FR2817656B1 - ELECTRICAL INSULATION OF GROUPED MICROCIRCUITS BEFORE UNIT BONDING - Google Patents

ELECTRICAL INSULATION OF GROUPED MICROCIRCUITS BEFORE UNIT BONDING

Info

Publication number
FR2817656B1
FR2817656B1 FR0015941A FR0015941A FR2817656B1 FR 2817656 B1 FR2817656 B1 FR 2817656B1 FR 0015941 A FR0015941 A FR 0015941A FR 0015941 A FR0015941 A FR 0015941A FR 2817656 B1 FR2817656 B1 FR 2817656B1
Authority
FR
France
Prior art keywords
microcircuits
grouped
electrical insulation
before unit
unit bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0015941A
Other languages
French (fr)
Other versions
FR2817656A1 (en
Inventor
Philippe Patrice
Jean Christophe Fidalgo
Olivier Brunet
Yves Pierre Cuenot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Priority to FR0015941A priority Critical patent/FR2817656B1/en
Priority to AU2002216172A priority patent/AU2002216172A1/en
Priority to PCT/FR2001/003846 priority patent/WO2002047151A2/en
Priority to AU2002216182A priority patent/AU2002216182A1/en
Priority to PCT/FR2001/003834 priority patent/WO2002047161A2/en
Publication of FR2817656A1 publication Critical patent/FR2817656A1/en
Application granted granted Critical
Publication of FR2817656B1 publication Critical patent/FR2817656B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
FR0015941A 2000-12-05 2000-12-05 ELECTRICAL INSULATION OF GROUPED MICROCIRCUITS BEFORE UNIT BONDING Expired - Fee Related FR2817656B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0015941A FR2817656B1 (en) 2000-12-05 2000-12-05 ELECTRICAL INSULATION OF GROUPED MICROCIRCUITS BEFORE UNIT BONDING
AU2002216172A AU2002216172A1 (en) 2000-12-05 2001-12-05 Barrier against overflow for fixing adhesive of a semiconductor chip
PCT/FR2001/003846 WO2002047151A2 (en) 2000-12-05 2001-12-05 Method for making a semiconductor chip using an integrated rigidity layer
AU2002216182A AU2002216182A1 (en) 2000-12-05 2001-12-05 Method for making a semiconductor chip using an integrated rigidity layer
PCT/FR2001/003834 WO2002047161A2 (en) 2000-12-05 2001-12-05 Barrier against overflow for fixing adhesive of a semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0015941A FR2817656B1 (en) 2000-12-05 2000-12-05 ELECTRICAL INSULATION OF GROUPED MICROCIRCUITS BEFORE UNIT BONDING

Publications (2)

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FR2817656A1 FR2817656A1 (en) 2002-06-07
FR2817656B1 true FR2817656B1 (en) 2003-09-26

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Publication number Priority date Publication date Assignee Title
FR2845805B1 (en) * 2002-10-10 2005-06-03 Gemplus Card Int SHUTTERING ADHESIVE FORMING SHUTTLE
DE102006010523B3 (en) 2006-02-20 2007-08-02 Siemens Ag Method and device for contacting an electrical contact surface on a substrate and/or a component on the substrate laminates an insulating film with laser-cut openings and applies electrically conductive material
JP4303282B2 (en) 2006-12-22 2009-07-29 Ｔｄｋ株式会社 Wiring structure of printed wiring board and method for forming the same
EP2357875A1 (en) * 2010-02-16 2011-08-17 Gemalto SA Method for manufacturing an electronic box

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Publication number Priority date Publication date Assignee Title
JPS535970A (en) * 1976-07-07 1978-01-19 Toshiba Corp Semiconductor device
JPS53120271A (en) * 1977-03-29 1978-10-20 Mitsubishi Electric Corp Semiconductor device
JPS5760844A (en) * 1980-09-30 1982-04-13 Nec Corp Semiconductor device
US5144407A (en) * 1989-07-03 1992-09-01 General Electric Company Semiconductor chip protection layer and protected chip
JP3212110B2 (en) * 1991-07-15 2001-09-25 沖電気工業株式会社 Method for manufacturing semiconductor device
JP3128878B2 (en) * 1991-08-23 2001-01-29 ソニー株式会社 Semiconductor device
FR2735284B1 (en) * 1995-06-12 1997-08-29 Solaic Sa CHIP FOR ELECTRONIC CARD COATED WITH A LAYER OF INSULATING MATERIAL AND ELECTRONIC CARD CONTAINING SUCH A CHIP
FR2779272B1 (en) * 1998-05-27 2001-10-12 Gemplus Card Int METHOD FOR MANUFACTURING A MICROMODULE AND A STORAGE MEDIUM COMPRISING SUCH A MICROMODULE
FR2779851B1 (en) * 1998-06-12 2002-11-29 Gemplus Card Int METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT CARD AND CARD OBTAINED
DE19845296A1 (en) * 1998-09-03 2000-03-16 Fraunhofer Ges Forschung Method for contacting a circuit chip
FR2791471B1 (en) * 1999-03-22 2002-01-25 Gemplus Card Int METHOD FOR MANUFACTURING INTEGRATED CIRCUIT CHIPS
FR2806189B1 (en) * 2000-03-10 2002-05-31 Schlumberger Systems & Service REINFORCED INTEGRATED CIRCUIT AND METHOD FOR REINFORCING INTEGRATED CIRCUITS

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WO2002047151A3 (en) 2003-02-13
WO2002047161A2 (en) 2002-06-13
WO2002047151A2 (en) 2002-06-13
AU2002216172A1 (en) 2002-06-18
FR2817656A1 (en) 2002-06-07
WO2002047151B1 (en) 2004-02-26
AU2002216182A1 (en) 2002-06-18
WO2002047161A3 (en) 2003-04-24

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