FR2809541B1 - Forme de micropoint forme par faisceau laser et procede de marquage de micropoints - Google Patents
Forme de micropoint forme par faisceau laser et procede de marquage de micropointsInfo
- Publication number
- FR2809541B1 FR2809541B1 FR0006641A FR0006641A FR2809541B1 FR 2809541 B1 FR2809541 B1 FR 2809541B1 FR 0006641 A FR0006641 A FR 0006641A FR 0006641 A FR0006641 A FR 0006641A FR 2809541 B1 FR2809541 B1 FR 2809541B1
- Authority
- FR
- France
- Prior art keywords
- micropoints
- micropoint
- marking
- shape
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Molecular Biology (AREA)
- General Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0006641A FR2809541B1 (fr) | 2000-05-24 | 2000-05-24 | Forme de micropoint forme par faisceau laser et procede de marquage de micropoints |
DE10025835A DE10025835B4 (de) | 1999-11-22 | 2000-05-25 | Mikropunktmarkierungsverfahren |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0006641A FR2809541B1 (fr) | 2000-05-24 | 2000-05-24 | Forme de micropoint forme par faisceau laser et procede de marquage de micropoints |
DE10025835A DE10025835B4 (de) | 1999-11-22 | 2000-05-25 | Mikropunktmarkierungsverfahren |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2809541A1 FR2809541A1 (fr) | 2001-11-30 |
FR2809541B1 true FR2809541B1 (fr) | 2005-06-10 |
Family
ID=26005824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0006641A Expired - Fee Related FR2809541B1 (fr) | 1999-11-22 | 2000-05-24 | Forme de micropoint forme par faisceau laser et procede de marquage de micropoints |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2809541B1 (fr) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5984515A (ja) * | 1982-11-08 | 1984-05-16 | Toshiba Corp | レ−ザ光による半導体基板へのマ−キング方法 |
JP2658351B2 (ja) * | 1989-02-03 | 1997-09-30 | 日本電気株式会社 | レーザマーキング装置 |
JPH10284359A (ja) * | 1997-04-11 | 1998-10-23 | Mitsubishi Electric Corp | ウエハの認識装置及びウエハの認識方法 |
JP3191918B2 (ja) * | 1997-11-25 | 2001-07-23 | 株式会社小松製作所 | 微小ドットマークが刻印されてなる半導体ウェハ |
JPH11156563A (ja) * | 1997-11-25 | 1999-06-15 | Komatsu Ltd | レーザ光による微小マーキング装置とそのマーキング方法 |
-
2000
- 2000-05-24 FR FR0006641A patent/FR2809541B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2809541A1 (fr) | 2001-11-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20160129 |