FR2933811B1 - STEAM ETCHING METHOD OF A MATERIAL, FOR DECOMPOSING A DEFINED PART - Google Patents

STEAM ETCHING METHOD OF A MATERIAL, FOR DECOMPOSING A DEFINED PART

Info

Publication number
FR2933811B1
FR2933811B1 FR0854673A FR0854673A FR2933811B1 FR 2933811 B1 FR2933811 B1 FR 2933811B1 FR 0854673 A FR0854673 A FR 0854673A FR 0854673 A FR0854673 A FR 0854673A FR 2933811 B1 FR2933811 B1 FR 2933811B1
Authority
FR
France
Prior art keywords
decomposing
etching method
defined part
steam etching
steam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0854673A
Other languages
French (fr)
Other versions
FR2933811A1 (en
Inventor
Irene Poulet
Emmanuel Issartel
Jean Christophe Brancaz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec SA filed Critical Soitec SA
Priority to FR0854673A priority Critical patent/FR2933811B1/en
Publication of FR2933811A1 publication Critical patent/FR2933811A1/en
Application granted granted Critical
Publication of FR2933811B1 publication Critical patent/FR2933811B1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/32—Polishing; Etching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/40—Concentrating samples
    • G01N1/4044—Concentrating samples by chemical techniques; Digestion; Chemical decomposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change

Landscapes

  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
FR0854673A 2008-07-09 2008-07-09 STEAM ETCHING METHOD OF A MATERIAL, FOR DECOMPOSING A DEFINED PART Expired - Fee Related FR2933811B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0854673A FR2933811B1 (en) 2008-07-09 2008-07-09 STEAM ETCHING METHOD OF A MATERIAL, FOR DECOMPOSING A DEFINED PART

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0854673A FR2933811B1 (en) 2008-07-09 2008-07-09 STEAM ETCHING METHOD OF A MATERIAL, FOR DECOMPOSING A DEFINED PART

Publications (2)

Publication Number Publication Date
FR2933811A1 FR2933811A1 (en) 2010-01-15
FR2933811B1 true FR2933811B1 (en) 2010-09-17

Family

ID=40364459

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0854673A Expired - Fee Related FR2933811B1 (en) 2008-07-09 2008-07-09 STEAM ETCHING METHOD OF A MATERIAL, FOR DECOMPOSING A DEFINED PART

Country Status (1)

Country Link
FR (1) FR2933811B1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330271A (en) * 1995-06-02 1996-12-13 Shin Etsu Handotai Co Ltd Method and device for etching surface of silicon wafer
JPH08321535A (en) * 1996-07-04 1996-12-03 Matsushita Electric Ind Co Ltd Recovery method of impurities
JP3487334B2 (en) * 1998-07-17 2004-01-19 三菱住友シリコン株式会社 Method for analyzing impurities in silicon substrate
JP4514267B2 (en) * 2000-01-11 2010-07-28 富士フイルム株式会社 Impurity extraction method and impurity extraction apparatus for semiconductor substrate
JP3473699B2 (en) * 2001-10-24 2003-12-08 三菱住友シリコン株式会社 Silicon wafer etching method and apparatus and impurity analysis method
JP2008130696A (en) * 2006-11-17 2008-06-05 Shin Etsu Handotai Co Ltd Silicon elimination method for silicon wafer surface, liquid sample extraction method for region under surface layer of silicon wafer, and analysis method for metal impurity in the region

Also Published As

Publication number Publication date
FR2933811A1 (en) 2010-01-15

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Legal Events

Date Code Title Description
CD Change of name or company name

Owner name: SOITEC, FR

Effective date: 20120423

ST Notification of lapse

Effective date: 20140331