FR2944876B1 - Procede et systeme pour quantifier une temperature de jonction de composant. - Google Patents

Procede et systeme pour quantifier une temperature de jonction de composant.

Info

Publication number
FR2944876B1
FR2944876B1 FR0952729A FR0952729A FR2944876B1 FR 2944876 B1 FR2944876 B1 FR 2944876B1 FR 0952729 A FR0952729 A FR 0952729A FR 0952729 A FR0952729 A FR 0952729A FR 2944876 B1 FR2944876 B1 FR 2944876B1
Authority
FR
France
Prior art keywords
junction temperature
component junction
quantifying component
quantifying
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0952729A
Other languages
English (en)
Other versions
FR2944876A1 (fr
Inventor
Julien Nicolas Roussel
Herve Cavelan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PSA Automobiles SA
Original Assignee
Peugeot Citroen Automobiles SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Peugeot Citroen Automobiles SA filed Critical Peugeot Citroen Automobiles SA
Priority to FR0952729A priority Critical patent/FR2944876B1/fr
Publication of FR2944876A1 publication Critical patent/FR2944876A1/fr
Application granted granted Critical
Publication of FR2944876B1 publication Critical patent/FR2944876B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
    • G01K7/425—Thermal management of integrated systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR0952729A 2009-04-27 2009-04-27 Procede et systeme pour quantifier une temperature de jonction de composant. Expired - Fee Related FR2944876B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0952729A FR2944876B1 (fr) 2009-04-27 2009-04-27 Procede et systeme pour quantifier une temperature de jonction de composant.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0952729A FR2944876B1 (fr) 2009-04-27 2009-04-27 Procede et systeme pour quantifier une temperature de jonction de composant.

Publications (2)

Publication Number Publication Date
FR2944876A1 FR2944876A1 (fr) 2010-10-29
FR2944876B1 true FR2944876B1 (fr) 2012-12-28

Family

ID=41401668

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0952729A Expired - Fee Related FR2944876B1 (fr) 2009-04-27 2009-04-27 Procede et systeme pour quantifier une temperature de jonction de composant.

Country Status (1)

Country Link
FR (1) FR2944876B1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107329070A (zh) * 2017-06-09 2017-11-07 常州银河电器有限公司 一种快速估算器件高温工作时结温的方法
CN111413604A (zh) * 2018-12-18 2020-07-14 比亚迪股份有限公司 结温估算方法、装置、电机控制器和车辆

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103149521A (zh) * 2013-01-27 2013-06-12 厦门大学 一种太阳能电池热阻测试装置及其测试方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2872644A (en) * 1956-12-10 1959-02-03 Reich Bernard Measurement of transistor thermal resistance
US3253221A (en) * 1962-02-07 1966-05-24 Rca Corp Method of measuring the thermal resistance of a semiconductor device by providing a stabilized temperature difference between the case and a pn junction therein and thereafter obtaining measurements of a temperature sensitive parameter
CA1046646A (fr) * 1975-12-03 1979-01-16 Canadian General Electric Company Limited Controleur de temperature pour jonction de semi-conducteur
EP0451324B1 (fr) * 1989-09-25 1994-06-01 Asea Brown Boveri Ag Commutateur à semi-conducteur
US6039471A (en) * 1996-05-22 2000-03-21 Integrated Device Technology, Inc. Device for simulating dissipation of thermal power by a board supporting an electronic component
GB9614590D0 (en) * 1996-07-11 1996-09-04 Smiths Industries Plc Electrical apparatus
DE19745040C2 (de) * 1997-02-10 2003-03-27 Daimler Chrysler Ag Anordnung und Verfahren zum Messen einer Temperatur
US6149299A (en) * 1997-12-11 2000-11-21 National Semiconductor Corporation Direct temperature sensing of a semiconductor device semiconductor device
GB2337121B (en) * 1998-05-09 2002-07-31 Motorola Ltd Temperature estimation arrangement and method
US7035064B2 (en) * 1998-05-29 2006-04-25 Semikron Elektronik Gmbh Method and circuit arrangement with adaptive overload protection for power switching devices
US6853944B2 (en) * 2002-10-29 2005-02-08 Koninklijke Philips Electronics N.V. Junction temperatures measurements in semiconductor chip package technology
US6888469B2 (en) * 2003-01-02 2005-05-03 Copley Controls Corporation Method and apparatus for estimating semiconductor junction temperature
US7394271B2 (en) * 2004-02-27 2008-07-01 Wells-Cti, Llc Temperature sensing and prediction in IC sockets
US7313500B2 (en) * 2004-11-05 2007-12-25 Schweitzer Engineering Labortories, Inc. Method to increase the maximum allowable ambient temperature rating of an electronic device
FR2901634B1 (fr) * 2006-05-23 2008-08-29 Converteam Sas Procede et dispositif de mesure de temperature de jonction d'un composant electronique.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107329070A (zh) * 2017-06-09 2017-11-07 常州银河电器有限公司 一种快速估算器件高温工作时结温的方法
CN107329070B (zh) * 2017-06-09 2019-07-19 常州银河电器有限公司 一种快速估算器件高温工作时结温的方法
CN111413604A (zh) * 2018-12-18 2020-07-14 比亚迪股份有限公司 结温估算方法、装置、电机控制器和车辆
CN111413604B (zh) * 2018-12-18 2022-01-07 比亚迪股份有限公司 结温估算方法、装置、电机控制器和车辆

Also Published As

Publication number Publication date
FR2944876A1 (fr) 2010-10-29

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