WO2003097287A1 - Method for joining a part to be joined to a counterpart using an alloy containing silver and copper constituents - Google Patents

Method for joining a part to be joined to a counterpart using an alloy containing silver and copper constituents Download PDF

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Publication number
WO2003097287A1
WO2003097287A1 PCT/DE2003/001321 DE0301321W WO03097287A1 WO 2003097287 A1 WO2003097287 A1 WO 2003097287A1 DE 0301321 W DE0301321 W DE 0301321W WO 03097287 A1 WO03097287 A1 WO 03097287A1
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WO
WIPO (PCT)
Prior art keywords
layer
copper
joining
silver
counterpart
Prior art date
Application number
PCT/DE2003/001321
Other languages
German (de)
French (fr)
Inventor
Roman Renz
Klaus Gessner
Lutz Kellmann
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2003097287A1 publication Critical patent/WO2003097287A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/004—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a metal of the iron group
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent

Definitions

  • the invention relates to a method for joining a joining part with a counterpart by means of an alloy having silver and copper components, in which at least one metal layer is applied to the stainless steel part before joining, and a joining process under vacuum or a protective gas atmosphere at a temperature between 650 and 850 ° C is carried out.
  • Such a method is already known from DE 40 26 394 C2.
  • the method disclosed there serves to produce a soldering connection between beryllium and stainless steel or beryllium and nickel, the connection of these parts being brought about by an alloy containing silver and copper components.
  • a thin metal layer is applied to the stainless steel surface, which consists of a noble metal, the noble metal used being completely miscible with the alloy containing silver-copper components.
  • the soldering process is then carried out at a temperature between 650 ° C and 750 ° C.
  • a disadvantage of the aforementioned method is that an additional solder must be arranged in the connection area between the parts to be connected to one another during the actual soldering process.
  • a 0.2 mm thick foil is therefore placed as solder at the soldering point and the soldering process is then carried out at a temperature between 650 and 750 ° C. It is also known to produce a contact arrangement for a vacuum interrupter by soldering a contact carrier to a contact piece, a solder material being arranged between these joining parts and melting in a vacuum, the joining parts being pressed against one another.
  • DE 199 02 500 AI discloses a method for producing a contact arrangement for a vacuum holding tube, in which the contact piece is pressed flat against the contact carrier directly before assembly. Before the actual joining process, which is carried out at high temperatures, the solder material is arranged directly adjacent to the gap, so that the solder material is melted under vacuum by supplying heat and penetrates into the gap between the contact carrier and contact piece in the liquid state. With this method, too, the appropriate positioning of the solder with respect to the connection points of the components to be joined is complex and cost-intensive in view of the precise design of the parts to be joined.
  • the object of the invention is therefore to improve the method mentioned at the outset so that an expensive positioning of a separate solder at the connection point of the parts to be joined or a complex design of the parts to be held together to hold the parts to be joined when assembling is superfluous.
  • the invention achieves this object in that a silver layer is applied to the joining part and a copper layer is applied to the counterpart, or in that a silver layer is applied to the joining part and the counterpart consists of copper, the joining part and the counterpart being used to form the Contain silver and copper Alloy are in contact with each other during the joining process.
  • the invention achieves the object in that a copper layer and a silver layer are applied to the joining part, the joining part and the counterpart being joined together by the alloy containing silver and copper components being in contact with one another during the joining process.
  • the metals required to form the alloy are applied as firmly adhering layers to the joining part before the actual joining process, which is carried out at high temperatures and under a vacuum or a protective gas atmosphere.
  • a vacuum or a protective gas atmosphere For example, nitrogen, argon or the like can be used as the protective gas.
  • the shielding gas used should advantageously have a low dew point.
  • the pressure of the vacuum is expediently not greater than 10 "4 mbar.
  • a complex positioning of a separate solder during the joining process, for example in the form of a film, is thus dispensed with and simplifies the joining process.
  • the alloy required for connecting the joining parts is formed by diffusion and melting the applied metal layers or the surface layer of a counterpart made of copper.
  • the copper and silver layers can expediently be arranged directly adjacent to one another during the joining process.
  • the silver layer is applied as the outermost layer on a copper layer or swept a copper layer as the outermost layer on one
  • a further third metal layer for example a titanium layer, can be applied between the layers of silver and copper.
  • the third metal layer would then be an outermost layer, which would be formed either on the silver layer of the joining part or on the copper layer of the counterpart.
  • the third metal layer would be applied between the silver layer and the copper layer. The one developing in these cases
  • alloy contains not only silver and copper parts but also parts of the third metal.
  • the temperatures set during the joining process are below the melting temperatures of silver and copper, which are 961 ° C for silver and 1083 ° C for copper. During the joining process, there is therefore a diffusion-related mixing of silver and copper and possibly the third metal before the layers melt.
  • Such alloys have a reduced melting point compared to pure metals.
  • the melting point of an alloy consisting only of silver and copper assumes its lowest value at approximately 780 ° C. If the temperatures set during the joining process at the contact point between the joining parts are in the range of 780 ° C., liquid phases with a composition of the copper-silver eutectic are therefore preferably generated.
  • the counterpart consists of copper or has a copper layer applied before the joining process.
  • the counterpart is by no means necessary that the counterpart is made of copper. More appropriate
  • Manufacturing materials of the counterpart are, for example
  • the invention in particular simplifies the manufacturing process of vacuum interrupters, since in these cases, on the one hand, high demands are placed on the connection points between the joining part and the counterpart, on the other hand the mutual holding of the joining parts to one another and the additional solder arrangement are made more difficult due to the complex structure of the joining parts.
  • connections according to the invention are formed only in the immediate vicinity of the applied layers or at the contact point of the parts to be joined. According to the invention, there is no running of an external solder into a contact gap.
  • the silver layer is applied as an outermost layer on a copper layer.
  • an outermost layer is to be understood as the layer which is applied as the last layer before the joining process under vacuum or under protective gas and temperatures in the range of the melting point of the alloy to the joining part or the counterpart and which is facing and in contact with the counterpart or the joining part during the joining process.
  • the copper layer and the silver layer are arranged adjacent to one another during the joining process. The formation of an alloy consisting solely of silver and copper is therefore preferred.
  • the counterpart consists of copper or a copper layer has, the silver layer with a thickness of 10 to
  • the setting of the thickness of the silver layer depends on the selected application method and can be set, for example, in the case of galvanic processes via the current density and the duration. In the context of the invention, however, the metal layer can also be applied by rolling on a metal foil of the desired thickness or by flame spraying.
  • the copper layer and the silver layer are applied with a thickness of 10-100 ⁇ m.
  • the setting of the respective layer thickness depends on the application method chosen in each case. According to the invention, however, it is by no means necessary for the layer thicknesses of the silver and copper layers to be the same. Rather, the procedural adjustment of the layer thickness should take place with regard to the desired composition of the alloy. For example, if an alloy containing only silver and copper parts is to be produced, the composition of which corresponds to the eutectic, the ratio of the layer thicknesses should essentially correspond to the mixing ratio of the metals in the eutectic. In this sense, it would be advantageous, for example, to apply an approximately 70 ⁇ m thick silver layer and an approximately 30 ⁇ m copper layer.
  • a gold layer for activating the stainless steel part is applied as the innermost metal layer in both variants of the invention.
  • the gold layer is applied first and directly to the joining part or the counterpart, which is then advantageously made of stainless steel. Deviating from this However, activation with other layers, for example a nickel layer, is also possible.
  • the gold layer has a thickness between 0.2 ⁇ m and 10 ⁇ m.
  • All metal layers are expediently applied galvanically.
  • Other application methods are carried out, for example, by rolling a metal foil or flame spraying the desired metals.
  • the joining part is a stainless steel part.
  • a stainless steel part is degreased, subjected to a suitable cleaning process and finally rinsed with water. This is followed by the application of a 1 ⁇ m gold layer to activate the surface of the stainless steel by immersing it in a commercially available gold bath under electrolysis conditions. After rinsing again with water, a 20 ⁇ m thick silver layer is applied by immersing it in a commercially available silver bath under electrolysis conditions.
  • the stainless steel part pretreated in this way is then brought together with a copper part and the joining parts are exposed to a vacuum of less than 10 ⁇ 4 mbar, the temperature being set to the working temperature of the copper-silver eutectic.
  • a vacuum less than 10 ⁇ 4 mbar
  • the temperature being set to the working temperature of the copper-silver eutectic.
  • a 1 ⁇ m thick gold layer, then a 30 ⁇ m thick copper layer and finally a 70 ⁇ m thick silver layer are applied to the stainless steel part as a joining part, as described above. This is followed by several rinsing processes.
  • the coated stainless steel part and an uncoated stainless steel part are exposed to a vacuum of less than 10 ⁇ 4 mbar and the working temperature of the silver-copper eutectic, which are in contact with one another during this joining process, so that the melting of the Copper and silver layer and their diffusion-related mixing an alloy is formed with the composition of the copper-silver eutectic.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

The invention relates to a method for joining a part to be joined to a counterpart by means of an alloy containing silver and copper constituents. According to the invention, at least one metal layer is applied to the part to be joined before joining it, and a joining process is carried out in a vacuum or in a protective gas atmosphere and at a temperature ranging from 650 °C and 900 °C. The aim of the invention is render a complicated positioning of a separate solder on the junction point of the parts to be joined or a complicated design of said parts of the molten solder or a joining alloy unnecessary. To this end, a silver layer is applied to the part to be joined and a copper layer is applied to the counterpart or a silver layer is applied to the part to be joined and the counterpart is comprised of copper. The part to be joined and the counterpart are placed in contact with one another during a joining process in order to form the alloy that contains silver and copper constituents. Another embodiment of the invention involves applying a copper layer and a silver layer to the part to be joined, and the part to be joined and the counterpart are placed in contact with one another during the joining process in order to join them by means of the alloy that contains silver and copper constituents.

Description

VERFAHREN ZUM ZUSAMMENFUGEN EINES FUGETEILS MIT EINEM GEGENSTUCK MIT EINER SILBER- UND KUPFERANTEILE ENTHALTENDEN LEGIERUNG METHOD FOR JOINING A JOINT WITH A COUNTERPIECE WITH AN ALLOY CONTAINING SILVER AND COPPER
Beschreibungdescription
Die Erfindung betrifft ein Verfahren zum Zusammenfügen eines Fügeteils mit einem Gegenstück mittels einer Silber- und Kupferanteile aufweisenden Legierung, bei dem zumindest eine Metallschicht vor dem Zusammenfügen auf das Edelstahlteil auf- gebracht wird und ein Fügevorgang unter Vakuum oder einer Schutzgasatmosphäre bei einer Temperatur zwischen 650 und 850°C durchgeführt wird.The invention relates to a method for joining a joining part with a counterpart by means of an alloy having silver and copper components, in which at least one metal layer is applied to the stainless steel part before joining, and a joining process under vacuum or a protective gas atmosphere at a temperature between 650 and 850 ° C is carried out.
Ein solches Verfahren ist aus der DE 40 26 394 C2 bereits be- kannt. Das dort offenbarte Verfahren dient zur Herstellung einer löttechnischen Verbindung zwischen Beryllium und Edelstahl oder Beryllium und Nickel, wobei die Verbindung dieser Teile durch eine Silber- und Kupferanteile enthaltende Legierung herbeigeführt wird. Vor dem Löten der genannten Bauteile wird auf die Edelstahloberfläche eine dünne Metallschicht aufgebracht, die aus einem Edelmetall besteht, wobei das verwendete Edelmetall mit der Silber- Kupferanteile enthaltenden Legierung vollständig mischbar ist. Der Lötvorgang wird dann bei einer Temperatur zwischen 650°C und 750°C durchgeführt. Nachteilig bei dem vorgenannten Verfahren ist jedoch, dass beim eigentlichen Lötvorgang ein zusätzliches Lot im Verbindungsbereich zwischen den miteinander zu verbindenden Teilen angeordnet werden muss. Als Lot wird daher eine 0,2 mm dicke Folie an der Lotstelle platziert und der Lötvorgang anschlie- ßend bei einer Temperatur zwischen 650 und 750°C durchgeführt . Weiterhin ist bekannt, zur Herstellung einer Kontaktanordnung für eine Vakuumschaltröhre einen Kontaktträger mit einem Kontaktstück zu verlöten, wobei zwischen diesen Fügeteilen ein Lotmaterial angeordnet und im Vakuum zum Schmelzen gebracht wird, wobei die Fügeteile gegeneinander gepresst werden.Such a method is already known from DE 40 26 394 C2. The method disclosed there serves to produce a soldering connection between beryllium and stainless steel or beryllium and nickel, the connection of these parts being brought about by an alloy containing silver and copper components. Before soldering the components mentioned, a thin metal layer is applied to the stainless steel surface, which consists of a noble metal, the noble metal used being completely miscible with the alloy containing silver-copper components. The soldering process is then carried out at a temperature between 650 ° C and 750 ° C. A disadvantage of the aforementioned method, however, is that an additional solder must be arranged in the connection area between the parts to be connected to one another during the actual soldering process. A 0.2 mm thick foil is therefore placed as solder at the soldering point and the soldering process is then carried out at a temperature between 650 and 750 ° C. It is also known to produce a contact arrangement for a vacuum interrupter by soldering a contact carrier to a contact piece, a solder material being arranged between these joining parts and melting in a vacuum, the joining parts being pressed against one another.
Aus der DE 199 02 500 AI ist ein Verfahren zum Herstellen einer Kontaktanordnung für eine Vakuumsehaltröhre offenbart, bei dem das Kontaktstück vor dem Zusammenfügen unmittelbar flächig gegen den Kontaktträger angedrückt wird. Dabei wird das Lotmaterial vor dem eigentlichen Fügevorgang, der bei hohen Temperaturen durchgeführt wird, unmittelbar an den Spalt angrenzend angeordnet, so dass unter Vakuum durch Zufuhr von Wärme das Lotmaterial aufgeschmolzen wird und im flüssigen Zustand in den Spalt zwischen Kontaktträger und Kontaktstück eindringt. Auch bei diesem Verfahren ist die zweckmäßige Positionierung des Lotes bezüglich der Verbindungsstellen der zusammenzufügenden Bauteile aufwendig und im Hinblick auf die passgenaue Ausgestaltung der Fügeteile kostenintensiv.DE 199 02 500 AI discloses a method for producing a contact arrangement for a vacuum holding tube, in which the contact piece is pressed flat against the contact carrier directly before assembly. Before the actual joining process, which is carried out at high temperatures, the solder material is arranged directly adjacent to the gap, so that the solder material is melted under vacuum by supplying heat and penetrates into the gap between the contact carrier and contact piece in the liquid state. With this method, too, the appropriate positioning of the solder with respect to the connection points of the components to be joined is complex and cost-intensive in view of the precise design of the parts to be joined.
Aufgabe der Erfindung ist es daher, das eingangs genannte Verfahren dahin zu verbessern, eine aufwendige Positionierung eines separaten Lotes an der Verbindungsstelle der Fügeteile oder eine aufwendige Ausgestaltung der Fügeteile zur gegen- seitigen Halterung der Fügeteile beim Zusammenfügen überflüssig zu machen.The object of the invention is therefore to improve the method mentioned at the outset so that an expensive positioning of a separate solder at the connection point of the parts to be joined or a complex design of the parts to be held together to hold the parts to be joined when assembling is superfluous.
Die Erfindung löst diese Aufgabe gemäß einer ersten Variante dadurch, dass auf das Fügeteil eine Silberschicht und auf das Gegenstück eine Kupferschicht aufgebracht werden oder dass auf das Fügeteil eine Silberschicht aufgebracht wird und das Gegenstück aus Kupfer besteht, wobei das Fügeteil und das Gegenstück zur Ausbildung der Silber- und Kupferanteile enthal- tenden Legierung beim Fügevorgang in Kontakt miteinander sind.According to a first variant, the invention achieves this object in that a silver layer is applied to the joining part and a copper layer is applied to the counterpart, or in that a silver layer is applied to the joining part and the counterpart consists of copper, the joining part and the counterpart being used to form the Contain silver and copper Alloy are in contact with each other during the joining process.
Die Erfindung löst die Aufgabe gemäß einer zweiten Variante dadurch, dass auf das Fügeteil eine Kupferschicht und eine Silberschicht aufgebracht werden, wobei das Fügeteil und das Gegenstück zum Zusammenfügen durch die Silber- und Kupferanteile enthaltende Legierung beim Fügevorgang in Kontakt miteinander sind.According to a second variant, the invention achieves the object in that a copper layer and a silver layer are applied to the joining part, the joining part and the counterpart being joined together by the alloy containing silver and copper components being in contact with one another during the joining process.
Erfindungsgemäß werden die zur Ausbildung der Legierung notwendigen Metalle vor dem eigentlichen Fügevorgang, der bei hohen Temperaturen und unter einem Vakuum oder einer Schutz- gasatmosphäre durchgeführt wird, als festhaftende Schichten auf dem Fügeteil aufgebracht. Als Schutzgas kommt beispielsweise Stickstoff, Argon oder dergleichen in Betracht. Das verwendete Schutzgas sollte vorteilhafterweise einen niedrigen Taupunkt aufweisen. Der Druck des Vakuums ist zweckmäßigerweise nicht größter als 10"4 mbar. Eine aufwendige Positi- onierung eines separaten Lots während des Fügeverfahrens, beispielsweise in Form einer Folie, entfällt somit und vereinfacht das Fügeverfahren. Die zur Verbindung der Fügeteile notwendige Legierung entsteht erfindungsgemäß durch Diffusion und Schmelzen der aufgebrachten Metallschichten beziehungs- weise der Oberflächenschicht eines aus Kupfer bestehenden Gegenstücks. Die Kupfer- und Silberschicht können zweckmäßigerweise während des Fügevorgangs unmittelbar benachbart zueinander angeordnet sein. Dies bedeutet gemäß der ersten Variante, dass die Silberschicht und die Kupferschicht jeweils eine äußere Schicht ausbilden, mit der das Fügeteil und das Gegenstück während des Fügevorgangs in Kontakt miteinander stehen. Gemäß der zweiten Variante ist entweder die Silberschicht als äußerste Schicht auf eine Kupferschicht aufgebracht oder um- gekehrt eine Kupferschicht als äußerste Schicht auf einerAccording to the invention, the metals required to form the alloy are applied as firmly adhering layers to the joining part before the actual joining process, which is carried out at high temperatures and under a vacuum or a protective gas atmosphere. For example, nitrogen, argon or the like can be used as the protective gas. The shielding gas used should advantageously have a low dew point. The pressure of the vacuum is expediently not greater than 10 "4 mbar. A complex positioning of a separate solder during the joining process, for example in the form of a film, is thus dispensed with and simplifies the joining process. According to the invention, the alloy required for connecting the joining parts is formed by diffusion and melting the applied metal layers or the surface layer of a counterpart made of copper. The copper and silver layers can expediently be arranged directly adjacent to one another during the joining process. According to the first variant, this means that the silver layer and the copper layer each form an outer layer with which the joining part and the counterpart are in contact with one another during the joining process. According to the second variant, either the silver layer is applied as the outermost layer on a copper layer or swept a copper layer as the outermost layer on one
Silberschicht. Hiervon abweichend kann jedoch auch eine weitere Drittmetallschicht beispielsweise eine Titanschicht zwischen den Schichten aus Silber und Kupfer aufgebracht werden. Die Drittmetallschicht wäre dann gemäß der ersten Variante eine äußerste Schicht, die entweder auf der Silberschicht des Fügeteils oder der Kupferschicht des Gegenstücks ausgebildet wäre. Gemäß der zweiten Variante der Erfindung wäre die Drittmetallschicht zwischen der Silberschicht und der Kupfer- schicht aufgebracht. Die sich in diesen Fällen ausbildendeSilver layer. Deviating from this, however, a further third metal layer, for example a titanium layer, can be applied between the layers of silver and copper. According to the first variant, the third metal layer would then be an outermost layer, which would be formed either on the silver layer of the joining part or on the copper layer of the counterpart. According to the second variant of the invention, the third metal layer would be applied between the silver layer and the copper layer. The one developing in these cases
Legierung enthält erfindungsgemäß neben Silber- und Kupferanteilen auch Anteile des Drittmetalls.According to the invention, alloy contains not only silver and copper parts but also parts of the third metal.
Die beim Fügevorgang eingestellten Temperaturen liegen unter- halb der Schmelztemperaturen von Silber und Kupfer, die bei 961°C für Silber und bei 1083°C für Kupfer liegen. Während des Fügevorgangs kommt es daher vor dem Schmelzen der Schichten zu einer diffusionsbedingten Durchmischung von Silber und Kupfer und gegebenenfalls des Drittmetalls. Solche Legierun- gen weisen gegenüber den Reinmetallen einen herabgesetzten Schmelzpunkt auf. In der Zusammensetzung des Kupfer-Silber- Eutektikums mit einem Silberanteil von 72 Gew.-% nimmt der Schmelzpunkt eine nur aus Silber und Kupfer bestehenden Legierung mit ungefähr 780°C seinen tiefsten Wert an. Liegen die beim Fügevorgang eingestellten Temperaturen an der Kontaktstelle zwischen den Fügeteilen im Bereich von 780°C, werden daher vorzugsweise flüssige Phasen mit einer Zusammensetzung des Kupfer-Silber-Eutektikums erzeugt.The temperatures set during the joining process are below the melting temperatures of silver and copper, which are 961 ° C for silver and 1083 ° C for copper. During the joining process, there is therefore a diffusion-related mixing of silver and copper and possibly the third metal before the layers melt. Such alloys have a reduced melting point compared to pure metals. In the composition of the copper-silver eutectic with a silver content of 72% by weight, the melting point of an alloy consisting only of silver and copper assumes its lowest value at approximately 780 ° C. If the temperatures set during the joining process at the contact point between the joining parts are in the range of 780 ° C., liquid phases with a composition of the copper-silver eutectic are therefore preferably generated.
Das Gegenstück besteht gemäß der ersten Variante der Erfindung aus Kupfer oder weist eine vor dem Fügevorgang aufgebrachte Kupferschicht auf. Im letzteren Fall und gemäß der ersten Variante der Erfindung ist es keineswegs notwendig, dass das Gegenstück aus Kupfer besteht. Weitere zweckmäßigeAccording to the first variant of the invention, the counterpart consists of copper or has a copper layer applied before the joining process. In the latter case and according to the first variant of the invention, it is by no means necessary that the counterpart is made of copper. More appropriate
Herstellungsmaterialien des Gegenstücks sind beispielsweiseManufacturing materials of the counterpart are, for example
Keramik oder Edelstahl.Ceramic or stainless steel.
Die Erfindung vereinfacht insbesondere das Herstellungsverfahren von Vakuumschaltröhren, da in diesen Fällen einerseits hohe Anforderungen an die Verbindungsstellen zwischen Fügeteil und Gegenstück gestellt werden, andererseits die gegenseitige Halterung der Fügeteile aneinander sowie die zusätz- liehe Lotanordnung aufgrund der komplexen Struktur der Fügeteile erschwert ist. Darüber hinaus werden erfindungsgemäße Verbindungen nur in unmittelbarer Umgebung der aufgebrachten Schichten oder an der Kontaktstelle der Fügeteile ausgebildet . Ein Verlaufen eines externen Lotes in einen Kontaktspalt hinein entfällt erfindungsgemäß.The invention in particular simplifies the manufacturing process of vacuum interrupters, since in these cases, on the one hand, high demands are placed on the connection points between the joining part and the counterpart, on the other hand the mutual holding of the joining parts to one another and the additional solder arrangement are made more difficult due to the complex structure of the joining parts. In addition, connections according to the invention are formed only in the immediate vicinity of the applied layers or at the contact point of the parts to be joined. According to the invention, there is no running of an external solder into a contact gap.
Gemäß einer vorteilhaften Weiterentwicklung der ersten Variante der Erfindung wird die Silberschicht als eine äußerste Schicht auf einer Kupferschicht aufgebracht. Unter einer äu- ßersten Schicht ist im Sinne der vorliegenden Erfindung, die Schicht zu verstehen, die als letzte Schicht vor dem Fügevorgang unter Vakuum oder unter Schutzgas und Temperaturen im Bereich des Schmelzpunktes der Legierung auf das Fügeteil o- der das Gegenstück aufgebracht wird und die während des Füge- Vorgangs dem Gegenstück beziehungsweise dem Fügeteil zugewandt und in Kontakt mit diesem ist . Bei dieser Variante der Erfindung sind die Kupferschicht und die Silberschicht während des Fügevorgangs benachbart zueinander angeordnet . Die Ausbildung einer lediglich aus Silber und Kupfer bestehenden Legierung ist daher bevorzugt.According to an advantageous further development of the first variant of the invention, the silver layer is applied as an outermost layer on a copper layer. For the purposes of the present invention, an outermost layer is to be understood as the layer which is applied as the last layer before the joining process under vacuum or under protective gas and temperatures in the range of the melting point of the alloy to the joining part or the counterpart and which is facing and in contact with the counterpart or the joining part during the joining process. In this variant of the invention, the copper layer and the silver layer are arranged adjacent to one another during the joining process. The formation of an alloy consisting solely of silver and copper is therefore preferred.
Gemäß einer Weiterentwicklung der ersten Variante, bei der das Gegenstück aus Kupfer besteht oder eine Kupferschicht aufweist, wird die Silberschicht mit einer Dicke von 10 bisAccording to a further development of the first variant, in which the counterpart consists of copper or a copper layer has, the silver layer with a thickness of 10 to
100 μm aufgebracht. Die Einstellung der Dicke der Silberschicht ist von dem gewählten Aufbringungsverfahren abhängig und kann beispielsweise bei galvanischen Prozessen über die Stromdichte und die Zeitdauer eingestellt werden. Die Metallschicht kann im Rahmen der Erfindung jedoch auch durch Aufwalzen einer Metallfolie mit gewünschter Dicke oder durch Flammspritzen aufgebracht werden.100 μm applied. The setting of the thickness of the silver layer depends on the selected application method and can be set, for example, in the case of galvanic processes via the current density and the duration. In the context of the invention, however, the metal layer can also be applied by rolling on a metal foil of the desired thickness or by flame spraying.
Gemäß der zweiten Variante der Erfindung, werden die Kupferschicht und die Silberschicht mit einer Dicke von 10-100 μm aufgebracht . Auch bei dieser Weiterentwicklung ist die Einstellung der jeweiligen Schichtdicke von dem jeweils gewählten Aufbringungsverfahren abhängig. Erfindungsgemäß ist es jedoch keinesfalls erforderlich, dass die Schichtdicken der Silber- und der Kupferschicht gleich sind. Vielmehr sollte die verfahrensmäßige Einstellung der Schichtdicke im Hinblick auf die gewünschte Zusammensetzung der Legierung erfolgen. Soll beispielsweise eine ausschließlich Silber- und Kupferan- teile enthaltende Legierung erzeugt werden, deren Zusammensetzung dem Eutektikum entspricht, so sollte das Verhältnis der Schichtdicken im Wesentlichen dem Mischungsverhältnis der Metalle im Eutektikum entsprechen. In diesem Sinne wäre es beispielsweise vorteilhaft etwa eine etwa 70 μm dicke Silber- Schicht und eine etwa 30 μm Kupferschicht aufzubringen.According to the second variant of the invention, the copper layer and the silver layer are applied with a thickness of 10-100 μm. With this further development, too, the setting of the respective layer thickness depends on the application method chosen in each case. According to the invention, however, it is by no means necessary for the layer thicknesses of the silver and copper layers to be the same. Rather, the procedural adjustment of the layer thickness should take place with regard to the desired composition of the alloy. For example, if an alloy containing only silver and copper parts is to be produced, the composition of which corresponds to the eutectic, the ratio of the layer thicknesses should essentially correspond to the mixing ratio of the metals in the eutectic. In this sense, it would be advantageous, for example, to apply an approximately 70 μm thick silver layer and an approximately 30 μm copper layer.
Gemäß einem bevorzugten Ausführungsbeispiel wird bei beiden Varianten der Erfindung als innerste Metallschicht eine Goldschicht zum Aktivieren des Edelstahlteils aufgebracht. Als innerste Schicht wird die Goldschicht zuerst und direkt auf das Fügeteil oder das Gegenstück aufgebracht, das dann vorteilhaft aus Edelstahl hergestellt ist. Abweichend hierzu wä- re eine Aktivierung jedoch auch mit anderen Schichten beispielsweise einer Nickelschicht möglich.According to a preferred embodiment, a gold layer for activating the stainless steel part is applied as the innermost metal layer in both variants of the invention. As the innermost layer, the gold layer is applied first and directly to the joining part or the counterpart, which is then advantageously made of stainless steel. Deviating from this However, activation with other layers, for example a nickel layer, is also possible.
Gemäß einer diesbezüglichen Weiterentwicklung weist die Gold- Schicht eine Dicke zwischen 0,2 μm und 10 μm auf.According to a further development in this regard, the gold layer has a thickness between 0.2 μm and 10 μm.
Alle Metallschichten werden zweckmäßigerweise galvanisch aufgebracht. Andere Aufbringungsverfahren erfolgen beispielsweise durch das Aufwalzen einer Metallfolie oder das Flammsprit- zen der gewünschten Metalle.All metal layers are expediently applied galvanically. Other application methods are carried out, for example, by rolling a metal foil or flame spraying the desired metals.
Bei einem bevorzugten Ausführungsbeispiel der Erfindung ist das Fügeteil ein Edelstahlteil.In a preferred embodiment of the invention, the joining part is a stainless steel part.
Im Folgenden wird ein bevorzugtes Ausführungsbeispiel der Erfindung beschrieben.A preferred exemplary embodiment of the invention is described below.
Zunächst wird ein Edelstahlteil entfettet, einem geeigneten Reinigungsprozess unterzogen und schließlich mit Wasser ge- spült. Es folgt das Aufbringen einer 1 μm dicken Goldschicht zur Aktivierung der Oberfläche des Edelstahls durch Eintauchen in ein handelsübliches Goldbad unter Elektrolysebedingungen. Nach einem abermaligen Spülvorgang mit Wasser schließt sich das Aufbringen einer 20 μm dicken Silberschicht durch Eintauchen in ein handelsübliches Silberbad unter E- lektrolysebedingungen an.First a stainless steel part is degreased, subjected to a suitable cleaning process and finally rinsed with water. This is followed by the application of a 1 μm gold layer to activate the surface of the stainless steel by immersing it in a commercially available gold bath under electrolysis conditions. After rinsing again with water, a 20 μm thick silver layer is applied by immersing it in a commercially available silver bath under electrolysis conditions.
Anschließend wird das auf diese Weise vorbehandelte Edelstahlteil mit einem Kupferteil zusammengebracht und die Füge- teile einem Vakuum von weniger als 10~4 mbar ausgesetzt, wobei die Temperatur auf die Arbeitstemperatur des Kupfer- Silber-Eutektikums eingestellt wird. Bei dieser Verfahrensweise entsteht durch Schmelzen der Silberschicht und der 0- berflächenschicht des Kupferteils bei gleichzeitiger Diffusion dieser Schichten eine Silber-Kupfer-Legierung, deren Zusammensetzung derjenigen des Kupfer-Silber-Eutektikums entspricht .The stainless steel part pretreated in this way is then brought together with a copper part and the joining parts are exposed to a vacuum of less than 10 ~ 4 mbar, the temperature being set to the working temperature of the copper-silver eutectic. With this procedure, melting of the silver layer and the 0- Surface layer of the copper part with simultaneous diffusion of these layers a silver-copper alloy, the composition of which corresponds to that of the copper-silver eutectic.
Beim bevorzugten Ausführungsbeispiel gemäß der zweiten Variante wird wie zuvor beschrieben zunächst eine 1 μm dicke Goldschicht, dann eine 30 μm dicke Kupferschicht und schließlich eine 70 μm dicke Silberschicht auf das Edelstahlteil als Fügeteil aufgebracht. Hieran schließen sich mehrere Spülvorgänge an.In the preferred exemplary embodiment according to the second variant, a 1 μm thick gold layer, then a 30 μm thick copper layer and finally a 70 μm thick silver layer are applied to the stainless steel part as a joining part, as described above. This is followed by several rinsing processes.
Zum Zusammenfügen zweier Edelstahlteile werden das beschichtete Edelstahlteil und ein unbeschichtetes Edelstahlteil ei- nem Vakuum von weniger als 10~4 mbar und der Arbeitstemperatur des Silber-Kupfer-Eutektikums ausgesetzt, wobei diese während dieses Fügevorganges in Kontakt miteinander sind, so dass durch das Schmelzen der Kupfer- und Silberschicht und deren diffusionsbedingte Vermischung eine Legierung mit der Zusammensetzung des Kupfer-Silber-Eutektikums ausgebildet wird. Nach dem Abkühlen der Fügeteile werden mechanisch feste und vakuumsdichte Verbindungen erhalten. To join two stainless steel parts, the coated stainless steel part and an uncoated stainless steel part are exposed to a vacuum of less than 10 ~ 4 mbar and the working temperature of the silver-copper eutectic, which are in contact with one another during this joining process, so that the melting of the Copper and silver layer and their diffusion-related mixing an alloy is formed with the composition of the copper-silver eutectic. After the parts to be cooled have cooled, mechanically strong and vacuum-tight connections are obtained.

Claims

Patentansprüche claims
1. Verfahren zum Zusammenfügen von einem Fügeteil mit einem Gegenstück mittels einer Silber- und Kupferanteile ent- haltenden Legierung, bei dem zumindest eine Metallschicht vor dem Zusammenfügen auf das Fügeteil aufgebracht wird und ein Fügevorgang unter Vakuum oder unter einer Schutz- gasatmosphäre bei einer Temperatur zwischen 650°C und 900°C durchgeführt wird, d a d u r c h g e k e n n z e i c h n e t, dass auf das Fügeteil eine Silberschicht und auf das Gegenstück eine Kupferschicht aufgebracht werden oder dass auf das Fügeteil eine Silberschicht aufgebracht wird und das Gegenstück aus Kupfer besteht, wobei das Fügeteil und das Gegenstück zur Ausbildung der Silber- und Kupferanteile enthaltenden Legierung beim Fügevorgang in Kontakt miteinander sind.1. A method for joining a joining part with a counterpart by means of an alloy containing silver and copper components, in which at least one metal layer is applied to the joining part before joining and a joining process under vacuum or under a protective gas atmosphere at a temperature between 650 ° C and 900 ° C is carried out, characterized in that a silver layer is applied to the joining part and a copper layer is applied to the counterpart or that a silver layer is applied to the joining part and the counterpart consists of copper, the joining part and the counterpart for formation of the alloy containing silver and copper components are in contact with one another during the joining process.
2. Verfahren zum Zusammenfügen von einem Fügeteil mit einem Gegenstück mittels einer Silber- und Kupferanteile enthaltenden Legierung, bei dem zumindest eine Metallschicht vor dem Zusammenfügen auf das Fügeteil aufgebracht wird und ein Fügevorgang unter Vakuum oder unter einer Schutz- gasatmosphäre bei einer Temperatur zwischen 650°C und 900°C durchgeführt wird, d a d u r c h g e k e n n z e i c h n e t, dass auf das Fügeteil eine Kupferschicht und eine Silberschicht aufgebracht werden, wobei das Fügeteil und das Gegenstück zum Zusammenfügen durch die Silber- und Kupferanteile ent- haltenden Legierung beim Fügevorgang in Kontakt miteinander sind.2. Method for joining a part to be joined with a counterpart by means of an alloy containing silver and copper parts, in which at least one metal layer is applied to the part to be joined and a joining process under vacuum or under a protective gas atmosphere at a temperature between 650 ° C and 900 ° C is carried out, characterized in that a copper layer and a silver layer are applied to the joining part, the joining part and the counterpart being joined together by the alloy containing silver and copper parts being in contact with one another during the joining process.
3. Verfahren nach Anspruch 2 , d a d u r c h g e k e n n z e i c h n e t, dass die Silberschicht als eine äußerste Schicht auf einer Kupferschicht aufgebracht wird.3. The method according to claim 2, characterized in that the silver layer is applied as an outermost layer on a copper layer.
4. Verfahren nach Anspruch 1 , d a d u r c h g e k e n n z e i c h n e t, dass die Silberschicht mit einer Dicke von 10 μm bis 100 μm aufgebracht wird.4. The method of claim 1, d a d u r c h g e k e n n z e i c h n e t that the silver layer is applied with a thickness of 10 microns to 100 microns.
5. Verfahren nach Anspruch 2 oder 3, d a d u r c h g e k e n n z e i c h n e t, dass die Kupferschicht und die Silberschicht mit einer Dicke von 10 μm bis 100 μm aufgebracht werden.5. The method according to claim 2 or 3, d a d u r c h g e k e n n z e i c h n e t that the copper layer and the silver layer are applied with a thickness of 10 microns to 100 microns.
6. Verfahren nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t, dass als innerste Metallschicht eine Goldschicht zum Aktivieren des Fügeteils aufgebracht wird.6. The method according to any one of the preceding claims, d a d u r c h g e k e n n z e i c h n e t that a gold layer for activating the joining part is applied as the innermost metal layer.
7. Verfahren gemäß Anspruch 5, d a d u r c h g e k e n n z e i c h n e t, dass die Goldschicht mit einer Dicke zwischen 0,2 μm und 10 μm aufgebracht wird.7. The method according to claim 5, d a d u r c h g e k e n n z e i c h n e t that the gold layer is applied with a thickness between 0.2 microns and 10 microns.
8. Verfahren nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t, dass die Metallschichten galvanisch aufgebracht werden.8. The method according to any one of the preceding claims, d a d u r c h g e k e n n z e i c h n e t that the metal layers are applied galvanically.
9. Verfahren nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t, dass das Fügeteil aus Edelstahl besteht. 9. The method according to any one of the preceding claims, d a d u r c h g e k e n n z e i c h n e t that the joining part consists of stainless steel.
PCT/DE2003/001321 2002-05-21 2003-04-16 Method for joining a part to be joined to a counterpart using an alloy containing silver and copper constituents WO2003097287A1 (en)

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