FR2803093B1 - Procede de realisation d'interconnexions metalliques isolees dans des circuits integres - Google Patents

Procede de realisation d'interconnexions metalliques isolees dans des circuits integres

Info

Publication number
FR2803093B1
FR2803093B1 FR9916489A FR9916489A FR2803093B1 FR 2803093 B1 FR2803093 B1 FR 2803093B1 FR 9916489 A FR9916489 A FR 9916489A FR 9916489 A FR9916489 A FR 9916489A FR 2803093 B1 FR2803093 B1 FR 2803093B1
Authority
FR
France
Prior art keywords
integrated circuits
metal interconnections
isolated metal
producing isolated
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9916489A
Other languages
English (en)
Other versions
FR2803093A1 (fr
Inventor
Philippe Gayet
Joaquim Torres
Michel Haond
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR9916489A priority Critical patent/FR2803093B1/fr
Publication of FR2803093A1 publication Critical patent/FR2803093A1/fr
Application granted granted Critical
Publication of FR2803093B1 publication Critical patent/FR2803093B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/7682—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing the dielectric comprising air gaps

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR9916489A 1999-12-24 1999-12-24 Procede de realisation d'interconnexions metalliques isolees dans des circuits integres Expired - Fee Related FR2803093B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9916489A FR2803093B1 (fr) 1999-12-24 1999-12-24 Procede de realisation d'interconnexions metalliques isolees dans des circuits integres

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9916489A FR2803093B1 (fr) 1999-12-24 1999-12-24 Procede de realisation d'interconnexions metalliques isolees dans des circuits integres

Publications (2)

Publication Number Publication Date
FR2803093A1 FR2803093A1 (fr) 2001-06-29
FR2803093B1 true FR2803093B1 (fr) 2002-11-29

Family

ID=9553834

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9916489A Expired - Fee Related FR2803093B1 (fr) 1999-12-24 1999-12-24 Procede de realisation d'interconnexions metalliques isolees dans des circuits integres

Country Status (1)

Country Link
FR (1) FR2803093B1 (fr)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0689246B1 (fr) * 1994-05-27 2003-08-27 Texas Instruments Incorporated Améliorations concernant des dispositifs semi-conducteurs
US5792706A (en) * 1996-06-05 1998-08-11 Advanced Micro Devices, Inc. Interlevel dielectric with air gaps to reduce permitivity

Also Published As

Publication number Publication date
FR2803093A1 (fr) 2001-06-29

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20090831