FR2816866B3 - Dispositif de sciage par fil - Google Patents
Dispositif de sciage par filInfo
- Publication number
- FR2816866B3 FR2816866B3 FR0114622A FR0114622A FR2816866B3 FR 2816866 B3 FR2816866 B3 FR 2816866B3 FR 0114622 A FR0114622 A FR 0114622A FR 0114622 A FR0114622 A FR 0114622A FR 2816866 B3 FR2816866 B3 FR 2816866B3
- Authority
- FR
- France
- Prior art keywords
- sawing device
- wire sawing
- wire
- sawing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
- B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/929—Tool or tool with support
- Y10T83/9292—Wire tool
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH02256/00A CH694182A5 (fr) | 2000-11-20 | 2000-11-20 | Dispositif de sciage par fil. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2816866A3 FR2816866A3 (fr) | 2002-05-24 |
FR2816866B3 true FR2816866B3 (fr) | 2002-10-04 |
Family
ID=4568243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0114622A Expired - Lifetime FR2816866B3 (fr) | 2000-11-20 | 2001-11-12 | Dispositif de sciage par fil |
Country Status (4)
Country | Link |
---|---|
US (1) | US6550364B2 (fr) |
JP (1) | JP2002210645A (fr) |
CH (1) | CH694182A5 (fr) |
FR (1) | FR2816866B3 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030170948A1 (en) * | 2002-03-07 | 2003-09-11 | Memc Electronic Materials, Inc. | Method and apparatus for slicing semiconductor wafers |
GB2414204B (en) * | 2004-05-18 | 2006-04-12 | David Ainsworth Hukin | Abrasive wire sawing |
JP4818848B2 (ja) * | 2006-08-28 | 2011-11-16 | コマツNtc株式会社 | ワイヤソー |
DE102007019566B4 (de) * | 2007-04-25 | 2012-11-29 | Siltronic Ag | Drahtführungsrolle für Drahtsäge |
WO2009102630A1 (fr) * | 2008-02-11 | 2009-08-20 | Memc Electronic Materials, Inc. | Faisceau de scie à fil renforcé par des nanotubes de carbone utilisé dans un découpage de lingots en tranches par scie à fil |
CN102398314B (zh) * | 2010-09-17 | 2014-05-21 | 上海日进机床有限公司 | 金刚线切片机 |
EP2586554A1 (fr) * | 2011-10-27 | 2013-05-01 | Applied Materials Switzerland Sàrl | Dispositif de scie à fil avec deux grilles de fils indépendantes et son procédé de fonctionnement |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5181503A (en) * | 1991-06-26 | 1993-01-26 | W. F. Meyers Company, Inc. | Stone slab saw |
JP2516717B2 (ja) * | 1991-11-29 | 1996-07-24 | 信越半導体株式会社 | ワイヤソ―及びその切断方法 |
US6067976A (en) * | 1994-01-10 | 2000-05-30 | Tokyo Seimitsu Co., Ltd. | Wafer cut method with wire saw apparatus and apparatus thereof |
CH690845A5 (de) * | 1994-05-19 | 2001-02-15 | Tokyo Seimitsu Co Ltd | Verfahren zum Positionieren eines Werkstücks und Vorrichtung hierfür. |
JP3427956B2 (ja) * | 1995-04-14 | 2003-07-22 | 信越半導体株式会社 | ワイヤーソー装置 |
US5944007A (en) * | 1996-02-08 | 1999-08-31 | Tokyo Rope Mfg. Co., Ltd. | Wire type slicing machine and method |
CZ283541B6 (cs) * | 1996-03-06 | 1998-04-15 | Trimex Tesla, S.R.O. | Způsob řezání ingotů z tvrdých materiálů na desky a pila k provádění tohoto způsobu |
DE19739966A1 (de) * | 1997-09-11 | 1999-03-18 | Wacker Siltronic Halbleitermat | Drahtsäge und Verfahren zum Abtrennen von Formkörpern |
CH692485A5 (fr) * | 1998-02-13 | 2002-07-15 | Hct Shaping Systems Sa | Dispositif de sciage par fil. |
-
2000
- 2000-11-20 CH CH02256/00A patent/CH694182A5/fr not_active IP Right Cessation
-
2001
- 2001-11-12 FR FR0114622A patent/FR2816866B3/fr not_active Expired - Lifetime
- 2001-11-14 JP JP2001348259A patent/JP2002210645A/ja active Pending
- 2001-11-19 US US09/988,182 patent/US6550364B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2816866A3 (fr) | 2002-05-24 |
CH694182A5 (fr) | 2004-08-31 |
US20020100354A1 (en) | 2002-08-01 |
JP2002210645A (ja) | 2002-07-30 |
US6550364B2 (en) | 2003-04-22 |
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