FR2845858B1 - DEVICE FOR FILLING OPEN AREAS LOCATED IN A HOLLOW WITH RESPECT TO A SURFACE - Google Patents

DEVICE FOR FILLING OPEN AREAS LOCATED IN A HOLLOW WITH RESPECT TO A SURFACE

Info

Publication number
FR2845858B1
FR2845858B1 FR0212711A FR0212711A FR2845858B1 FR 2845858 B1 FR2845858 B1 FR 2845858B1 FR 0212711 A FR0212711 A FR 0212711A FR 0212711 A FR0212711 A FR 0212711A FR 2845858 B1 FR2845858 B1 FR 2845858B1
Authority
FR
France
Prior art keywords
hollow
respect
open areas
areas located
filling open
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0212711A
Other languages
French (fr)
Other versions
FR2845858A1 (en
Inventor
Francis Bourrieres
Clement Kaiser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novatec SA
Original Assignee
Novatec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novatec SA filed Critical Novatec SA
Priority to FR0212711A priority Critical patent/FR2845858B1/en
Publication of FR2845858A1 publication Critical patent/FR2845858A1/en
Application granted granted Critical
Publication of FR2845858B1 publication Critical patent/FR2845858B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR0212711A 2002-10-11 2002-10-11 DEVICE FOR FILLING OPEN AREAS LOCATED IN A HOLLOW WITH RESPECT TO A SURFACE Expired - Fee Related FR2845858B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0212711A FR2845858B1 (en) 2002-10-11 2002-10-11 DEVICE FOR FILLING OPEN AREAS LOCATED IN A HOLLOW WITH RESPECT TO A SURFACE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0212711A FR2845858B1 (en) 2002-10-11 2002-10-11 DEVICE FOR FILLING OPEN AREAS LOCATED IN A HOLLOW WITH RESPECT TO A SURFACE

Publications (2)

Publication Number Publication Date
FR2845858A1 FR2845858A1 (en) 2004-04-16
FR2845858B1 true FR2845858B1 (en) 2004-12-10

Family

ID=32039677

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0212711A Expired - Fee Related FR2845858B1 (en) 2002-10-11 2002-10-11 DEVICE FOR FILLING OPEN AREAS LOCATED IN A HOLLOW WITH RESPECT TO A SURFACE

Country Status (1)

Country Link
FR (1) FR2845858B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2858253A1 (en) * 2003-07-30 2005-02-04 Novatec METHOD AND DEVICE FOR FILLING WITH A VISCOUS PRODUCT ZONES LOCATED IN HOLLOW OR INTERPIST ON A PRINTED CIRCUIT
FR2858254B1 (en) * 2003-07-30 2007-10-05 Novatec METHOD AND DEVICE FOR FILLING WITH A VISCOUS PRODUCT ZONES LOCATED IN HOLLOW OR INTERPIST ON A PRINTED CIRCUIT, AND EQUIPMENT USING SUCH A DEVICE

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6117212A (en) * 1997-07-22 2000-09-12 International Business Machines Corp. System for evacuating air from a viscous media
JP4331834B2 (en) * 1999-09-06 2009-09-16 富士機械製造株式会社 Screen printing method and apparatus

Also Published As

Publication number Publication date
FR2845858A1 (en) 2004-04-16

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20150630