FR2897504B1 - METHOD FOR FASTENING A COMPONENT ON AN ELECTRIC SOLDER PRINTED CIRCUIT BOARD AND CORRESPONDING PRODUCTION LINE - Google Patents

METHOD FOR FASTENING A COMPONENT ON AN ELECTRIC SOLDER PRINTED CIRCUIT BOARD AND CORRESPONDING PRODUCTION LINE

Info

Publication number
FR2897504B1
FR2897504B1 FR0601357A FR0601357A FR2897504B1 FR 2897504 B1 FR2897504 B1 FR 2897504B1 FR 0601357 A FR0601357 A FR 0601357A FR 0601357 A FR0601357 A FR 0601357A FR 2897504 B1 FR2897504 B1 FR 2897504B1
Authority
FR
France
Prior art keywords
fastening
component
circuit board
printed circuit
production line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0601357A
Other languages
French (fr)
Other versions
FR2897504A1 (en
Inventor
Bruno Lefevre
Jean Yves Moreno
Christian Schwartz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Systemes de Controle Moteur SAS
Original Assignee
Valeo Systemes de Controle Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Systemes de Controle Moteur SAS filed Critical Valeo Systemes de Controle Moteur SAS
Priority to FR0601357A priority Critical patent/FR2897504B1/en
Publication of FR2897504A1 publication Critical patent/FR2897504A1/en
Application granted granted Critical
Publication of FR2897504B1 publication Critical patent/FR2897504B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10818—Flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10848—Thinned leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR0601357A 2006-02-16 2006-02-16 METHOD FOR FASTENING A COMPONENT ON AN ELECTRIC SOLDER PRINTED CIRCUIT BOARD AND CORRESPONDING PRODUCTION LINE Active FR2897504B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0601357A FR2897504B1 (en) 2006-02-16 2006-02-16 METHOD FOR FASTENING A COMPONENT ON AN ELECTRIC SOLDER PRINTED CIRCUIT BOARD AND CORRESPONDING PRODUCTION LINE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0601357A FR2897504B1 (en) 2006-02-16 2006-02-16 METHOD FOR FASTENING A COMPONENT ON AN ELECTRIC SOLDER PRINTED CIRCUIT BOARD AND CORRESPONDING PRODUCTION LINE

Publications (2)

Publication Number Publication Date
FR2897504A1 FR2897504A1 (en) 2007-08-17
FR2897504B1 true FR2897504B1 (en) 2015-01-16

Family

ID=36954108

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0601357A Active FR2897504B1 (en) 2006-02-16 2006-02-16 METHOD FOR FASTENING A COMPONENT ON AN ELECTRIC SOLDER PRINTED CIRCUIT BOARD AND CORRESPONDING PRODUCTION LINE

Country Status (1)

Country Link
FR (1) FR2897504B1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2629496A1 (en) * 1976-06-30 1978-01-05 Siemens Ag Connecting component terminals to layered circuits - coats terminal with solder and contacts uncoated surface with gap electrodes
EP0041928A1 (en) * 1980-05-27 1981-12-16 TECHNICONSULT S.r.l. A method to braze by the Joule effect an electroconductive element onto a silk-screen printed support or the like as well as a device and product relating the same
US5948175A (en) * 1996-12-12 1999-09-07 Hughes Electronics Corporation Strap device clamping soldered wires for use in solar cell arrays
JP4143280B2 (en) * 2001-06-01 2008-09-03 日本電気株式会社 Mounting structure, method for manufacturing mounting structure, mask for printing, and printing method

Also Published As

Publication number Publication date
FR2897504A1 (en) 2007-08-17

Similar Documents

Publication Publication Date Title
EP2034806A4 (en) Circuit board device, method for connecting wiring boards, and circuit substrate module device
EP2071907A4 (en) Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board
HK1083000A1 (en) Screening device for electronic subsassemblies on a printed circuit board
EP1945013A4 (en) Multilayer printed wiring board and method for manufacturing same
TWI371997B (en) Printed wiring board and method for manufacturing the same
EP1959717A4 (en) Printed wiring board with component-mounting pin
GB2435378B (en) Multi-layer printed circuit board comprising a through connection for high frequency applications
WO2008082533A3 (en) Low profile surface mount poke-in connector
HK1110826A1 (en) Apparatuses and methods for manipulating droplets on a printed circuit board
EP1895024A4 (en) Copper foil for printed wiring board
PL1734617T3 (en) Connector for printed wiring board
GB2387974B (en) Wrap-around cooling arrangement for printed circuit board
GB2429852B (en) Method and system of electrically connecting multiple printed circuit boards
EP1928218A4 (en) Flexible printed wiring board and method for manufacturing same
AU2003295369A8 (en) Cross connect via for multilayer printed circuit boards
GB2394284B (en) A method and apparatus for detecting missing components from a printed circuit board
TWI341153B (en) Printed wiring board with a pin for mounting a component and an electronic device using the same
DE69926162D1 (en) Device for equipping printed circuit boards with electronic components
FR2907283B1 (en) DEVICE AND METHOD FOR ELECTRICALLY SUPPLYING AT LEAST ONE INDUCTION MACHINE ON BOARD AN AIRCRAFT
GB2390493B (en) Device for temporarily fastening electronic component to circuit board
EP1747704A4 (en) Printed wiring board, manufacturing method and electronic device
FR2897504B1 (en) METHOD FOR FASTENING A COMPONENT ON AN ELECTRIC SOLDER PRINTED CIRCUIT BOARD AND CORRESPONDING PRODUCTION LINE
GB0312150D0 (en) A pallet for supporting a printed circuit board during soldering and a method for soldering a component to the printed circuit board
TW532709U (en) High cycle laminated board fixing device for multi-layer circuit boards
DE10350745A8 (en) Device for fixing a printed circuit board of a refrigerator

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 13

PLFP Fee payment

Year of fee payment: 15

PLFP Fee payment

Year of fee payment: 16

PLFP Fee payment

Year of fee payment: 17

PLFP Fee payment

Year of fee payment: 18