FR2914406B1 - Echangeur de chaleur hybride - Google Patents

Echangeur de chaleur hybride

Info

Publication number
FR2914406B1
FR2914406B1 FR0802567A FR0802567A FR2914406B1 FR 2914406 B1 FR2914406 B1 FR 2914406B1 FR 0802567 A FR0802567 A FR 0802567A FR 0802567 A FR0802567 A FR 0802567A FR 2914406 B1 FR2914406 B1 FR 2914406B1
Authority
FR
France
Prior art keywords
heat exchanger
hybrid heat
hybrid
exchanger
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0802567A
Other languages
English (en)
Other versions
FR2914406A1 (fr
Inventor
Charles D Hood
Ioan Sauciuc
Mohammed Tantoush
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dell Products LP
Original Assignee
Dell Products LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dell Products LP filed Critical Dell Products LP
Priority to FR0802567A priority Critical patent/FR2914406B1/fr
Publication of FR2914406A1 publication Critical patent/FR2914406A1/fr
Application granted granted Critical
Publication of FR2914406B1 publication Critical patent/FR2914406B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/0408—Multi-circuit heat exchangers, e.g. integrating different heat exchange sections in the same unit or heat exchangers for more than two fluids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Air-Conditioning For Vehicles (AREA)
FR0802567A 2006-10-13 2008-05-13 Echangeur de chaleur hybride Active FR2914406B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0802567A FR2914406B1 (fr) 2006-10-13 2008-05-13 Echangeur de chaleur hybride

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/580,671 US8453467B2 (en) 2006-10-13 2006-10-13 Hybrid heat exchanger
FR0707125A FR2907201B1 (fr) 2006-10-13 2007-10-11 Echangeur de chaleur hybride
FR0802567A FR2914406B1 (fr) 2006-10-13 2008-05-13 Echangeur de chaleur hybride

Publications (2)

Publication Number Publication Date
FR2914406A1 FR2914406A1 (fr) 2008-10-03
FR2914406B1 true FR2914406B1 (fr) 2015-11-27

Family

ID=38787877

Family Applications (2)

Application Number Title Priority Date Filing Date
FR0707125A Active FR2907201B1 (fr) 2006-10-13 2007-10-11 Echangeur de chaleur hybride
FR0802567A Active FR2914406B1 (fr) 2006-10-13 2008-05-13 Echangeur de chaleur hybride

Family Applications Before (1)

Application Number Title Priority Date Filing Date
FR0707125A Active FR2907201B1 (fr) 2006-10-13 2007-10-11 Echangeur de chaleur hybride

Country Status (9)

Country Link
US (2) US8453467B2 (fr)
CN (2) CN102230684A (fr)
BR (1) BRPI0703896B1 (fr)
DE (1) DE102007048645B4 (fr)
FR (2) FR2907201B1 (fr)
GB (1) GB2442864B (fr)
MY (1) MY149481A (fr)
SG (1) SG142246A1 (fr)
TW (1) TWI386154B (fr)

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US10295229B2 (en) 2015-09-18 2019-05-21 Hamilton Sundstrand Corporation Thermoelectric cooling system
US9968010B2 (en) 2015-12-21 2018-05-08 Dell Products, L.P. Information handling system having flexible chassis block radiators
TWI663903B (zh) * 2015-12-30 2019-06-21 微星科技股份有限公司 熱電致冷模組與包含熱電致冷模組的散熱裝置
US11249522B2 (en) 2016-06-30 2022-02-15 Intel Corporation Heat transfer apparatus for a computer environment
US10077682B2 (en) 2016-12-21 2018-09-18 General Electric Company System and method for managing heat duty for a heat recovery system
CN107763900A (zh) * 2017-11-14 2018-03-06 广州番禺速能冷暖设备有限公司 一种紧凑型壳管式换热器
TWI662402B (zh) * 2018-06-06 2019-06-11 酷碼科技股份有限公司 冷卻系統及水冷排
CN109944806B (zh) * 2019-04-23 2024-08-13 迎新科技(中国)有限公司 并联双泵导液装置及其液冷散热系统
TWM575882U (zh) * 2018-11-22 2019-03-21 訊凱國際股份有限公司 外接式水冷裝置
EP4004923A4 (fr) * 2019-07-31 2023-04-05 Hewlett-Packard Development Company, L.P. Régulation de température de refroidissement thermoélectrique pour systèmes de refroidissement de liquide
US11825628B2 (en) * 2020-08-19 2023-11-21 Baidu Usa Llc Hybrid cooling system for electronic racks
US11849562B2 (en) 2022-02-24 2023-12-19 International Business Machines Corporation Hybrid in-drawer computer equipment cooling device

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Also Published As

Publication number Publication date
CN101175392A (zh) 2008-05-07
FR2907201A1 (fr) 2008-04-18
MY149481A (en) 2013-08-30
GB0719730D0 (en) 2007-11-21
SG142246A1 (en) 2008-05-28
US20080087024A1 (en) 2008-04-17
TW200830982A (en) 2008-07-16
BRPI0703896B1 (pt) 2021-05-25
BRPI0703896A2 (pt) 2010-08-31
TWI386154B (zh) 2013-02-11
DE102007048645A1 (de) 2008-06-05
US9588554B2 (en) 2017-03-07
FR2907201B1 (fr) 2019-08-23
CN102230684A (zh) 2011-11-02
GB2442864A (en) 2008-04-16
DE102007048645B4 (de) 2020-03-12
IE20070734A1 (en) 2008-06-11
FR2914406A1 (fr) 2008-10-03
US20130232995A1 (en) 2013-09-12
GB2442864B (en) 2009-08-19
US8453467B2 (en) 2013-06-04

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