FR2802764B1 - Methode et dispositif de soudure de composants - Google Patents

Methode et dispositif de soudure de composants

Info

Publication number
FR2802764B1
FR2802764B1 FR9916304A FR9916304A FR2802764B1 FR 2802764 B1 FR2802764 B1 FR 2802764B1 FR 9916304 A FR9916304 A FR 9916304A FR 9916304 A FR9916304 A FR 9916304A FR 2802764 B1 FR2802764 B1 FR 2802764B1
Authority
FR
France
Prior art keywords
welding method
component welding
component
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9916304A
Other languages
English (en)
Other versions
FR2802764A1 (fr
Inventor
Christian Schmit
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FCI SA
Original Assignee
Framatome Connectors International SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Framatome Connectors International SAS filed Critical Framatome Connectors International SAS
Priority to FR9916304A priority Critical patent/FR2802764B1/fr
Priority to EP00127249A priority patent/EP1118411A1/fr
Publication of FR2802764A1 publication Critical patent/FR2802764A1/fr
Application granted granted Critical
Publication of FR2802764B1 publication Critical patent/FR2802764B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR9916304A 1999-12-17 1999-12-17 Methode et dispositif de soudure de composants Expired - Fee Related FR2802764B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9916304A FR2802764B1 (fr) 1999-12-17 1999-12-17 Methode et dispositif de soudure de composants
EP00127249A EP1118411A1 (fr) 1999-12-17 2000-12-15 Méthode et dispositif de brasage de composants

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9916304A FR2802764B1 (fr) 1999-12-17 1999-12-17 Methode et dispositif de soudure de composants

Publications (2)

Publication Number Publication Date
FR2802764A1 FR2802764A1 (fr) 2001-06-22
FR2802764B1 true FR2802764B1 (fr) 2002-11-08

Family

ID=9553678

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9916304A Expired - Fee Related FR2802764B1 (fr) 1999-12-17 1999-12-17 Methode et dispositif de soudure de composants

Country Status (2)

Country Link
EP (1) EP1118411A1 (fr)
FR (1) FR2802764B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2895924B1 (fr) * 2006-01-10 2009-09-25 Valeo Electronique Sys Liaison Procede de brasage entre eux d'au moins deux organes empiles

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0209650A3 (fr) * 1985-06-07 1989-07-05 Vanzetti Systems, Inc. Méthode et appareil pour placer et connecter électriquement des composants sur une plaquette à circuit imprimé
US4845335A (en) * 1988-01-28 1989-07-04 Microelectronics And Computer Technology Corporation Laser Bonding apparatus and method
FR2659886A1 (fr) * 1990-03-26 1991-09-27 Mafond Luc Procede et dispositif destines au chauffage d'une matiere de soudage.
US5175410A (en) * 1991-06-28 1992-12-29 Digital Equipment Corporation IC package hold-down fixture
US6204490B1 (en) * 1998-06-04 2001-03-20 Hitachi, Ltd. Method and apparatus of manufacturing an electronic circuit board

Also Published As

Publication number Publication date
EP1118411A1 (fr) 2001-07-25
FR2802764A1 (fr) 2001-06-22

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20070831