FR2858254B1 - METHOD AND DEVICE FOR FILLING WITH A VISCOUS PRODUCT ZONES LOCATED IN HOLLOW OR INTERPIST ON A PRINTED CIRCUIT, AND EQUIPMENT USING SUCH A DEVICE - Google Patents

METHOD AND DEVICE FOR FILLING WITH A VISCOUS PRODUCT ZONES LOCATED IN HOLLOW OR INTERPIST ON A PRINTED CIRCUIT, AND EQUIPMENT USING SUCH A DEVICE

Info

Publication number
FR2858254B1
FR2858254B1 FR0408375A FR0408375A FR2858254B1 FR 2858254 B1 FR2858254 B1 FR 2858254B1 FR 0408375 A FR0408375 A FR 0408375A FR 0408375 A FR0408375 A FR 0408375A FR 2858254 B1 FR2858254 B1 FR 2858254B1
Authority
FR
France
Prior art keywords
interpist
filling
hollow
equipment
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0408375A
Other languages
French (fr)
Other versions
FR2858254A1 (en
Inventor
Francis Bourrieres
Clement Kaiser
Antonio Cicero
Oslovaldo Novello
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novatec SA
Original Assignee
Novatec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR0309351A external-priority patent/FR2858255A1/en
Priority claimed from FR0403455A external-priority patent/FR2858253A1/en
Application filed by Novatec SA filed Critical Novatec SA
Priority to FR0408375A priority Critical patent/FR2858254B1/en
Publication of FR2858254A1 publication Critical patent/FR2858254A1/en
Application granted granted Critical
Publication of FR2858254B1 publication Critical patent/FR2858254B1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/18—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material only one side of the work coming into contact with the liquid or other fluent material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
FR0408375A 2003-07-30 2004-07-29 METHOD AND DEVICE FOR FILLING WITH A VISCOUS PRODUCT ZONES LOCATED IN HOLLOW OR INTERPIST ON A PRINTED CIRCUIT, AND EQUIPMENT USING SUCH A DEVICE Expired - Fee Related FR2858254B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0408375A FR2858254B1 (en) 2003-07-30 2004-07-29 METHOD AND DEVICE FOR FILLING WITH A VISCOUS PRODUCT ZONES LOCATED IN HOLLOW OR INTERPIST ON A PRINTED CIRCUIT, AND EQUIPMENT USING SUCH A DEVICE

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0309351A FR2858255A1 (en) 2003-07-30 2003-07-30 Substrates hollow zone filling method for printed circuit, involves evacuating gas from hollow zone and dielectric product, under form of bubbles, substituting evacuated gas by product, and adjusting thickness of product
FR0403455A FR2858253A1 (en) 2003-07-30 2004-04-02 METHOD AND DEVICE FOR FILLING WITH A VISCOUS PRODUCT ZONES LOCATED IN HOLLOW OR INTERPIST ON A PRINTED CIRCUIT
FR0408375A FR2858254B1 (en) 2003-07-30 2004-07-29 METHOD AND DEVICE FOR FILLING WITH A VISCOUS PRODUCT ZONES LOCATED IN HOLLOW OR INTERPIST ON A PRINTED CIRCUIT, AND EQUIPMENT USING SUCH A DEVICE

Publications (2)

Publication Number Publication Date
FR2858254A1 FR2858254A1 (en) 2005-02-04
FR2858254B1 true FR2858254B1 (en) 2007-10-05

Family

ID=34068749

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0408375A Expired - Fee Related FR2858254B1 (en) 2003-07-30 2004-07-29 METHOD AND DEVICE FOR FILLING WITH A VISCOUS PRODUCT ZONES LOCATED IN HOLLOW OR INTERPIST ON A PRINTED CIRCUIT, AND EQUIPMENT USING SUCH A DEVICE

Country Status (1)

Country Link
FR (1) FR2858254B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7410090B2 (en) * 2006-04-21 2008-08-12 International Business Machines Corporation Conductive bonding material fill techniques
US9314864B2 (en) 2007-07-09 2016-04-19 International Business Machines Corporation C4NP compliant solder fill head seals

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05337425A (en) * 1992-06-04 1993-12-21 Ibiden Co Ltd Method and device for filling viscous paste
JP3085451B2 (en) * 1996-04-22 2000-09-11 富士通株式会社 Production line and multilayer printed wiring board produced thereby
JP3410639B2 (en) * 1997-07-23 2003-05-26 株式会社日立製作所 Paste filling method, soldering method and paste printing machine
FR2803228B1 (en) * 2000-01-03 2002-02-08 Novatec Sa Soc COLLECTIVE FILLING DEVICE OF BORGNATED CAVITIES
JP3952872B2 (en) * 2001-10-10 2007-08-01 株式会社デンソー Fluid substance filling apparatus and filling method
FR2845858B1 (en) * 2002-10-11 2004-12-10 Novatec Sa Soc DEVICE FOR FILLING OPEN AREAS LOCATED IN A HOLLOW WITH RESPECT TO A SURFACE

Also Published As

Publication number Publication date
FR2858254A1 (en) 2005-02-04

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20090331