DE2629496A1 - Connecting component terminals to layered circuits - coats terminal with solder and contacts uncoated surface with gap electrodes - Google Patents

Connecting component terminals to layered circuits - coats terminal with solder and contacts uncoated surface with gap electrodes

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Publication number
DE2629496A1
DE2629496A1 DE19762629496 DE2629496A DE2629496A1 DE 2629496 A1 DE2629496 A1 DE 2629496A1 DE 19762629496 DE19762629496 DE 19762629496 DE 2629496 A DE2629496 A DE 2629496A DE 2629496 A1 DE2629496 A1 DE 2629496A1
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Germany
Prior art keywords
solder
gap electrodes
terminal
connection
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19762629496
Other languages
German (de)
Inventor
Dieter Berchtold
Hans Josef Ing Grad Knier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19762629496 priority Critical patent/DE2629496A1/en
Publication of DE2629496A1 publication Critical patent/DE2629496A1/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0004—Resistance soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The metal terminals of components are connected to a layer circuit by current passage across at least two gap electrodes. The respective terminal is coated with solder and subsequently applied with one surface side to the layered circuit. The other surface side of th terminal is brought into contact with the gap electrodes. A current flow is applied across the gap electrodes and the terminal for a maximum period of 100 msec. Preferably eutectic gold tin solder, containing 80% wt. of gold and 20% wt. of tin, is used for soldering. During the process inert gas may be used for complete protection, consisting of hydrogen and nitrogen in volume ratio of 1:9.

Description

Verbinden von Anschlußteilen von Bauelementen mit Schicht-Connect connection parts of components with layered

schaltungen Die Erfindung betrifft ein Verfahren zum Verbinden eines metallischen Anschlußteils eines Bauelements mit einer Schichtschaltung mittels Stromfluß durch wenigstens 2 Spaltelektroden.circuits The invention relates to a method for connecting a metallic connection part of a component with a layer circuit by means of Current flow through at least 2 gap electrodes.

Es sind eine Reihe von Verfähren zur Befestigung der Anschlußteile von Bauelementen an Schichtschaltungen bekannt.There are a number of methods of attaching the fittings of components on layered circuits known.

Ein besonders häufig verwendetes Verfahren ist die Befestigung der Anschlußteile durch Thermokompression. Bei diesem Verfahren treten bei der Befestigung der Anschlußteile Schwierigkeiten auf, da die aufzubringenden Kräfte und Temperaturen zu einer Gefährdung der Bauelemente und Schichtschaltung führen. Weitere häufig verwendete Verfahren sind das Widerstandsschweißen, das Spaltschweißen und verschiedene Lötverfahren wie Einzellöten, Reflowlöten und das Impulslöten. Von diesen Verfahren zeigt das sog. Spaltschweißen mittels 2 durch einen Spalt voneinander getrennter sogenannter Spaltelektroden den Vorteil, daß ohne Anwendung eines Flußmittels und ohne eine zusätzliche Heizung des Substrates zuverlässige Verbindungen hergestellt werden können, nachteilig ist jedoch die geringe Festiglteit, die sich aus der kleinen räumlichen Ausdehnung der Verbindwgszone ergibt. Bei der Verwendung von Lötverfahren ist zu beachten, daß im Hinblick auf später notwendig werdende Lötprozesse ein Lot verwendet wird, das erst oberhalb üblicher Löttemperaturen schmilzt, gleichzeitig aber wegen eventueller vorhergegangener Lötprozesse auf eine zusätzliche Erhitzung des Substrates verzichtet werden muß. Im Falle der Verwendung von ungt schützten Halbleitern ergibt sich außerdem die Forderung nach einer flußmittelfreien Lötung, da sonst mit einer Erhöhung der Sperrströme bis zur Unbrauchbarkeit bei den verwendeten Halbleitern gerechnet werden#muß.A particularly frequently used method is the attachment of the Connection parts by thermocompression. This procedure occurs when fastening the connecting parts on difficulties because of the forces and temperatures to be applied lead to a hazard to the components and layer circuit. More often methods used are resistance welding, gap welding and various Soldering methods such as single soldering, reflow soldering and pulse soldering. From these procedures shows the so-called gap welding by means of 2 separated from one another by a gap So-called gap electrodes have the advantage that without using a flux and Reliable connections are established without additional heating of the substrate can be, but the disadvantage is the low Festiglteit, which results from the small spatial Expansion of the connecting zone results. When using When it comes to soldering processes, it is important to note that with a view to later requirements Soldering processes a solder is used that only melts above normal soldering temperatures, but at the same time because of any previous soldering processes on an additional one Heating of the substrate must be dispensed with. In the case of using ungt Protected semiconductors also result in the requirement for a flux-free Soldering, otherwise with an increase in the reverse currents to the point of uselessness the semiconductors used must be expected #.

Aufgabe der Erfindung ist es also, ein möglichst universell einsetzbares Verfahren zum Verbinden der Anschlußelemente von Bauelenenten mit Schichtschaltungen zu finden, das bei Verzicht auf eine Vorheizung von Substraten die Verwendung hochschmelzender Lote ohne zusätzliche Verwendung von Flußmittels gestattet und dabei eine ausreichend feste Verbindung ergibt.The object of the invention is therefore to provide a system that can be used as universally as possible Method for connecting the connection elements of components with layered circuits to find the use of refractory melting points when there is no need to preheat substrates Solders are permitted without the additional use of flux, and one is sufficient solid connection results.

Erfindungsgemäß wird die Aufgabe dadurch gelöst, daß das Anschlußteil mit einem Lot bedeckt wird und anschließend mit einer Oberflächenseite auf die Schichtschaltung gebracht wird, Baß die andere Oberflächenseite mit den Spaltelektroden in Berührung gebracht wird und daß durch die Spaltelektroden und das Anschlußteil für eine Zeitdauer von höchstens 100 msec, vorzugsweise aber für wenige Millisekunden, ein Stromfluß erzeugt wird. Das erfindungsgemäße Verfahren stellt also eine neuartige Kombination von Löt- und Schweißverfahren dar, es bietet als besondere Vorteile die hohe Festigkeit und Gleichmäßigkeit der Verbindungen, die gute Reproduzierbarkeit des Verbindungs- verfahrens die mit Hilfe des Elektrodenabstandes gut begrenzbarer Lötfläche, die Verwendung von extrem kurzen Lötzeiten und von unterschiedlichen Anschlußmaterialien sowie relativ dicken Bändern und die Sicherheit, daß keine Iluflösung der Goldbeschichtung auf den Leiterbahnen und den Anschlußelementen auftritt. Eine bevorzugte Variante des Verfahrens nach der Erfindung ergibt sich durch die Verwendung von Gold-Zinnlot vnd dadurch, d# die Vebindung unter einer Inertgasdusche vorgenommen wird, bei einerweiteren Variante der Erfindung wird die Verbindung unter einer Formiergas-Atmosphäre vorgenommen. Weitere Ausgestaltungen des Verfahrens nach der Erfindung ergeben sich dadurch, daß die zu kontaktierenden Anschlußbänder durch Tauchen in einem Gold-Zinnbad mit einer Lotschicht vorbeschichtet werden oder daß Formteile aus einer Gold-Zinn Folie zwischen die zu verbindenden Teile gebacht wird.According to the invention the object is achieved in that the connecting part is covered with a solder and then with one surface side on the layer circuit the other surface side is brought into contact with the gap electrodes is brought and that through the gap electrodes and the connector for a period of time of a maximum of 100 msec, but preferably for a few milliseconds, a current flow is produced. The method according to the invention therefore represents a novel combination of soldering and welding processes, it offers the special advantages of high strength and uniformity of the connections, the good reproducibility of the connection procedure the soldering surface, which can be easily limited with the aid of the electrode spacing, the use extremely short soldering times and different connection materials as well relatively thick ribbons and the assurance that the gold coating will not dissolve occurs on the conductor tracks and the connection elements. A preferred variant of the method according to the invention results from the use of gold-tin solder and by making the connection under an inert gas shower, with another In a variant of the invention, the connection is made under a forming gas atmosphere. Further refinements of the method according to the invention result from that the connection strips to be contacted by dipping in a gold-tin bath with a layer of solder or that molded parts made of a gold-tin foil is brought between the parts to be connected.

Die Erfindung soll im folgenden anhand der Zeichnung näher erläutert werden.The invention is explained in more detail below with reference to the drawing will.

Die Zeichnung zeigt die während des Verbindens bestehende Anordnung aus dem Substrat 1 mit der Leiterbahn 2 und den Spaltelektroden 3 sowie mit dem dazwischen befindlichen Anschlußelement 5 mit einer Tauchverzinnung 4, die aus einem Gold-Zinnlot 80/20 besteht. Zusätzlich wird der Verbindungsstelle ein aus Wasserstoff und Stickstoff im Volumenverhältnis 1:9 bestehendes Formiergas zugeführt.The drawing shows the existing arrangement during connection from the substrate 1 with the conductor track 2 and the gap electrodes 3 as well as with the intermediate connecting element 5 with a dip tinning 4, which consists of a 80/20 gold-tin solder. In addition, the junction is made of hydrogen and nitrogen in a volume ratio of 1: 9 existing forming gas is supplied.

Das aus der bekannten Legierung Vacon 20 bestehende Anschlußelement 5 wurde vor dem Verbinden in einem Reinigunsbad vorbehandelt, anschließend durch Tauchverzinnen mit einer Gold-Zinnschicht 4 überzogen, während die auger Leiterbahn 2 vorgesehene Lötfläche nicht vorbehandelt werden muß. Nach dem Aufbringen der beiden Verbindungselemente erfolgt ein Andrücken durch die Spalt-elektroden 3, wobei die zu verwendenden Kräfte unkritisch sind, da sie nicht zur Einleitung der Verbindung dienen, sondern lediglich zur Sicherung des ohmschen Kontaktes zwischen der Spaltelektrode und dem zu verbindenden Material. Anschließend wird für eine kurze Zeit, die zwischen wenigen Millisekunden und etwa 100 msec liegen kann, ein Schweißstromgenerator mit den beiden Spaltelektroden verbunden, so daß sch ein Stromfluß über die Spaltelektroden 3 und das Anschlußelement 5 ergibt. Durch das Aufschmelzen der Lotschicht 4 ergibt sich eine großflächige Verbindung zwischen dem Anschlußelement 5 und der Leiterbahn 2, die eine hochfeste Verbindung ergibt. Trotz der sehr kurzen Lötzeiten ergab sich eine sehr gute Benetzung, was durch Messung des Ubergangswiderstandes und durch Lösen bzw. Abätzen der Verbindung bestätigt werden konnte. Auch zeigte die an derartigen Verbindungen durchgeführte künstliche äderung kein wesentliches Abfallen der vorher festgestellten günstigen Werte.The connection element consisting of the well-known Vacon 20 alloy 5 was pretreated in a cleaning bath before joining, then through Dip tinning coated with a gold-tin layer 4, while the outer conductor track 2 intended soldering surface does not have to be pretreated. After applying the two Fasteners the gap electrodes are pressed against it 3, whereby the forces to be used are not critical, since they are not used for initiation serve the connection, but only to secure the ohmic contact between the gap electrode and the material to be connected. Then for a short time, which can be between a few milliseconds and about 100 msec Welding current generator connected to the two gap electrodes, so that there is a current flow via the gap electrodes 3 and the connection element 5 results. By melting it the solder layer 4 results in a large-area connection between the connection element 5 and the conductor track 2, which results in a high-strength connection. Despite the very short Soldering times resulted in a very good wetting, which was demonstrated by measuring the contact resistance and could be confirmed by loosening or etching off the connection. Also showed the artificial veining carried out on such connections is not essential Decline in the previously determined favorable values.

Weitere Versuche ergaben die Möglichkeit, das relaitv teuere Gold-Zinnlot durch ein allerdings etwas weniger feste Verbindungen ergebendes Blei-Zinn-Lot zu ersetzen.Further attempts showed the possibility of the relatively expensive gold-tin solder by a lead-tin solder, which however results in a somewhat less firm connection substitute.

5 Patentansprüche 1 Figur5 claims 1 figure

Claims (5)

P a t e n t a n s p r ü c h e Verfahren zum Verbinden eines metallischen Anschlußteiles von Bauelementen mit einer Schichtschaltung mittels Stromfluß durch wenigstens zwei Spaltelektroden, d a -d u r c h g e k e n n z e i c h n e t , daß das Anschlußteil mit einem Lot bedeckt wird und anschliuend mit einer Oberflächenseite auf die Schichtschaltung gebracht wird, daß die andere Oberflächenseite mit den Spaltelektroden in Berührung gebracht wird und daß durch die Spaltelektroden und das Anschlußteil für eine Zeitdauer von höchstens 100 msec,vorzugsweise aber für wenige Millisekunden, ein Stromfluß erzeugt wird.P a t e n t a n s p r ü c h e Method for joining a metallic Connection part of components with a layer circuit by means of current flow through at least two gap electrodes, d a -d u r c h e k e n n n n z e i c h n e t that the connection part is covered with a solder and then with a surface side is brought to the layer circuit that the other surface side with the Gap electrodes is brought into contact and that by the gap electrodes and the connector for a period of at most 100 msec, but preferably for a few milliseconds, a current flow is generated. 2. Verfahren nach Anspruch 1, d a d u r c h g e k e n n -z e i c h n e t , daß es sich bei dem Lot um ein eutektisches Gold-Zinnlot mit 80 Gewichtsprozent Gold und 20 Gewichtsprozent Zinn handelt. 2. The method according to claim 1, d a d u r c h g e k e n n -z e i c Not that the solder is a eutectic gold-tin solder with 80 percent by weight Gold and 20 percent by weight tin. 3. Verfahren nach Anspruch 1, d a d u r c h g e k e n n -z e i c h n e t , daß über die zu verbindenden Teile wenigstens während des Verbindens ein inertes Gas geleitet wird.3. The method according to claim 1, d a d u r c h g e k e n n -z e i c h n e t that about the parts to be connected at least during the connection inert gas is passed. 4. Verfahren nach Anspruch 1, d a d u r c h g e k e n n -z e i c h n- e t , daß über die zu verbindenden Teile wenigstens während des Verbindens ein vorzugsweise aus Wasserstoff und Stickstoff im Volumenverhältnis von 1:9 bestehendes Formiergas geleitet wird.4. The method according to claim 1, d a d u r c h g e k e n n -z e i c h n- e t that about the parts to be connected at least during the connection preferably consisting of hydrogen and nitrogen in a volume ratio of 1: 9 Forming gas is passed. 5. Verfahren nach Anspruch 1 und 2, d a d u r c h g e k e n n z e i c h n e t ,daß das Lot als Formteil an das zu verbindende Anschlußteil gebracht wird.5. The method according to claim 1 and 2, d a d u r c h g e k e n n z e i c h n e t that the solder brought as a molded part to the connecting part to be connected will.
DE19762629496 1976-06-30 1976-06-30 Connecting component terminals to layered circuits - coats terminal with solder and contacts uncoated surface with gap electrodes Pending DE2629496A1 (en)

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DE19762629496 DE2629496A1 (en) 1976-06-30 1976-06-30 Connecting component terminals to layered circuits - coats terminal with solder and contacts uncoated surface with gap electrodes

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DE19762629496 DE2629496A1 (en) 1976-06-30 1976-06-30 Connecting component terminals to layered circuits - coats terminal with solder and contacts uncoated surface with gap electrodes

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0041928A1 (en) * 1980-05-27 1981-12-16 TECHNICONSULT S.r.l. A method to braze by the Joule effect an electroconductive element onto a silk-screen printed support or the like as well as a device and product relating the same
DE3406542A1 (en) * 1984-02-23 1985-08-29 Telefunken electronic GmbH, 7100 Heilbronn Process for fabricating a semiconductor component
FR2897504A1 (en) * 2006-02-16 2007-08-17 Valeo Sys Controle Moteur Sas Electronic component e.g. power component, soldering method for electronic module, involves positioning electronic component on printed circuit board and fusing solder joint by circulating electric current in pins of component to heat pins
EP2234749B1 (en) * 2007-12-14 2020-02-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for producing a soldered connection between two components

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0041928A1 (en) * 1980-05-27 1981-12-16 TECHNICONSULT S.r.l. A method to braze by the Joule effect an electroconductive element onto a silk-screen printed support or the like as well as a device and product relating the same
DE3406542A1 (en) * 1984-02-23 1985-08-29 Telefunken electronic GmbH, 7100 Heilbronn Process for fabricating a semiconductor component
FR2897504A1 (en) * 2006-02-16 2007-08-17 Valeo Sys Controle Moteur Sas Electronic component e.g. power component, soldering method for electronic module, involves positioning electronic component on printed circuit board and fusing solder joint by circulating electric current in pins of component to heat pins
EP2234749B1 (en) * 2007-12-14 2020-02-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for producing a soldered connection between two components

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