CN102484662B - Cover comprising a flexible connecting element for an electronic device - Google Patents

Cover comprising a flexible connecting element for an electronic device Download PDF

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Publication number
CN102484662B
CN102484662B CN201080036722.2A CN201080036722A CN102484662B CN 102484662 B CN102484662 B CN 102484662B CN 201080036722 A CN201080036722 A CN 201080036722A CN 102484662 B CN102484662 B CN 102484662B
Authority
CN
China
Prior art keywords
film
coating member
assembly
coating
bus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080036722.2A
Other languages
Chinese (zh)
Other versions
CN102484662A (en
Inventor
T·佩尔托拉
M·希尔文诺伊宁
J·希耶塔拉
M·阿拉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lite On Technology Corp
Original Assignee
Lite On Mobile Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lite On Mobile Oyj filed Critical Lite On Mobile Oyj
Publication of CN102484662A publication Critical patent/CN102484662A/en
Application granted granted Critical
Publication of CN102484662B publication Critical patent/CN102484662B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/147Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0274Details of the structure or mounting of specific components for an electrical connector module
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467Joining articles or parts of a single article
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14688Coating articles provided with a decoration
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0247Electrical details of casings, e.g. terminals, passages for cables or wiring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16Making multilayered or multicoloured articles
    • B29C45/1671Making multilayered or multicoloured articles with an insert
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005Conductive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10439Position of a single component
    • H05K2201/105Mechanically attached to another device
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Abstract

A cover part of an electronic device and an electronic device. The cover part has a frame (1) with a first surface (8) and a second surface (9) opposite to the first surface. The cover part (25) further comprises first component (4) that is arranged to transmit and/or receive signals, and a connecting element (5) with a signal-transmitting bus that is connected to said first component (4).The connecting element (5) comprises a flexible part (27) arranged to diverge from the cover part (25).

Description

The coating member comprising flexible connecting element of electronic equipment
Technical field
The present invention relates to the coating member of electronic equipment, this coating member has the framework with first surface and the second surface relative with first surface, this coating member also comprises the first assembly being arranged to transmission and/Received signal strength, and has the Connection Element that the signal being connected to described first assembly sends bus.
The invention still further relates to electronic equipment.
Background technology
The covered structure of electronic equipment (particularly portable electric appts, such as mobile phone, communicator (communicator), palmtop computer, portable computer, game console or controller, playback apparatus etc. for the sense of hearing and/or visual material) typically comprises one or more coating members that maybe can link together and/or be connected to device framework regularly with opening.The confined space formed by covered structure contains the electric assembly needed for the function of electronic equipment, and this covered structure makes assembly from such as dust, dirt and mechanical stress.Coating member is the usual thin-wall product manufactured by plastics, metal, plastic composite typically.Opening and the through hole of the necessity being used for display, keyboard, switch, electric connector etc. is formed in coating member.
Known have the electronic equipment that one or more is fixed to the electronic building brick of covered structure.Such as, electronic building brick can be antenna.
The known such electronic building brick arranged in covered structure is connected to by using the metal pins that typically arranges in coating member or plug such as " pogo " pin the electric assembly arranged in the confined space of covered structure inside.
Some problem associates with such solution.First, little pin is processed or plug is difficult in the fabrication stage of coating member.Coating member is manufactured by injection molding (injection moulding), and pin or plug need to be arranged and be fixed to mould thus they remain on appropriate location when injecting.This needs expensive special arrangement to obtain the dimensional accuracy wanted.
But pin and plug are so large thus create the very large space of many electric bus requirementses of mutual insulating.Because do not have available space, can not arrange such electronic building brick in covered structure, it is connected to circuit board by several electric buses in order to action need.
Another problem is that it is very difficult for then clearly visible pin and plug invisibly will being arranged into coating member if the electronic building brick connected is arranged at the outer surface side of coating member.Therefore, pin and plug can not improve the outward appearance of coating member really.
Summary of the invention
Target of the present invention is to provide electronic equipment coating member and the electronic equipment of a kind of novelty and improvement.
The content that coating member of the present invention and electronic equipment are set forth by the characteristic of independent claims characterizes.Other embodiments of the present invention are characterized by the content set forth in other claims.
Invention embodiment is also open in the specification and accompanying drawing of present patent application.The invention content of present patent application can also to define from other different modes that appended claims defines.Invention content can also be made up of several independent inventions, if particularly the present invention according to explicit or implicit subtask or according to the benefit obtained or benefit collection checked words.Under such a condition, consider independent invention thought, some definition comprised in following patent requires may be dispensable.The feature of different embodiments of the invention can be applied to other embodiments in the scope of basic invention thought.Below, the feature of some embodiments of the present invention is listed with random sequence:
-the first assembly is the assembly sending and/or receive the signal of telecommunication, and signal sends the bus that bus is the transmission signal of telecommunication,
-the first assembly is the assembly of transmission and/or receiving optical signals, and signal sends the bus that bus is transmission light signal,
-the first assembly is arranged at first surface side, and signal sends bus is arranged to and extends to second surface side from first surface side, thus flexible (flexible) parts are arranged to fork (diverge) to second surface side,
-signal sends bus and is arranged to the edge extending past framework, thus it extends to its second surface side from the first surface side of the framework of described covering,
The edge of-framework is through the opening of framework,
-opening is camera opening,
-opening is display for equipment or its protecting window and the opening formed,
-opening is the opening formed for the action button of equipment,
The edge of-framework is the edge of the external margin forming coating member,
The film that the first surface side that-coating member is included in framework arranges, and the part of conductive bus is arranged between the outer surface of framework and described film,
-film embeds film (insert film),
-film is label film (labelling film),
-film is divert film (transfer film),
-film is plural layers,
-the first assembly is arranged at second surface side, and flexible part is arranged to and branches to second surface side,
-the first assembly is arranged between the first and second surfaces of coating member, and signal sends bus is arranged to and extends to second surface side, thus flexible part is arranged to and branches to second surface side,
It is independent assembly that-this signal sends bus, and it comprises conductor and by they dielectric base disconnected from each other,
-signal sends the element that bus is similar film, and it is included in the conductor of organized side-by-side in dielectric base,
It is flexible electric circuit board that-signal sends bus,
-signal sends the photoconductor that bus is similar film,
-signal sends the second structure member that bus is integrated into coating member,
-signal sends bus and is integrated into film,
-signal sends the framework that bus is integrated into covering,
-the first assembly comprises an assembly,
-the first assembly is the combination of several assemblies,
-the first assembly comprises antenna,
-the first assembly comprises circuit board,
-first surface on the outer surface side of coating member,
-first surface is on the interior surface side of coating member.
Thought of the present invention is, the signal arranged in coating member sends and/or receiving unit is connected to from the bus of the flexible part of coating member fork the second assembly not belonging to coating member by sending described signal and comprising.Advantage provided by the invention is, due to the flexible bus agent diverged from coating member, this assembly is easy to be connected to the second assembly.
The thought of the preferred embodiments of the present invention is, between the outer surface that signal transmission bus is arranged at the framework of coating member and the film being fixed to this coating member.Advantage is, bus is easy to be fixed to coating member, and the quantity of bus can be very large, and bus does not need the outward appearance changing coating member.
The thought of the preferred embodiments of the present invention is, signal sends bus and is arranged to the edge extending past framework, thus it extends to its second surface side from the first surface side of the framework of described covering.
Advantage is, the assembly that the not ipsilateral of coating member arranges can be connected to each other.
Accompanying drawing explanation
In the accompanying drawings some embodiments of the present invention will be described in more detail, in the accompanying drawings:
Fig. 1 a is the schematic exploded end view of the coating member of the present invention in partial cross section;
Fig. 1 b is the schematic plan of the conductive bus in Fig. 1 a;
Fig. 1 c is in partial cross section and comprises the schematic side elevation of the electronic equipment of the assembling of the present invention of the coating member be made up of the parts in Fig. 1 a;
Fig. 2 is the perspective schematic view of the second coating member of the present invention;
Fig. 3 a and Fig. 3 b is schematic side elevation and the vertical view of the 3rd coating member of the present invention in partial cross section;
Fig. 4 is the schematic side elevation of the 4th coating member of the present invention in partial cross section;
Fig. 5 is the schematic side elevation of the 5th coating member of the present invention in partial cross section;
Fig. 6 is the schematic side elevation of the 6th coating member of the present invention in partial cross section;
Fig. 7 is the schematic side elevation of the 7th coating member of the present invention in partial cross section;
Fig. 8 a to Fig. 8 c is the schematic partial cross sectional end view of the method for the manufacture of coating member of the present invention;
Fig. 9 is the schematic side elevation of the 8th coating member of the present invention in partial cross section;
Figure 10 is the schematic side elevation of the 9th coating member of the present invention in partial cross section.
In the accompanying drawings, for the sake of clarity, some embodiments of the present invention are simplified and illustrate.The identical label of parts identical in the drawings marks.
Preferred forms
Fig. 1 is the schematic exploded end view of the coating member of the present invention in partial cross section, Fig. 1 b is the schematic plan of the conductive bus arranged in coating member, and Fig. 1 c in partial cross section, comprise the schematic side elevation of the electronic equipment of the assembling of the present invention of the coating member be made up of the parts in Fig. 1 a.
Coating member comprises the framework 1 of injection molding.Manufactured materials is known polymer material itself, and it not only can comprise thermoplastic matrix materials, also can comprise strengthening material, filler etc.Framework can to visible transparent, partially transparent, or opaque.
At injection moulding stage, the film 2 forming the outer surface of coating member is fixed to the outer surface of framework 1.In this case, film 2 embeds film, and it refers to the film of the shape being at least substantially built as mould and final products before being arranged into injection molding die here.This structure realizes typically via hot forming.This kind of technology is called as " mould interior label " (in-mould labelling) or " embedding mould decoration " (insert mould decoration).The manufactured materials of film 2 and method itself are known, therefore can not describe in more detail in this manual.
Film 2 also can be multilayer, and even so it is driving component (activecomponent), comprises the electronic unit be laminated between layer of surface or multilayer.Film so can be used as surface film or be sprayed paint, coating or surface treatment in some other fashion.
Or film 2 can be label film, that is, partly " mould interior label " film.This is a fraction of planar tags of the outer surface only covering coating member or similar label.
Film 2 can also be divert film, namely, " mould-decoration " (in-mould decoration) film, when being arranged in mould, it is plane substantially, and is arranged in injection molding die with the divert film of continuous band-shaped feeding or counterdie (carrier film) by being used between half module (mould half).
Film can be monochromatic or polychrome, and it can have decoration, those films that such as outward appearance changes along with illumination condition and changes, such as, " hide until light " decoration of (hidden till lit).Film 2 can be to visible transparent, partially transparent or nontransparent.In its surface any one or both can be printed, suppress, spray paint or other itself known mode process with some.Film can be single thin film or plural layers, and every layer film has himself operation and decoration task.
Film 2 is fixed to framework 1 in injection molded process, and composition graphs 8a to 8c more specifically describes by this process.But we wish to illustrate in the present context, framework 1 is formed as its shape illustrated in figures ia and ic while it is fixed to the rear surface 7 of film 2.
We also wish to illustrate, by arranging the second film or by spraying paint, printing or some other corresponding mode, film 2 can also be coated further on the outer surface 6 of film 2.In addition, we wish to illustrate, additional parts can be arranged in coating member, to change its outward appearance, sensation, function or some other attribute.In addition, we wish to illustrate, the ratio of the thickness of framework 1 and film 2 of the part dimension of coating member-mainly-be shown as in the drawings is different from reality, to show feature of the present invention better to be understood.
The first surface 8 of framework is on the side of film 2, and surface 9 forms the inner surface of coating member.Element can be added to second surface 9, such as film, conductor, electronics or optical assembly etc.
First assembly 4 is arranged at first surface 8 side, or on the outer surface of framework 1 in this case, and thus it by outside the confined space that coating member is formed.Here, the first assembly 4 sends or receives or namely send the assembly also receiving the signal of telecommunication.
In the embodiments of the invention shown in Fig. 1 a to 1c, the first assembly 4 is arranged in the opening in film 2.First assembly 4 can also be arranged on the outer surface 6 of film, or between film 2 and framework 1, or inner at film 2.
In order to work, the first assembly 4 needs some the buses being suitable for sending the signal of telecommunication, and it is connected to the second assembly of covered structure internal arrangement by it.
The bus needed uses the Connection Element 5 of flexible similar film to realize.This can be such as the electric conductor being called as torsion line (flex).This is flexible electric circuit board, and it is all flexible along its whole length substantially, or rigid-flexible (rigid flex) circuit board, and it has rigidity and flexible part simultaneously.It has the conductive bus 11 of organized side-by-side in the dielectric base 12 be made up of nonconductive plastic material.In the one or both ends of torsion line, adapter can be had bus 11 to be connected at the opposed parts (counter-piece) that can arrange in coupling assembling.This connection also naturally by welding, by conductive glue gummed or can realize in other known mode itself.
Present conductive bus 11 is at first end 13 place of Connection Element 5, and this Connection Element is directly fixed to the first assembly 4, or indirectly, that is, is connected to the connector of formation in framework 1 or film 2 and is connected to the first assembly 4.
Connection Element 5 is arranged to be hidden between framework 1 and film 2, and is fixed to coating member in position at the injection moulding stage of framework 1.Composition graphs 8a to 8c describes by more detail.
Second end 14 of Connection Element 5 is arranged in opening 3 place built in coating member, thus it extends past the edge 15 of the film 2 and framework 1 formed in opening 3.Because Connection Element 5 is whole is flexible, the part extending past edge 15 forms flexible flexible parts 27.This can freely be bent to second surface 9 side of framework; Here, the inside of coating member is bent to.
Described opening 3 is camera openings, and this refers to that it is fabricated protecting window or the camera lens of the camera being mainly used in mobile phone here, and extends past both framework 1 and film 2.Opening 3 can be certain other opening needed for camera naturally; The opening that it can be opening for display or its protecting window build, build for action button, be microphone, earphone, charging adapter or the opening etc. that builds for certain other adapter.
Opening 3 can also be in particular conductive bus 11 and build.Should be noted that film 2 is not to have opening 3; In other words, in order to realize the embodiment shown in Fig. 1 a to 1c, the opening that framework 1 has through it is just much of that.Depend on the object of opening, the part that film extends past opening 3 can be transparent or opaque.
First assembly 4 can also be the assembly sending or receive or both sent also receiving optical signals, and correspondingly, Connection Element 5 can be the bus sending light signal, the photoconductor of such as similar film or similar thin plate or optical fiber.In addition, first assembly 4 can be send or receive or both sent the assembly also receiving electricity and light signal, such as LED, laser, photodiode, detector, photocell, optical sensor, motion detector, display element or certain other surface or assemblies of responding to light.
Here it is noted that the first assembly can be transducer, antenna, switch, belong to the device of the user interface of equipment, such as key, display, microphone, loud speaker, tactile sensor etc.This assembly can be independent assembly, or is integrated into the assembly of film 2 or framework 1, the assembly of such as printing or compacting.
Fig. 1 c shows the electronic equipment of assembling, and wherein the flexible part 27 of Connection Element 5 is bent and is advanced to the inside of coating member through opening 3, is connected to the second assembly at this its second end 14.The second coating member closing described equipment is shown in broken lines.
Here, the second assembly is the mainboard 10 of equipment.Because second end 14 freely of Connection Element 5 basic from edge 15 points diverge to, when equipment is assembled, it can be connected to the second assembly fast and reliably.Connection Element 5 be left certain other assembly that one end freely may be connected to coating member inside naturally, such as auxiliary circuit board, user board for keyboard arrangements, battery or other power supply, control module etc.Connection Element 5 can also be connected to the assembly belonging to another coating member or the assembly being connected to oneself inside of coating member 1.
Have benefited from the arrangement sending bus formation above by opening 3 and signal, can arrange in the outside of framework 1 even need the complicated assembly connected.Meanwhile, avoid manufacture coating member time process little pin and plug.Do not need to build extra hole in coating member 25, may there be adverse influence in this hole to the outward appearance of equipment.Connection Element 5 is so thin, thus visually can not change the outward appearance of coating member 25.Naturally, if need it can be visible.If needed, the mode of the shape of adverse effect can be had superposed to arrange two or more Connection Elements 5 to the aesthetic impression of coating member 25 not formed.
Can also be also fastened to each other by them after this by first framework 1 and film 2 being both modelled as substantially its final form, manufacture coating member 25.Then framework 1 can be manufactured by injection molding, and need not using film 2 as the insert entering mould.
We wish explanation, framework 1 not only can be manufactured by plastics or plastic composite, also can be manufactured by other materials such as metal, or it can be the combination of the parts (such as plastics and metal parts) manufactured by the material belonging to several different materials groups.A benefit of metal allows to manufacture thinner framework 1 and coating member 25 thinner thus.
Other known methods itself, such as drawing method and machining are also the possible manufacture methods of framework 1.
Such as, can use adhesive, heating power, welding and mechanical fastening system that framework 1 is fixed to film 2.This is fixing can be permanent, and in other words, if do not destroy them, framework 1 can not be separated from film 2.This is fixing also can be separable, and in other words, framework 1 can be separated from film 2, and need not destroy them.
Then the configuration of coating member 25 can comprise the step described in Fig. 1 a, and Connection Element 5 can be independent element or be integrated in film 2, thus film 2 is formed by the dielectric base of bus mutual insulating at least partially.
The bus and/or the conductive bus that send light signal can be in turn laminated to film 2 before being fixed to framework 1.Film 2 is preferably embedding film, and described bus was preferably even fixed to this film before this film is built into its measurements of the chest, waist and hips form.Bus can be fixed directly to film, or first they can be fixed to the supporting film being laminated to film 2.
The flexible part 27 of Connection Element can be manufactured to divide from the distal-most edge of film 2 and diverge to, or it can be a part for bus or the supporting film comprising bus, it is separated from film 2, or from thin film separation before the laminar structure be made up of film or photoconductor is fixed to framework 1.If film 2 comprises some layers, the flexible part 27 of Connection Element can be made up of such one deck or more layer or its part.Electronic building brick can be arranged in the layer of plural layers 2 and/or therebetween.
Fig. 2 is the perspective schematic view of a part for the second coating member of the present invention.Coating member 1 comprises the film 2 of the major part at least forming its outer surface, and is injection moulded at rear surface 7 upper frame 3 of film.
First assembly 4 is arranged on the outer surface side of coating member 1.In order to work, this needs the electric conductor being arranged in Connection Element 5.This is arranged to enter coating member, thus its one end extends past edge 15, the edge 15 of film 2 and framework-is now the edges of the external margin forming coating member, and it is fixed to the framework of the second coating member or equipment at assembly process.Such embodiment provides extra benefit, and namely it does not need opening 3.
Fig. 3 a and 3b is the schematic side elevation of the 3rd coating member of the present invention in partial cross section.This Figure only shows the film 2 as embedding film.During manufacture, electric conductor 11 and bonding conductor 11 are integrated into film 2 with the contact surface 16 needed for the first assembly be arranged on the outer surface of coating member.Ledge or protrusion 17 are also structured on film 2, and conductor 11 is arranged on this ledge or protrusion.Protrusion 17 is by the material manufacture identical with other parts of film 2.Film 2 is formed dielectric base disconnected from each other for conductor, and is formed in the overcoat (casing) of all lateral protection conductors 11.It is noted that protrusion 17 is not the definitely necessary feature of the present embodiment.
Protrusion 17 shown in figure is thinner than other parts of film 2, although this is not definitely necessary.Crucial thing is that the protrusion 17 with its conductor 11 is flexible, thus it can be bent in covered structure inside with its conductor.Substitute conductivity conductor or adding as them, nature can use Lightbus.
The present embodiment additionally provides extra advantage, namely avoids during the equipment of coating member (during the injection moulding stage of such as framework 1) and processes independent Connection Element 5.
Imitate the embodiment shown in Fig. 2, the conductivity conductor 11 being integrated into film 2 can also be arranged to the outer peripheral limit through forming coating member naturally.
Fig. 4 is the schematic side elevation of the 4th coating member of the present invention in partial cross section.It illustrates and such as embed by plastics and film 2 framework 1 that film forms, this film is arranged on its first surface 8, and is made up of transparent or transparent at least partly material.The photoconductor 28 of similar film is arranged on the rear surface of film 2.
Film 2 comprises mask 29, and it is at least substantially opaque to light, and builds by such as suppressing or printing.Mask 29 defines zone of action 30 in the film, and the light from photoconductor is delivered to film 2 through it and continues to pass out coating member.
Coating member 25 also has light source, is LED 31 in this case, and the coupler 34 that link 5 is connected to.LED 31 and coupler 34 are fixed to circuit board 32, the conductive bus that this circuit board comprises conductor and is connected to each other.LED is encapsulated in boundary belt (protectivetape), and boundary belt prevents the light transmition from LED local to other except photoconductor 28.Circuit board 32 can be flexible flexible electric circuit board or the rigid flexible circuit board of part flexible, and circuit board 32 can leave from coating member 25 is bending thus, thus it forms Connection Element 5 and flexible part 27 thereof.
We wish independent explanation, make Connection Element 5 not need visible hole or opening through coating member.The solution of this type can be applied to all Connection Elements 5 described in this specification.
Assembly listed above and parts 28 to 34 form the first assembly 4.First assembly is connected to Connection Element 5, and its one end comprises the flexible part 27 that can be connected to the second assembly.Framework 1 is formed a part for dielectric base disconnected from each other for the bus in link 5.Also it is noted that the second assembly does not illustrate in the drawings.
In the equipment of assembling, the second assembly can be positioned at coating member 25 inside or coating member 25 outside.In rear a solution, the first assembly 4 is typically arranged in the inner surface side of framework 1, but in one embodiment of the invention, it is arranged on the outer surface side of framework 1.In a preferred embodiment, the first assembly 4 is arranged in game console, and the second assembly in game controller, or vice versa.Connection Element branches to its outer surface side from coating member 25, and with connecting bus or its part of game console and controller.
Framework 1 by such as on the rear surface of film 2 injection molding manufacture, the first assembly 4 is well from the pressure that environment causes thus.
LED 31 can be arranged on second surface 9 side of framework 1, and photoconductor 28 extends past framework 1 to first surface 8 side thus.
Fig. 5 is the schematic side elevation of the 5th coating member of the present invention in partial cross section.It is noted that framework 1 does not have shown in Figure 5, to simplify the displaying of things.This is alternative to of the embodiment shown in Fig. 4.
First assembly comprises two LED 31 as light source.We wish to illustrate, in this context, the quantity of light source also can more than two.
The first assembly 4 comprising LED 31, conductive bus and coupler is entered film 2 by direct construction, and circuit required is thereon printed or suppress, or with known such as manufacturing from certain other modes of circuit board technology or electronics industry itself.
An advantage of the present embodiment is that independent circuit board 32 becomes unnecessary, can obtain simpler and thinner structure thus.
Connection Element 5 is connected to the first assembly 4 by this way, makes the surface of it and film 2 at a right angle; But this arrangement is not definitely necessary, and the path of the position of Connection Element relative to film 2 and the opposite side to framework thereof is suitably selected in each case.
Fig. 6 is the schematic side elevation of the 6th coating member of the present invention in partial cross section.Generally, this is similar with the coating member 25 shown in Fig. 5, but present LED 31, photoconductor 28, conductive bus, coupler 34 etc., that is, and the first assembly 4, is fabricated or is fixed on independent supporting film 35.
It should be noted that supporting film 35 is illustrated as being separated from film 2, to simplify the displaying of things.
Supporting film 35 can be in turn laminated to film 2, and after this coating member 25 is fabricated by this way, and supporting film 35 is retained between framework and film 2.Supporting film 35 and assembly thereof are formed thus and can be used as entity and be installed in installation module in coating member 25 or its semi-finished product.
The explanation provided together with Fig. 5 is also applicable to the position of Connection Element 5.
Fig. 7 is the schematic side elevation of the 7th coating member of the present invention in partial cross section.Here, the first element 4 is whole to be arranged on second surface 9, and this second surface forms the inner surface of framework 1 and forms whole coating member simultaneously.
In another embodiment of the invention, film 2, such as, embed film, is arranged on the inner surface of coating member 25, and the first element 4 in addition with it; In other words, this embodiment is similar to the embodiment shown in Fig. 5.Supporting film 35 according to Fig. 6 also can be fixed on the inner surface of coating member 25 with its first element 4.
Framework 1 and film 2 by material manufacture transparent at least partly, thus LED 31 launch and the light being directed into photoconductor 28 through them.Film 2 can also be removed.
Usually, can illustrate framework 1 can by spraying paint, printing, suppress, coating, use second plastic layer or other other known corresponding modes itself process with certain.
First element 4 comprises the reflecting element 36 be arranged between photoconductor 28 and circuit board 32, and the outer surface of the light of guiding it into towards coating member reflects by it.
Circuit board 32 can be torsion line, such as, the part from it keeps not being fixed to framework 1 by this way, makes this unfixed part form Connection Element 5 and most important thing, its flexible part i.e., the first element 4 is connected to the second element by this flexible part.Here need repetition, Connection Element 5 comprises at least one signal and sends bus.
Fig. 8 a to 8c is the schematic partial cross sectional end view of the method for the manufacture of coating member of the present invention.Such as, the method can be used to manufacture the coating member according to Fig. 1 c.
Fig. 8 a shows the rear surface 7 that first how Connection Element 5 to be fixed to film 2.This fixing can such as by welding, by use be mechanically connected such as adhesive tape " Velcro " (Velcro), by gluing together such as lamination or adhesive tape (taping) to carry out.
In another embodiment of the present invention shown in Figure 3, Connection Element 5 is integrated into film 2.When using this kind of solution, Connection Element 5 does not need to be fixed to separately film 2 naturally.
Fig. 8 a also show the following step, and wherein, the installation module 21 be made up of film 2 and Connection Element 5 is brought to the mould of opening, or more accurately, is brought to the receiving-member 20 of inserting in the first half module 18.This mould also comprises the second half module 19.
Described receiving-member 20 can comprise housekeeping arrangement initiatively, to guarantee that installation module 21 keeps in place, and such as vacuum suction (vacuum suction) or certain other known corresponding arrangement own.But housekeeping arrangement is not initiatively definitely necessary, because in most of the cases, the interference fit only between mould and installation module 21 is just enough to guarantee that installation module keeps correct position in a mold.
When the correct position of installation module 21 in the first half module 18, close die can be carried out by engaging half module 18,19.Close die cavity 22 shown in Fig. 4 b is built in mould thus.Mould cavity 22 is formalized by the mode needed for the shape of coating member that will manufacture.
The first assembly 4 being fixed to coating member 25 also can be arranged in mould before mould is closed, and is connected to film 2.The most preferably, this completed before film 2 is added in mould.
The second half module 19 shown in Fig. 8 a to 8c comprises insert 23, and it is oppressed the first half module 18 and prevents the plastic material being injected into mould from entering the opening 3 in film 2 and spreading near the second end 14 of Connection Element 5 extending to opening 3.It is how to force it away from its path by being bent into by Connection Element 5 to fold that the magnified partial view of Fig. 8 b shows insert 23.Connection Element 5 has benefited from its flexible structure and can not be damaged by this.Insert 23 can be included in Connection Element 5 when mould closes and be placed the shape-depression or groove that enter at the latest.
In figure 8b, plastic material 26 is injected in mould by feed throughs (feed channel) 24.The plastic material 26 of fusing has entered mould and has filled the clearance spaces in mould cavity 22, and contacts with the rear surface 7 of film 2.Plastic material 26 and thin-film material 2 are selected as coupling, thus plastic material is adhered on film 2 by chemical bond.This adhesion can also only be fixed by physically based deformation, such as form-lock (form locking), or chemical and that physics is fixing combination.If needed, layer of auxiliary material can be added to the inner surface of film 2, thus by brushing thereon, spraying or arrange auxiliary material film to improve adhesion.
The plastic material 26 being injected into mould cavity 22 is cooled down in mould cavity 22 in the own known mode cooled by the cooling device of mould, and being cured as can not forma fluens, and forms the framework 1 of cover part.After plastic material 26 enough cools, mould is opened, and coating member 25 removes from mould.This step is shown in Fig. 8 c.Coating member 25 comprises the framework 1 of injection molding, film 2 and Connection Element 5 fixing between which.
Coating member 25 can be processed further and complete, and such as, by removing possible burr, spraying paint, arranging additional parts etc. to it, coating member 25 has been ready to be installed in electronic equipment afterwards.
In an embodiment of the present invention, installation module 21 also comprises the first assembly 4, and it as previously mentioned then comprise one or more assembly.First assembly 4 can be secured to film 2 by using above-mentioned fixing means.
But the installation module 21 comprising the first assembly 4 is not to comprise film 2.First assembly 4 and Connection Element 5 can be fixed to plastic-substrates, and it forms the main body or basis that are kept together by installation module 21 thus.Such as installation module 21 can be arranged in injection molding die or compression mould by the mode similar with installation module 21 shown in Fig. 8 a, the installation module 21 of this type may be arranged to a part for coating member 25, or it can be pasted in certain known other mode itself or weld or be fixed to prefabricated framework 1.
In an embodiment of the present invention, coating member 25 or at least its framework 1 manufacture by using multicompartment injection molding method.Then first assembly 4 and Connection Element 5 are arranged in the first mould, and they are fixed to the first plastics material part by the first plastic material is injected into mould wherein.First mould is manufactured by this way, makes to be kept being exposed by the first plastic material by the part selected in the first assembly 4 and/or Connection Element 5.Afterwards, the first mould is opened, thus the first plastics material part and be fixed to the first assembly 4 of these parts and Connection Element 5 remains in the first half module.On the position of the second half module of the first mould, the 3rd half module is arranged to close to this mould.Then this mould has clearance spaces wherein, and the second plastic material is injected into wherein.Second plastic material forms the second plastics material part, it encapsulates the first assembly 4 and/or the Connection Element 5 between its oneself and the first plastics material part, but by this way, make the flexible part 27 of Connection Element remain from coating member fork and flexible parts.
Fig. 9 is the schematic side elevation of the 8th coating member of the present invention in partial cross section.
(preferably in injection molding die) film 2 of arranging in the inner surface side that coating member 25 is included in the coating member associated with framework 1.Framework 1 is by plastics manufacture transparent at least partly.Film 2 can also be arranged on the outer surface side of coating member 25.
Such as, film 2 embeds film, and solar cell 37 is by wherein integrated.In this embodiment, solar cell 37 is the solar cells being called as thin-film solar cells, and it is by printing such as ink jet printing or silk screen printing (stencil printing), spraying paint or use certain other covering methods and made in film 2.The operation of thin-film solar cells itself is known, and based on the organic material arranged between the electrode of battery.The example of the advantage of thin-film solar cells it can be arranged on straight surface and curved surface.Have benefited from this, the shape of coating member can not limit the surf zone of solar cell 37.
Solar cell 37 nature can also be another kind of type, such as, based on the solar cell of silicon.
Solar radiation is passed framework 1 and is arrived solar cell 37, and this produces electric energy thus.According to the principle described before in this specification, solar cell 37 is connected to the circuit of equipment by flexible part 27.
Protective layer 38 is arranged at the front side of solar cell 37 on film 2.Protective layer 38 refers to and makes the sightless one deck of solar cell 37 at least partly.Protective layer 38 is optical diffusion layer now.It allows most of light to arrive solar cell 37, but it hides this solar cell at least substantially, thus can not see solar cell easily when checkout facility.Optical diffusion layer can have pattern or other decorative characteristics.
Optical diffusion layer can also be arranged on framework 1, and it can be equal with framework 1 thickness in the front side of solar cell 37 thus, or only form the segment thickness of framework.Some other embodiment of protective layer 38 are, coating painted with translucent paint, varnish etc. or the framework 1 adding pattern (patterned).
In another embodiment of the invention, protective layer 38 comprises one or more layers of certain other attribute changing its color or its outward appearance.The protective layer 38 of this type such as can be implemented as known electrochromism (electrochromic) layer itself.When charging is applied to electrochromic layer, it reversibly changes its color.Necessary charging can by user's activation of equipment or automatic activation without user intervention.The operation of other attributes of this layer of its color of change or its outward appearance can also based on temperature change etc.
In an embodiment of the present invention, protective layer 38 is arranged to as display device, is preferably touch-screen, and such as keyboard can be applied in this.Touch-screen is required can use transparent or very thin conductor to realize to conductor.The contact of the circuit to equipment needed for the operation of protective layer 38 can be realized by such as flexible part 27.
Figure 10 is the schematic side elevation of the 9th coating member of the present invention in partial cross section.This embodiment is different from shown in Fig. 9, is mainly that film 2 arranges between two plastic layers 1a, 1b.These plastic layers 1a, 1b form the framework 1 of coating member 25.The structure example of the type is as built by using two benches injection molding or multicompartment injection molding.In the structure shown in Figure 10, the operation layer film 2 depended on thereon is well protected with from external load etc.
Another difference of embodiment shown in Fig. 9 and Figure 10 is that the latter does not have protective layer 38.Protective layer 38 can be added to the coating member 25 in Figure 10 naturally, and it can save from the coating member Fig. 9.
In some cases, the feature described in the application can to use like that by described, and no matter other features.On the other hand, the feature described in the application can also be combined, to provide different combinations where necessary.
In a word, can illustrate, be that signal sends bus packet containing flexible part according to the feature of the coating member of electronic equipment of the present invention, it is arranged to divide from coating member and diverges to.In addition, can illustrate, the feature of electronic equipment of the present invention is that it has coating member claimed any one of Claim 1-3 7.
Accompanying drawing and associated description are only in order to illustrate thought of the present invention.To those skilled in the art clearly, the invention is not restricted to above-described embodiment, wherein the present invention is described in an illustrative manner, and in the scope of the invention thought defined in following claims, the present invention can have a lot of amendment and different embodiments.

Claims (31)

1. the coating member (25) of electronic equipment, this coating member has
Framework (1), has first surface (8) and the second surface relative with first surface (9),
Described coating member (25) also comprises
First assembly (4), is arranged to transmission and/or Received signal strength, and
Connection Element (5), has the signal being connected to described first assembly (4) and sends bus,
Described Connection Element (5) comprises flexible part (27), and it is arranged to and diverges to from coating member (25) point,
It is characterized in that
Signal sends bus and is arranged to the edge (15) extending past described framework,
The edge (15) of this framework is the outer peripheral edge forming coating member (25), and
Signal sends the framework (1) that bus is integrated into this coating member.
2. coating member as claimed in claim 1, it is characterized in that described first assembly (4) is the assembly sending and/or receive the signal of telecommunication, and described signal sends the bus that bus is the transmission signal of telecommunication.
3. coating member as claimed in claim 1, it is characterized in that described first assembly (4) is the assembly of transmission and/receiving optical signals, and described signal sends the bus that bus is transmission light signal.
4. coating member as claimed in claim 1, it is characterized in that described first assembly (4) is arranged at first surface (8) side, and described signal sends bus is arranged to and extends to second surface (9) side from first surface (8) side, thus described flexible part (27) is arranged to divide from second surface (9) side and diverges to.
5. coating member as claimed in claim 1, it is characterized in that it comprises the film (2) of first surface (8) side being arranged in described framework, and the part that signal sends bus is arranged between the outer surface (6) of framework (1) and described film.
6. coating member as claimed in claim 5, is characterized in that described film (2) embeds film.
7. coating member as claimed in claim 5, is characterized in that described film (2) is label film.
8. coating member as claimed in claim 5, is characterized in that described film (2) is divert film.
9. the coating member as described in any one in claim 5 to 8, is characterized in that described film (2) is plural layers.
10. the coating member as described in any one in Claim 1-3, it is characterized in that described first assembly (4) is arranged on second surface (9) side, and described flexible part (27) is arranged to and branches to this second surface (9) side.
11. coating members as described in any one in Claim 1-3, it is characterized in that described first assembly (4) is arranged between the first (8) and second (9) surface of described framework (1), and described signal sends bus is arranged to and extends to this second surface (9) side, thus flexible part (2) is arranged to and branches to second surface (9) side.
12. coating members as claimed in claim 1, it is characterized in that described signal sends bus is independent assembly, and it comprises conductor (11) and by they dielectric base disconnected from each other (12).
13. coating members as claimed in claim 12, it is characterized in that described signal sends the element that bus is similar film, it is included in the conductor (11) of organized side-by-side in dielectric base (12).
14. coating members as claimed in claim 12, it is characterized in that described signal sends bus is the photoconductor (28) being similar to film.
15. coating members as claimed in claim 13, it is characterized in that described signal sends bus is flexible electric circuit board.
16. coating members as claimed in claim 1, is characterized in that described signal sends another structure member that bus is integrated into this coating member.
17. coating members as claimed in claim 16, is characterized in that described signal sends bus and is integrated into film (2).
18. coating members as claimed in claim 1, is characterized in that described first assembly (4) comprises an assembly.
19. coating members as claimed in claim 1, is characterized in that described first assembly (4) is the combination of some assemblies.
20. coating members as claimed in claim 1, is characterized in that described first assembly (4) comprises antenna.
21. coating members as claimed in claim 1, is characterized in that described first assembly (4) comprises circuit board.
22. coating members as claimed in claim 1, is characterized in that described first surface (8) is positioned at the outer surface of this coating member (25).
23. coating members as claimed in claim 1, is characterized in that described first surface (8) is positioned at the inner surface of this coating member (25).
24. coating members as described in any one in claim 5 to 8, is characterized in that solar cell (37) is arranged in film (2).
25. coating members as claimed in claim 24, is characterized in that described solar cell (37) is thin-film solar cells.
26. coating members as claimed in claim 24, is characterized in that light diffusion protective layer is arranged at the front side of described solar cell (37).
27. coating members as claimed in claim 24, is characterized in that the one deck of other attributes changing its color or its outward appearance is arranged at the front side of described solar cell (37).
28. coating members as claimed in claim 24, is characterized in that display is arranged at the front side of described solar cell (37).
29. coating members as claimed in claim 28, is characterized in that described display is touch-screen.
30. coating members as claimed in claim 1, is characterized in that described first assembly (4) by mold in framework (1).
31. 1 kinds of electronic equipments, is characterized in that it has coating member as claimed in claim 1 (25).
CN201080036722.2A 2009-08-20 2010-08-16 Cover comprising a flexible connecting element for an electronic device Expired - Fee Related CN102484662B (en)

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FI20095860A FI122621B (en) 2009-08-20 2009-08-20 Electronic device and housing part
PCT/FI2010/050633 WO2011020946A2 (en) 2009-08-20 2010-08-16 Electronic device

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WO2011020946A2 (en) 2011-02-24
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FI122621B (en) 2012-04-30
EP2467996A2 (en) 2012-06-27
CN102484662A (en) 2012-05-30
WO2011020946A3 (en) 2011-06-23

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