FR2864342B1 - METHOD FOR INTERCONNECTING ELECTRONIC COMPONENTS WITHOUT BRASURE DELIVERY AND ELECTRONIC DEVICE OBTAINED BY SUCH A METHOD - Google Patents

METHOD FOR INTERCONNECTING ELECTRONIC COMPONENTS WITHOUT BRASURE DELIVERY AND ELECTRONIC DEVICE OBTAINED BY SUCH A METHOD

Info

Publication number
FR2864342B1
FR2864342B1 FR0315034A FR0315034A FR2864342B1 FR 2864342 B1 FR2864342 B1 FR 2864342B1 FR 0315034 A FR0315034 A FR 0315034A FR 0315034 A FR0315034 A FR 0315034A FR 2864342 B1 FR2864342 B1 FR 2864342B1
Authority
FR
France
Prior art keywords
brasure
delivery
device obtained
electronic device
interconnecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR0315034A
Other languages
French (fr)
Other versions
FR2864342A1 (en
Inventor
Christian Val
Olivier Lignier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3D Plus SA
Original Assignee
3D Plus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3D Plus SA filed Critical 3D Plus SA
Priority to FR0315034A priority Critical patent/FR2864342B1/en
Publication of FR2864342A1 publication Critical patent/FR2864342A1/en
Application granted granted Critical
Publication of FR2864342B1 publication Critical patent/FR2864342B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
FR0315034A 2003-12-19 2003-12-19 METHOD FOR INTERCONNECTING ELECTRONIC COMPONENTS WITHOUT BRASURE DELIVERY AND ELECTRONIC DEVICE OBTAINED BY SUCH A METHOD Expired - Lifetime FR2864342B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0315034A FR2864342B1 (en) 2003-12-19 2003-12-19 METHOD FOR INTERCONNECTING ELECTRONIC COMPONENTS WITHOUT BRASURE DELIVERY AND ELECTRONIC DEVICE OBTAINED BY SUCH A METHOD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0315034A FR2864342B1 (en) 2003-12-19 2003-12-19 METHOD FOR INTERCONNECTING ELECTRONIC COMPONENTS WITHOUT BRASURE DELIVERY AND ELECTRONIC DEVICE OBTAINED BY SUCH A METHOD

Publications (2)

Publication Number Publication Date
FR2864342A1 FR2864342A1 (en) 2005-06-24
FR2864342B1 true FR2864342B1 (en) 2006-03-03

Family

ID=34630365

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0315034A Expired - Lifetime FR2864342B1 (en) 2003-12-19 2003-12-19 METHOD FOR INTERCONNECTING ELECTRONIC COMPONENTS WITHOUT BRASURE DELIVERY AND ELECTRONIC DEVICE OBTAINED BY SUCH A METHOD

Country Status (1)

Country Link
FR (1) FR2864342B1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2917234B1 (en) 2007-06-07 2009-11-06 Commissariat Energie Atomique MULTI-COMPONENT DEVICE INTEGRATED IN A SEMICONDUCTOR MATRIX
FR2934082B1 (en) 2008-07-21 2011-05-27 Commissariat Energie Atomique MULTI-COMPONENT DEVICE INTEGRATED IN A MATRIX
FR2940521B1 (en) 2008-12-19 2011-11-11 3D Plus COLLECTIVE MANUFACTURING METHOD OF ELECTRONIC MODULES FOR SURFACE MOUNTING
FR2947948B1 (en) 2009-07-09 2012-03-09 Commissariat Energie Atomique HANDLE PLATE HAVING VISUALIZATION WINDOWS
DE102016209840A1 (en) * 2016-06-03 2017-12-07 Continental Teves Ag & Co. Ohg Sensor, method and sensor arrangement

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2298251A1 (en) * 1975-01-14 1976-08-13 Peltier Marc Solderless assembly of wiring and components - minimises manual work required, allows inclusion of touch operated controls and involves bending of components into shape
FR2572849B1 (en) * 1984-11-06 1987-06-19 Thomson Csf HIGH DENSITY MONOLITHIC MODULE COMPRISING INTERCONNECTED ELECTRONIC COMPONENTS AND MANUFACTURING METHOD THEREOF
US4635356A (en) * 1984-12-28 1987-01-13 Kabushiki Kaisha Toshiba Method of manufacturing a circuit module
JPH0744320B2 (en) * 1989-10-20 1995-05-15 松下電器産業株式会社 Resin circuit board and manufacturing method thereof
DE19907295C1 (en) * 1999-02-22 2001-02-08 Univ Dresden Tech Electronic and/or optical component mounting method for rear side of flexible printed circuit board has molded material used for encasing components on front side of circuit board before inversion of latter
JP2003142797A (en) * 2001-11-02 2003-05-16 Matsushita Electric Ind Co Ltd Finished product with electronic component mounted and manufacturing method thereof

Also Published As

Publication number Publication date
FR2864342A1 (en) 2005-06-24

Similar Documents

Publication Publication Date Title
FR2834156B1 (en) METHOD FOR ACCESSING A SERVICE BY RADIO FREQUENCY ASSOCIATED WITH A PORTABLE ELECTRONIC CHIP OBJECT
FR2832241B1 (en) DEVICE TRACEABLE BY AN ELECTRONIC IDENTIFIER
FR2810157B1 (en) METHOD FOR PRODUCING AN ELECTRONIC COMPONENT WITH SOURCE, DRAIN AND SELF-ALLOCATED GRID, IN DAMASCENE ARCHITECTURE
FR2838879B1 (en) ELECTRONIC BOX CONNECTION DEVICE
FR2842984B1 (en) METHOD AND DEVICE FOR SELECTING TELECOMMUNICATION NETWORKS
FR2864342B1 (en) METHOD FOR INTERCONNECTING ELECTRONIC COMPONENTS WITHOUT BRASURE DELIVERY AND ELECTRONIC DEVICE OBTAINED BY SUCH A METHOD
FR2843633B1 (en) POTENTIALLY ALTERNATIVE PURE BENDING TEST METHOD, DEVICE AND MACHINE
FR2841731B1 (en) DEVICE AND METHOD FOR FIXING AN ELECTRONIC COMPONENT TO A CARD AND ELECTRONIC COMPONENT
FR2880189B1 (en) METHOD FOR DEFERRING A CIRCUIT ON A MASS PLAN
FR2796249B1 (en) HARVESTING SORTING DEVICE
FR2828054B1 (en) METHOD AND DEVICE FOR CODING A SCENE
FR2835279B1 (en) METHOD AND DEVICE FOR CONTROLLING AN ELECTRICALLY DRIVEN COMPRESSOR
FR2804264B1 (en) METHOD AND DEVICE FOR ELECTRONIC PAYMENT
FR2862424B1 (en) DEVICE FOR COOLING AN ELECTRICAL COMPONENT AND METHOD FOR MANUFACTURING THE SAME
FR2822342B1 (en) DEVICE FOR COLLECTING FRUITS FALLING FROM A TREE
FR2860934B1 (en) METHOD FOR RECEIVING AN EMAIL BY AN ELECTRONIC COMMUNICATION DEVICE
FR2844396B1 (en) METHOD FOR PRODUCING AN INTEGRATED ELECTRONIC COMPONENT AND ELECTRICAL DEVICE INCORPORATING AN INTEGRATED COMPONENT THUS OBTAINED
FR2827206B1 (en) METHOD AND DEVICE FOR FORMING BOARDS, AND PACKAGES COMPRISING SUCH BOARDS
FR2838598B1 (en) STEREOSCOPIC TELEVISION METHOD AND DEVICE
FR2830978B1 (en) INTEGRATED VARIABLE ELECTRICAL CAPACITY DEVICE AND METHOD FOR PRODUCING SUCH A DEVICE
FR2823376B1 (en) DEVICE AND METHOD FOR MOUNTING AN ELECTRONIC COMPONENT
FR2843979B1 (en) METHOD AND DEVICE FOR STRENGTHENING A WORK
FR2838235B1 (en) DEVICE FOR COOLING AN ELECTRONIC TUBE
FR2850454B1 (en) METHOD FOR ASSEMBLING A PYROTECHNIC SEPARATION DEVICE, AND PYROTECHNIC SEPARATION DEVICE OBTAINED THEREBY
FR2806529B1 (en) METHOD FOR ADJUSTING AN ELECTRICAL PARAMETER ON AN INTEGRATED ELECTRONIC COMPONENT

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 13

PLFP Fee payment

Year of fee payment: 14

PLFP Fee payment

Year of fee payment: 15

PLFP Fee payment

Year of fee payment: 17

PLFP Fee payment

Year of fee payment: 18

PLFP Fee payment

Year of fee payment: 19

PLFP Fee payment

Year of fee payment: 20