FR2853433B1 - Carte a microcircuit fixee sur un support adaptateur, support de carte et procede de fabrication - Google Patents
Carte a microcircuit fixee sur un support adaptateur, support de carte et procede de fabricationInfo
- Publication number
- FR2853433B1 FR2853433B1 FR0304156A FR0304156A FR2853433B1 FR 2853433 B1 FR2853433 B1 FR 2853433B1 FR 0304156 A FR0304156 A FR 0304156A FR 0304156 A FR0304156 A FR 0304156A FR 2853433 B1 FR2853433 B1 FR 2853433B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- card holder
- board attached
- adapter support
- microcircuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
- G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/005—Record carriers for use with machines and with at least a part designed to carry digital markings the record carrier comprising an arrangement to facilitate insertion into a holding device, e.g. an arrangement that makes the record carrier fit into an etui or a casing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
- G06K19/041—Constructional details
- G06K19/048—Constructional details the record carrier being shaped as a key
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0304156A FR2853433B1 (fr) | 2003-04-03 | 2003-04-03 | Carte a microcircuit fixee sur un support adaptateur, support de carte et procede de fabrication |
FR0311437A FR2853434B1 (fr) | 2003-04-03 | 2003-09-30 | Carte a microcircuit fixee sur un support adaptateur, support de carte et procede de fabrication |
US10/816,827 US7264172B2 (en) | 2003-04-03 | 2004-04-05 | Microcircuit card attached to an adapter base, card base and manufacturing method |
US11/828,571 US7559478B2 (en) | 2003-04-03 | 2007-07-26 | Microcircuit card attached to an adapter base, card base and manufacturing method |
US12/338,332 US7871007B2 (en) | 2003-04-03 | 2008-12-18 | Microcircuit card attached to an adapter base, card base and manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0304156A FR2853433B1 (fr) | 2003-04-03 | 2003-04-03 | Carte a microcircuit fixee sur un support adaptateur, support de carte et procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2853433A1 FR2853433A1 (fr) | 2004-10-08 |
FR2853433B1 true FR2853433B1 (fr) | 2005-08-05 |
Family
ID=32982211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0304156A Expired - Lifetime FR2853433B1 (fr) | 2003-04-03 | 2003-04-03 | Carte a microcircuit fixee sur un support adaptateur, support de carte et procede de fabrication |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2853433B1 (fr) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19650048A1 (de) * | 1996-12-03 | 1998-06-04 | Bayerische Motoren Werke Ag | Speicher für benutzerindividuelle Einstelldaten von Fahrzeug-Ausrüstungsteilen |
DE19713641A1 (de) * | 1997-04-02 | 1998-10-08 | Ods Gmbh & Co Kg | Minichipkarte sowie Verfahren zu ihrer Herstellung |
DE29821087U1 (de) * | 1998-11-25 | 1999-02-11 | Ociepka, Roman, 44809 Bochum | Adapter zur Anpassung eines D-Netz Plug-in-Chips an eine große D-Netz Telefonkarte |
FR2794264B1 (fr) * | 1999-05-27 | 2001-11-02 | Gemplus Card Int | Adaptateur pour dispositif electronique portable a circuit integre, de type carte a puce, d'un format reduit par rapport au format standard d'une mini-carte |
FR2837594B1 (fr) * | 2003-02-04 | 2004-07-16 | Canal Plus Technologies | Objet portable a puce |
-
2003
- 2003-04-03 FR FR0304156A patent/FR2853433B1/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2853433A1 (fr) | 2004-10-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 14 |
|
PLFP | Fee payment |
Year of fee payment: 15 |
|
PLFP | Fee payment |
Year of fee payment: 16 |
|
PLFP | Fee payment |
Year of fee payment: 18 |
|
CA | Change of address |
Effective date: 20201228 |
|
CD | Change of name or company name |
Owner name: IDEMIA FRANCE, FR Effective date: 20201228 |
|
PLFP | Fee payment |
Year of fee payment: 19 |
|
PLFP | Fee payment |
Year of fee payment: 20 |