising a connector
WO2017219260A1 (en) * 2016-06-22 2017-12-28 广东欧珀移动通信有限公司 Camera assembly and mobile terminal
CN108048794B (en) * 2017-12-26 2019-12-03 昆山英利悦电子有限公司 It is a kind of for covering the PVD jig of mobile phone TYPE-C charging interface pin
DE102019126232A1 (en) * 2019-09-30 2021-04-01 Lisa Dräxlmaier GmbH MANUFACTURING A LIVE VEHICLE COMPONENT

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0475399A (en) * 1990-07-17 1992-03-10 Matsushita Electric Ind Co Ltd Multilayer circuit member and its manufacture
DE69716055T2 (en) * 1996-03-08 2003-07-10 Citizen Watch Co Ltd SOLAR WATCH WITH A DIAL OF STRUCTURES FOR SOLAR WATCHES AND WITH A SOLAR CELL CONTAINED IN THIS WATCH
US5979043A (en) * 1997-07-14 1999-11-09 Ford Motor Company Method of manufacturing a circuit assembly from two or more layers of flexible film
DE69833703T2 (en) * 1997-12-29 2006-08-17 Samsung Electronics Co., Ltd. Method and system for character recognition for a mobile communication terminal
US7112885B2 (en) * 2003-07-07 2006-09-26 Board Of Regents, The University Of Texas System System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
US20080094025A1 (en) * 2006-10-20 2008-04-24 Rosenblatt Michael N Solar cells on portable devices
WO2008123191A1 (en) * 2007-03-30 2008-10-16 Nissha Printing Co., Ltd. Resin molded body and method for manufacturing the same
TWI348636B (en) * 2007-08-03 2011-09-11 High Tech Comp Corp Handheld electronic apparatus and touch panel thereof
KR101379073B1 (en) * 2007-08-28 2014-03-28 삼성전자주식회사 Apparatus and method for charging battery using solar cell
JP4756020B2 (en) * 2007-09-25 2011-08-24 株式会社東芝 Housing, method for manufacturing the same, and electronic device
CN201274473Y (en) * 2008-07-30 2009-07-15 深圳易盛泰科技有限公司 Built-in antenna structure for mobile phone

Also Published As

Publication number Publication date
WO2011020946A2 (en) 2011-02-24
CN102484662B (en) 2015-05-13
FI122621B (en) 2012-04-30
CN102484662A (en) 2012-05-30
WO2011020946A3 (en) 2011-06-23
EP2467996A2 (en) 2012-06-27
FI20095860A0 (en) 2009-08-20

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