FR2895845A1 - DEVICE AND METHOD FOR COOLING POWER ELECTRONICS OF AN ELECTRIC GENERATING / ENGINE COMBINATION. - Google Patents

Abstract

This is to ensure, in particular in a motor vehicle, the cooling of a power electronics of a generator / electric motor combination in the form of an electromagnetic torque converter and / or an electromagnetic transmission. At least one stator (1) with its support (2) is provided, and at least one short-circuit winding (3) can be switched by at least one semiconductor switching module (5) arranged on and / or in the stator (1), and at least one cooling element (10) is provided in the stator (1) for cooling the module (5), this element comprising at least one intake orifice and at least one discharge orifice, and for the circulation of a cooling agent of the module.

Description

The invention relates to a device and a method for cooling a

  power electronics of a generator / electric motor combination, the generator / electric motor combination being made in the form of an electromagnetic torque converter and / or an electromagnetic transmission, in particular in a motor vehicle, and comprising at least one stator with at least one stator support, and at least one short-circuit winding which can be switched, if necessary, by means of at least one semiconductor switching module arranged on and / or in the stator, and at least one a separate cooler element being provided on and / or in the stator for cooling the semiconductor switching module. Electromagnetic transmissions or torque converters for use in a motor vehicle are already known. Thus, for example, the publication DE 4 408 719 C1 discloses a combination generator / electric motor, which can be used as an electromagnetic torque converter or electromagnetic transmission in a wide range of speeds, for example in a motor vehicle with hybrid drive structure. The combination generator / electric motor comprises in this case a housing, in which are arranged the rotor and the stator, both the generator and the electric motor, and a hollow cylindrical generator rotor fixed on an input shaft, and a hollow cylindrical motor rotor fixed on an output shaft, the rotors being axially aligned, and permanent magnets of alternating polarity distributed in the peripheral direction being provided on their inner face. There is further provided an axially movable hollow cylindrical stator, comprising at least one short-circuit winding which is switched according to the relative position of the permanent magnets of the two rotors. The polarity of permanent magnets located opposite each other is determined by means of magnetic field sensors between the permanent magnets, and the short-circuit line is closed or opened depending on the signals of the sensors. The direction of rotation of the output shaft can thus be adjusted, while the positioning of the short-circuit winding under the permanent magnets of the rotor of the motor or that of the generator defines the speed of rotation and the output torque. of the output shaft. The switching of the short-circuit winding is in this case carried out using semiconductor elements that can be controlled, for example by means of bipolar transistors. Due to the necessary power of such a control and power electronics, heating generally occurs which, in the case of insufficient cooling, can lead to deterioration and failure of the electronics. The publication DE 19 945 368 A1 discloses a magneto-electric machine for a motor vehicle, which comprises an electronics arranged inside a stator support of the magneto-electric machine, the cooling water channels being preferably provided in the wall of the stator support. In addition, heat sinks are provided, which constitute the basis for the electronics, and also permit direct contact with the stator support. Their outer shape corresponds in this case to the surface of the inner wall of the stator support, to ensure a direct contact between these two components. This arrangement makes it possible to ensure cooling of the electronics via the wall of the stator support. The heat sinks are in this case heat conduction plates, which promote the dissipation of heat from the electronics to the stator support preferably water-cooled. This cooling principle of evacuating heat to the stator support via thermal conduction plates, however, is only sufficient for a relatively low power electronics. If power electronics modules of relatively high electrical power are used, a warm-up occurs during their operation, so that this simple principle of heat dissipation reaches its limits. The consequences may be insufficient cooling, followed by deterioration and failure of the electronics.

  Furthermore, the publication WO 03/095 922 A2 discloses a cooling unit for liquid cooling of power semiconductors, the cooling unit cooling components which are arranged on the upper face of at least one plate, and the lower face of the at least one plate being cooled by a liquid which is guided along the plate by means of a distribution element, and a liquid inlet and a liquid outlet of the element of distribution being provided perpendicular to the plate. The distribution element is subdivided into cells, each cell comprising a liquid inlet and a liquid outlet, which are preferably provided perpendicular to the plate, the liquid passing through only one cell, and the distribution element comprising minus two cells for each plate. Such a cooling unit is shown in FIGS. 7 to 9. Efficient cooling of power semiconductors is possible using such cooling units in which a liquid circulates. Up to now, however, the field of use of such cooling units is mainly limited to voltage converters, as well as to the casing of electrical machines, integration into moving components, such as, for example, rotors and stators. , not intended because of the coolant circuit necessary for the supply of the cooling units, and the related construction difficulties with respect to the external supply of coolants. Another cooler element for use in reducing the heat of electrical components or switching circuits is known from DE 19 710 783 C2. The invention is therefore based on the technical problem of proposing an improved device and an improved method for cooling a power electronics of a generator / electric motor combination, the generator / electric motor combination being made in the form of an electromagnetic torque converter and / or an electromagnetic transmission.

  A solution of the technical problem thus formulated is offered according to the present invention and will be described hereinafter. The invention is in this case based on the observation that the cooling of a power electronics of a generator / electric motor combination, in which the power electronics is arranged on moving parts, can also be realized effectively and efficiently. in a way that is not very cumbersome for semiconductor switching modules of relatively high power, since, in spite of more expensive supply and removal of the cooling medium, a separate cooling element is used for the cooling of cooling modules. switching semiconductors provided in or on the stator (mobile) which, for the formation of a module cooling circuit, is traversed by a coolant. This is achieved according to the invention by the fact that there is provided a device and a method for cooling a power electronics of a generator / electric motor combination, the generator / electric motor combination being made in the form of an electromagnetic torque converter and / or an electromagnetic transmission, in particular in a motor vehicle, and comprising at least one stator with at least one stator support, and at least one short-circuit winding, which can be switched in case as required by means of at least one semiconductor switching module arranged on and / or in the stator, and at least one separate cooling element for cooling the semiconductor switching module being provided on and / or in the stator , and the at least one separate cooler element having at least one inlet port and at least one exhaust port, and capable of being traversed by a coolant for the formation of a module cooling circuit. Despite the significant heating during operation, the power electronics, including the cooling provided for this purpose, can be arranged on or preferably inside the stator. Thanks to the compact arrangement, this leads to a considerable saving of space, and also solves the problem of a cooling power as high as possible, in particular of electrical machines, such as for example the generator / electric motor combination described in FIG. DE 4 408 719 C1, in which a plurality of hollow cylindrical rotors rotates around an axially movable stator, which until now have been cooled through the stator support only by means of plates. heat dissipation. The arrangement according to the invention therefore allows a higher transmissible power of such electrical machines. In another advantageous embodiment, cooling agent channels are provided in the wall of the stator support for cooling the stator, which are formed as constituent parts of a stator cooling circuit. In addition to cooling the power electronics by means of a separate cooling element, the stator can also be cooled independently of the cooling element, which again exerts an additional cooling effect on the power electronics, and allows therefore to use semiconductor switching modules of even higher power. In another advantageous embodiment, the stator cooling circuit and the cooling circuit of the module are fed from the same coolant source. Since a common source is provided for both cooling circuits, the provision of coolant is simplified, and a more economical use of the space conditions is possible on and in the generator / electric motor combination, in particular with regard to the coolant supply lines. In another advantageous embodiment, the coolant flows in parallel in the stator cooling circuit and in the cooling circuit of the module. Compared to a series circulation, this has the advantage of avoiding a temperature gradient with respect to the chronological order of the circulation between the stator cooling circuit and the cooling circuit of the module. Moreover, the two circuits can be attacked at substantially the same temperature of the coolant at the respective inlet of the circuits. This promotes a controlled cooling process, and increases its efficiency. In another advantageous embodiment, the cooling element is arranged on the base of the semiconductor switching module, the semiconductor switching module being fixed to the stator support by means of the cooling element. The cooling element thus fulfills a dual function because, in addition to cooling the semiconductor switching module as efficiently as possible, it also simultaneously serves as a means for fixing the semiconductor switching module on the stator support.

  In another advantageous embodiment, at least one module support is provided for fixing the cooling element to the stator support, the module support comprising at least one inlet orifice and at least one orifice of evacuation, and can be crossed by the coolant. The module support facilitates in this case the arrangement in the stator of one or more cooling elements, including power electronics, and thus promotes the compact arrangement of the combination generator / electric motor when the power of cooling is high. The module holder simultaneously allows the supply and discharge of the coolant to and from the coolers, without the need for additional coolant supply lines. In another advantageous embodiment, there is provided at least one coolant distribution element, which is connected to the coolant source for the coolant supply of the cooling circuit of the module. The distribution of the cooling agent of the coolant source on one or more cooling elements, and preferably also on the stator cooling circuit, is thus possible via a single component, to know the coolant distribution element. This ensures a low volume of construction, and makes it possible to forgo cooling agent supply lines as well as additional branches. In another advantageous embodiment, the cooling element consists of a plurality of superimposed cooling layers in stack, and connected to one another at the surface, which form between them channels through which the coolant passes, at least a first and a second collection space being respectively formed by apertures in the cooling layers, and the cooling layers having between the two openings a sieved structured area having a plurality of apertures for formation of the channels. This arrangement of the cooler element conducts through the cooler element to a largely branched flow path for the coolant, preferably in all three spatial axes. The different openings, and areas of material provided between them, are preferably shifted from one cooling layer to another so that a circulation of the coolant in the cooling element is only possible. by the permanent alternation of the cooling layers, and by the use of breakthroughs. Inside the cooling element, a very branched labyrinth is thus generated which can be traversed by the coolant, in which the sections of material situated opposite the openings are respectively provided in the circulation channels formed by breakthroughs. The effective surface of heat exchange is thus increased, and a turbulent mixture of the coolant for the heat dissipation is obtained as efficient as possible. The cooling layers are preferably made in the form of metal plates or films, for example copper, and are further preferably interconnected by their entire surface in a cooling element using the DCB technique (Direct Copper Bond Technique).

  In another advantageous embodiment, the cooling element comprises a plurality of cooling cells, each having an intake orifice and an outlet for the coolant, the direction of flow of the agent cooling through the inlet and outlet ports being perpendicular to the surface to be cooled of the semiconductor switching module, and a finger structure for the formation of an inlet chamber and an evacuation chamber on its back side. Since, for the entire cooler element, there is not only an intake port and an exhaust port provided, but a plurality of cooling cells each having an inlet port and an orifice a uniform distribution of the coolant temperature is ensured, without a temperature gradient occurring due to an increasing heating of the coolant over the entire surface to cooling of the semiconductor switching module or over the entire length and / or width of the cooling element.

  The different cooling cells are in this case supplied parallel to each other, namely supplied with coolant of the same temperature, which leads to the homogeneous distribution of temperature on the semiconductor substrate.

  By means of the perpendicular flow direction of the coolant with respect to the surfaces to be cooled, the coolant can be brought particularly fast to the coolant and can be removed just as quickly from them before is too warm, and begins to form temperature gradients on the surface. Thanks to the finger structure on the back side of the cooling element, the same pressures or the same pressure loss can be obtained in all the cooling cells.

  The cooling element is preferably made of plastic, which allows an extremely simple production and a particularly interesting cost. Furthermore, each cooling cell preferably has a passage channel with a meandering structure, which forces the coolant to frequently change direction of flow. This leads to a high cooling effect because the coolant is mixed with each change in its direction of flow. Due to the turbulent flow thus generated, the heat can be removed particularly efficiently from the hot surfaces of the semiconductor switching module. The variation of the size and the geometry of the channels of the different cooling cells makes it possible to individually vary the heat dissipation of individual cooling cells, which makes it possible to take into account maxima or minima of heat located on the surface to be cooled. semiconductor. In another advantageous embodiment, a module support is provided for fixing the cooling element on the stator support, the module support having at least one refrigerating tank provided with at least one inlet and at least one discharge opening for receiving the cooling element, and through which the cooling medium passes.

  The cooler element is preferably positioned in the cooling tank through which the coolant passes through a finger structure on its back side, which bowl is subdivided by the finger structure into a side containing hot coolant. and one side containing cold coolant. The cold-coolant-containing side serves here to bring the coolant to the cooling-cell inlets, while the hot-coolant-containing side is used to evacuate the coolant. the coolant through the cooling cell outlets. Cooling in parallel without temperature gradient can thus be achieved simply by means of the whole of the cooling element, the same pressure loss prevailing in all the cooling cells, while the admission and the Evacuation of the coolant can be done centrally to an evacuation or from a source of coolant through the inlet and outlet ports of the cooling tank. Other features and advantages of the present invention will emerge more clearly on reading the following description given by way of example, when taken in conjunction with the appended drawings, in which: FIG. 1 is a diagrammatic representation through a view in oblique perspective from the front of a cooling device according to the invention; Figure 2 is a similar schematic representation of the chiller without stator support and without winding; Figure 3 is a schematic representation oblique perspective view from the rear of the cooler according to the invention; Figure 4 is a similar view of the chiller, without stator support and without winding; Figure 5 is a schematic representation in top view of two module supports of the cooler according to the invention; Figure 6 is a top view of a possible embodiment of a cooler element (state of the art) for use in a cooler according to the invention; Figure 7 is a perspective view of an alternative embodiment of a cooler element (state of the art) for use in a cooler according to the invention; Figure 8 is a top view of the same alternative embodiment of a cooler element (state of the art) for use in a cooler according to the invention; Figure 9 is a bottom view of the same alternative embodiment of a cooler element (state of the art) for use in a cooler according to the invention; and Figure 10 is a schematic representation of a generator / electric motor combination (state of the art). FIG. 1 schematically represents a cooler according to the invention of a generator / electric motor combination 40 (see FIG. 10 for this purpose), which is embodied in the form of an electromagnetic torque converter or an electromagnetic transmission in a wide range of speeds, for example for use in a motor vehicle with a hybrid drive structure. The generator / electric motor combination 40 preferably comprises a generator rotor 42, an electric motor rotor 45 and an axially movable hollow cylindrical stator 1 with a stator support 2, on which short windings are provided. circuit 3, and which is also an integral part of the cooler. For the operation of the generator / electric motor combination 40, the short-circuit windings 3 are in this case switched with respect to each other as a function of the position of permanent magnets 43, 46 which are respectively arranged on the the rotor 42 of the generator and the rotor 45 of the electric motor, the polarity of the permanent magnets 43, 46 located opposite each other being preferably determined by means of magnetic field sensors (not shown) between the magnets permanent 43, 46, and the lines of the short-circuit windings 3 are closed or open depending on the signals of the sensors. It is thus possible to determine the direction of rotation of an output shaft 44 of the generator / electric motor combination 40, while the positioning of the short-circuit windings 3 under the permanent magnets 43, 46 of the rotor 45 of the electric motor or the rotor 42 of the generator determines the rotational speed and the driving torque of the output shaft 44, and can be modified with respect to a drive shaft 41. The positioning of the short-circuit windings 3 under the permanent magnets 43, 46 can in this case be modified by axial displacement of the stator 1 by means of a displacement bar 47. The commutation of the short-circuit windings 3 is in this case carried out using semiconductor switching 5 which can be controlled, which can for example be embodied in the form of bipolar transistors. The power electronics, of which the semiconductor switching modules 5 are part, is preferably arranged on and / or in the stator 1, and even more preferably in the interior volume thereof. Since the stator 1 is axially mobile, the power electronics, including the semiconductor switching modules 5, is therefore arranged on a moving part. A total of five separate cooling elements 10 are provided on and / or in the stator 1 for the cooling of the semiconductor switching modules 5. Each cooling element 10 comprises in this case at least one inlet orifice 23, 31 and at least one discharge orifice 24, 32 (see FIGS. 6 to 9), and may be traversed by a cooling medium, for example water, to form a module cooling circuit. The cooling elements 10 are respectively arranged on the base of the semiconductor switching modules 5. The semiconductor switching modules 5 are thus fixed on the stator support 2 by means of the cooling elements 10. Agent channels cooling means (not shown), which are embodied as integral parts of a stator cooling circuit, and connected to a coolant feed 16 and a coolant return 17, are further provided in the wall of the stator support 2 for the cooling of the stator 1. The stator cooling circuit and the cooling circuit of the module are in this case fed from the same source of coolant, and are crossed in parallel by the cooling agent. Two module supports 7a, 7b are furthermore provided for fixing the cooling elements 10 to the stator support 2, the module supports 7a, 7b respectively comprising connection orifices 22a, 22b, and a go 18 of the agent. cooling and return of coolant (see Figure 5), and can be traversed by the coolant. The module supports 7a, 7b have in this case an outer shape which corresponds to the surface of the inner wall of the stator support 2. In addition, two coolant distribution elements are provided, which are connected to the coolant source for the coolant supply of the module cooling circuit and the stator cooling circuit. The coolant distribution elements therefore provide the supply and distribution of coolant from the coolant source to the cooler elements 10 and the stator cooling circuit. Two openings 4 for housing bearings and bearing couples, and the axial displacement of the stator 1 by means of the displacement bars 47 (see Figure 10), are further provided in the interior of the stator 1. FIG. 2 is a schematic representation of the same preferred embodiment of the cooler according to the invention as in FIG. 1, but without the stator support 2 and the short-circuit windings 3. The arrangement of the components arranged in the internal volume of the The stator is therefore particularly well recognizable, in particular the module supports 7a, 7b and the coolant distribution elements. It is recognized for example that holes with discharge holes 21 are provided in the module supports 7a, 7b, in order to be able to fix the module supports 7a, 7b and the cooling elements 10 to the stator support 2, for example by means of screws (not shown). FIGS. 3 and 4 show schematically the same preferred embodiment of the cooling device according to the invention as FIGS. 1 and 2, but seen from behind, once with the stator support 2 and the short-circuit windings 3 (Figure 3), and once without (Figure 4). FIG. 5 schematically represents a view from above of the two module supports 7a, 7b of the cooling device according to the invention. A module support 7a is in this case provided for the reception of three cooling elements 10, the other module support 7b is only provided for the reception of two cooling elements 10. It is also recognized that the The module supports 7a, 7b each have a cooling agent passage 18 and a cooling medium return 19 arranged in the form of orifices, as well as each of the connecting orifices 22a, 22b for the supply of cooling agent. cooling the cooling elements 10 (see Figures 1 to 4). For the connection of the connection ports 22a to the cooling agent passage 18, and the connection ports 22b to the coolant return 19, cooling agent channels 20a, 20b are provided inside. module supports 7a, 7b, so that the module supports 7a, 7b can be traversed by coolant. The connection orifices 22a and the coolant channel 20a serve in this case to connect the cooling medium 18 to the inlet orifices 23, 31 of the cooling elements 10a, 10b (see FIGS. ), while the connection ports 22b and the coolant channel 20b serve to connect the outlet orifices 24, 32 of the cooling elements 10a, 10b to the coolant return 19. For fixing the module supports 7a, 7b as well as the cooling elements 10a, 10b to the stator support 2, the holes with discharge holes 21 are provided in the module supports 7a, 7b. Figure 6 is a schematic top view of a cooling element 10a known from the state of the art, which is suitable for use in a cooler according to the invention. The cooling element 10a is in this case constituted by several stacking layers superimposed in a stack and interconnected at the surface, which form between them channels (not shown) through which the cooling medium can pass. First and second collection spaces are respectively formed by apertures, arranged as intake port 31 and discharge port 32, formed in the cooling layers. Between the inlet orifice 31 and the discharge orifice 32, the cooling layers comprise a structured screen-type zone provided with a plurality of openings 26 for the formation of the circulation channels. The cooling layers are for example arranged in the form of copper plates, which are interconnected in the cooling element 10a using the technique DCB (Direct Copper Bond Technique). Holes 25 are provided for fixing the cooling element, for example by means of screws. Figures 7 and 8 show schematically a preferred embodiment of a chiller element 10b known from the state of the art, which is suitable for use in a chiller device according to the invention. The cooling element 10b is for example made of plastic, and comprises a plurality of cooling cells 30 each having an inlet port 31 and a discharge port 32 for the coolant. The direction of flow of the coolant through the inlet and outlet ports 32 and 32 is perpendicular to the surface to be cooled at the base of the semiconductor switching module 5 (see FIGS. 1 to 4), that the cooling element 10b covers in the mounted state (not shown), and closes sealingly. On its rear face (see Figure 9), the cooling element 10b has a finger structure 28 for the formation of an intake chamber 38 and a discharge chamber 39. The various cooling cells 30 are fed in parallel cooling agent, which leads to a homogeneous distribution of temperature on the substrate of the semiconductor switching module 5. Each cooling cell 30 has a passage channel 36 with a meandering structure, which forces the coolant to frequently change its direction of flow. In this case, the coolant enters the cooling cells 30 through the inlet ports 31 from the rear face of the cooling element 10b and is guided along the surface to be cooled by the cooling element. semiconductor switching 5 by guide walls 33 provided on the lower face (as sketched by the arrows in Figure 8), and out again cooling cells 30 through the discharge ports 32. The guide walls 33 are in this case each interrupted so that they allow the passage of the coolant at one end. Some uninterrupted walls 35 are however also provided, which extend longitudinally or transversely across the entire structure of the cooling element 10b. These uninterrupted walls 35 subdivide the upper face of the cooling element 10b into the cooling cells 30. The inlet orifice 31 of one of the cooling cells 30 is furthermore positioned respectively as close as possible to the orifice exhaust 32 of one of the adjacent cooling cells 30. This leads to the fact that the heated coolant, coming out of the cooling cell 30, is in the vicinity of cold coolant entering the adjacent cooling cell, whereby the temperature gradient can be further minimized along the surface to be cooled of the semiconductor switching module 5. Along the edges 34 of the chiller element 10b, the surface of the cooling cells 30 located at this level is larger than in the other cells of the chiller element 10b. cooling 30, means by which the cooling in the areas along the edges 12 is less effective than in other areas. Since in semiconductor switching modules 5, the greatest heat development is usually generated centrally, the central hot areas are more strongly cooled by the smaller cooling cells. The variation in the size of the surface to be cooled of the different cooling cells 30 therefore makes it possible to obtain additional minimization of the temperature gradient along the surface to be cooled.

  FIG. 9 schematically represents the same preferred embodiment of the cooling element 10b as the bottom views of FIGS. 7 and 8. The finger structure 28 for the formation of the admission chamber 38 and of the evacuation chamber 39 is here represented on the rear face of the cooling element 10b. The finger structure 28 is formed by a wall 37, which winds along the rear face of the cooling element 10b. This wall 37 is provided to be disposed by its free face on the bottom of a cooling tank (not shown), and to form therewith a liquid-tight connection. With such a positioning of the cooling element 10b in the cooling tank, its rear face is subdivided into the inlet chamber 38 and the exhaust chamber 39. If the cooling element 10b, with its finger structure 28 located on its rear face is positioned in the cooling tank through which the cooling medium passes, which is therefore separated by the finger structure 28 in one side with hot cooling agent and one side with the agent cold cooling.

  The side with cold coolant serves to bring the coolant to the intake ports 31 of the cooling cells 30, while the side with hot coolant serves to evacuate the coolant. outlet openings 32 of the cooling cells 30. For the reception of the cooling element 10b, the module supports 7a, 7b (see FIGS. 1 to 5) preferably comprise cooling vessels (not shown), provided respectively with at least one coolant inlet port, and at least one coolant return port 19, and the cooling medium therethrough. All the inlet orifices 31 of the cooling elements 10b are connected to the inlet chamber 38, and all the discharge orifices are connected to the evacuation chamber 39. The cooling cells 30 (see FIGS. 8) are therefore all connected in parallel with the coolant flow 18 and coolant return 19.

  Although the invention has been particularly shown and described with reference to a preferred embodiment thereof, it will be readily understood by those skilled in the art that changes in form and detail can be made without out of the mind or the field of invention.

  List of numerical references 1 Stator 2 Stator support 3 Short-circuit windings 4 Orifice 5 Semiconductor switching module 7a, 7b Module holder 10, 10a, 10b Cooling element 15 Coolant distribution element 16 Go to Coolant 17 Coolant Return 18 Coolant Flow 19 Coolant Return 20a, 20b Coolant Channel 21 Drop Hole Hole 22a, 22b Connection Hole 23 Orifice Port inlet 24 Drain hole Drilling 26 Breakthrough 28 Finger structure Cooling cell 25 31 Intake port 32 Exhaust port 33 Guide wall 34 Edge Continuous wall 30 36 Through passage 37 Wall 38 Intake chamber 39 Chamber d Generator / electric motor combination 35 41 Drive shaft 42 Generator rotor

Claims (20)

  1. Cooler of a power electronics of a generator / electric motor combination {40), the generator / electric motor combination (40) being embodied as an electromagnetic torque converter and / or an electromagnetic transmission , in particular in a motor vehicle, and comprising at least one stator (1) with at least one stator support (2), and at least one short-circuit winding (3) which can be switched, if necessary, by means of at least one semiconductor switching module (5) arranged on and / or in the stator (1), and at least one separate cooling element (10, 10a, 10b) being provided on and / or in the stator (1) for cooling the semiconductor switching module (5), characterized in that the at least one separate cooling element (10, 10a, 10b) has at least one inlet (23, 31) and at least one vent (24, 32), and may be traversed by a coolant component for the formation of a module cooling circuit.   Device according to claim 1, characterized in that coolant channels, which are formed as integral parts of a stator cooling circuit, are provided in the wall of the stator support (2) for the cooling of the stator (1).   3. Device according to claim 2, characterized in that the stator cooling circuit and the cooling circuit of the module are fed from the same source of coolant.   4. Device according to one of claims 2 or 3, characterized in that the coolant flows in parallel in the stator cooling circuit and in the cooling circuit of the module.   5. Device according to one of the preceding claims, characterized in that the cooling element (10, 10a, 10b) is arranged on the base of the semiconductor switching module (5), the semiconductor switching module ( 5) being fixed to the stator support (2) by means of the cooling element.   6. Device according to one of the preceding claims, characterized in that at least one module support (7a, 7b) is provided for fixing the cooling element (10, 10a, 10b) to the support (2) of stator, the support (7a, 7b) of module comprising at least one inlet and at least one discharge orifice, and can be traversed by the cooling agent.   Device according to one of the preceding claims, characterized in that at least one coolant distribution element (15) is provided which is connected to the coolant source for the supply of cooling medium. cooling agent of the cooling circuit of the module.   8. Device according to one of the preceding claims, characterized in that the cooling element (10a) consists of several superimposed cooling layers stack, and interconnected at the surface, which form between them channels that can be traversed by the coolant, at least a first and a second collection space respectively being formed by openings in the cooling layers, and the cooling layers having between the two openings a structured screen-like area provided with a plurality piercing (26) for formation of the channels.   9. Device according to one of the preceding claims, characterized in that the cooling element (10b) comprises a plurality of cooling cells 35 (30) each having an inlet (31) and an orifice discharge (32) for the coolant, the flow direction of the coolant through the inlet (31) and discharge (32) ports being perpendicular to the surface to be cooled of the cooling module. semiconductor switching (5), and a finger structure (28) for forming an inlet chamber (38) and an evacuation chamber (39) on its rear face.   10. Device according to claim 9, characterized in that a module holder (7a, 7b) is provided for fixing the cooling element (10b) to the stator support (2), the support (7a, 7b). module comprising at least one cooling tank for receiving the cooling element (10b), which is provided with at least one intake orifice and at least one discharge orifice, and can be traversed by the coolant.   11. A method of cooling a power electronics of a generator / electric motor combination (40), the generator / electric motor combination (40) being embodied as an electromagnetic torque converter and / or a electromagnetic transmission, in particular in a motor vehicle, and comprising at least one stator (1) with at least one stator support (2), and at least one short-circuit winding (3) which can be switched, if necessary, by means of at least one semiconductor switching module (5) arranged on and / or in the stator (1), and at least one separate cooling element (10, 10a, 10b) being provided on and / or in the stator ( 1) for cooling the semiconductor switching module (5), characterized in that the at least one separate cooling element (10, 10a, 10b) comprises at least one inlet (23, 31) and at least one minus one evacuation orifice (24, 32), and is traversed by an agent of cooling for formation of a module cooling circuit.   The method according to claim 11, characterized in that coolant channels, which are embodied as integral parts of a stator cooling circuit, are provided in the wall of the stator support (2) for cooling of the stator (1).   13. The method of claim 12, characterized in that the stator cooling circuit and the cooling circuit of the module are fed from the same source of coolant.   14. Method according to one of claims 12 or 13, characterized in that the coolant flows in parallel in the stator cooling circuit and in the cooling circuit of the module.   15. Method according to one of claims 11 to 14, characterized in that the cooling element is arranged on the base of the semiconductor switching module (5), the semiconductor switching module (5) being fixed to the stator support (2) by means of the cooling element (10, 10a, 10b).   16. Method according to one of claims 11 to 15, characterized in that at least one support (7a, 7b) module is provided for fixing the cooling element (10, 10a, 10b) to the support (2 ) of the stator, the module support (7a, 7b) having at least one inlet port and at least one discharge port, and being traversed by the coolant.   Method according to one of Claims 11 to 16, characterized in that at least one coolant distribution element (15) is provided which is connected to the coolant source for the cooling medium. coolant supply to the cooling circuit of the module.   18. A method according to one of claims 11 to 17, characterized in that the cooling element (10a) consists of several stacked superimposed cooling layers, connected together in a sheet, which form between them channels that can be passed through the cooling medium, at least a first and a second collection space respectively being formed by openings in the cooling layers, and the cooling layers having between the two openings a structured screen-like area provided with plurality of bores (26) for channel formation.   19. Method according to one of claims 11 to 18, characterized in that the cooling element (10b) comprises a plurality of cooling cells (30) each having an inlet (31) and a exhaust port (32) for the coolant, the flow direction of coolant through the inlet (31) and outlet (32) ports being perpendicular to the cooling surface of the module semiconductor switching device (5), and a finger structure (28) for forming an inlet chamber (38) and an evacuation chamber (39) on its rear face.   20. The method of claim 19, characterized in that a support (7a, 7b) module is provided for fixing the cooling element (10b) to the support (2) of the stator, the support (7a, 7b). module comprising at least one cooling tank for receiving the cooling element (10b), which is provided with at least one intake orifice and at least one discharge orifice, and is traversed by the agent cooling.