FR2751164B3 - Ensemble de ventilateur pour circuit integre - Google Patents
Ensemble de ventilateur pour circuit integreInfo
- Publication number
- FR2751164B3 FR2751164B3 FR9608618A FR9608618A FR2751164B3 FR 2751164 B3 FR2751164 B3 FR 2751164B3 FR 9608618 A FR9608618 A FR 9608618A FR 9608618 A FR9608618 A FR 9608618A FR 2751164 B3 FR2751164 B3 FR 2751164B3
- Authority
- FR
- France
- Prior art keywords
- integrated circuit
- fan assembly
- fan
- assembly
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Amplifiers (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9612747A GB2314453B (en) | 1996-06-19 | 1996-06-19 | Fan assembly for an integrated circuit |
US08/668,629 US5690468A (en) | 1996-06-19 | 1996-06-19 | Fan assembly for an integrated circuit |
DE29611158U DE29611158U1 (de) | 1996-06-19 | 1996-06-26 | Lüfteranordnung für einen integrierten Schaltkreis |
FR9608618A FR2751164B3 (fr) | 1996-06-19 | 1996-07-10 | Ensemble de ventilateur pour circuit integre |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9612747A GB2314453B (en) | 1996-06-19 | 1996-06-19 | Fan assembly for an integrated circuit |
US08/668,629 US5690468A (en) | 1996-06-19 | 1996-06-19 | Fan assembly for an integrated circuit |
DE29611158U DE29611158U1 (de) | 1996-06-19 | 1996-06-26 | Lüfteranordnung für einen integrierten Schaltkreis |
FR9608618A FR2751164B3 (fr) | 1996-06-19 | 1996-07-10 | Ensemble de ventilateur pour circuit integre |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2751164A3 FR2751164A3 (fr) | 1998-01-16 |
FR2751164B3 true FR2751164B3 (fr) | 1998-05-29 |
Family
ID=27439126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9608618A Expired - Lifetime FR2751164B3 (fr) | 1996-06-19 | 1996-07-10 | Ensemble de ventilateur pour circuit integre |
Country Status (4)
Country | Link |
---|---|
US (1) | US5690468A (fr) |
DE (1) | DE29611158U1 (fr) |
FR (1) | FR2751164B3 (fr) |
GB (1) | GB2314453B (fr) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6352103B1 (en) * | 1996-05-22 | 2002-03-05 | Intel Corporation | High performance notebook PC cooling system |
JP3206436B2 (ja) * | 1996-07-03 | 2001-09-10 | 松下電器産業株式会社 | ヒートシンク装置 |
JP4290232B2 (ja) * | 1997-02-24 | 2009-07-01 | 富士通株式会社 | ヒートシンクとそれを使用する情報処理装置 |
US6501652B2 (en) | 1997-02-24 | 2002-12-31 | Fujitsu Limited | Heat sink and information processor using it |
JP3942248B2 (ja) | 1997-02-24 | 2007-07-11 | 富士通株式会社 | ヒートシンクおよびそれを搭載した情報処理装置 |
DE19712723A1 (de) * | 1997-03-26 | 1998-10-01 | Ego Elektro Geraetebau Gmbh | Kühlkörper |
US6152213A (en) * | 1997-03-27 | 2000-11-28 | Fujitsu Limited | Cooling system for electronic packages |
USD418216S (en) * | 1997-10-07 | 1999-12-28 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat dissipation fan |
GB2330901B (en) * | 1997-11-04 | 2001-05-09 | Sunonwealth Electr Mach Ind Co | Heat dissipation device |
US6357515B1 (en) * | 1998-02-23 | 2002-03-19 | Intel Corporation | Heat exchanger for a portable computing device utilizing active and passive heat dissipation mechanisms |
US6311767B1 (en) * | 1999-05-26 | 2001-11-06 | Intel Corporation | Computer fan assembly |
US6108206A (en) * | 1999-06-21 | 2000-08-22 | General Electric Company | Semiconductor thermal protection arrangement |
US6154959A (en) * | 1999-08-16 | 2000-12-05 | Chromalloy Gas Turbine Corporation | Laser cladding a turbine engine vane platform |
US6249435B1 (en) | 1999-08-16 | 2001-06-19 | General Electric Company | Thermally efficient motor controller assembly |
US6394175B1 (en) * | 2000-01-13 | 2002-05-28 | Lucent Technologies Inc. | Top mounted cooling device using heat pipes |
US6328097B1 (en) * | 2000-06-30 | 2001-12-11 | Intel Corporation | Integrated heat dissipation apparatus |
US6621698B2 (en) * | 2001-05-29 | 2003-09-16 | Intel Corporation | Computer assembly providing cooling for more than one electronic component |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3069819B2 (ja) * | 1992-05-28 | 2000-07-24 | 富士通株式会社 | ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置 |
JP2938704B2 (ja) * | 1993-03-19 | 1999-08-25 | 富士通株式会社 | 集積回路パッケージ |
US5377745A (en) * | 1993-11-30 | 1995-01-03 | Hsieh; Hsin M. | Cooling device for central processing unit |
GB2293487B (en) * | 1994-09-21 | 1998-08-12 | Hewlett Packard Co | Method and apparatus for attaching a heat sink and a fan to an intergrated circuit package |
JPH08204373A (ja) * | 1995-01-27 | 1996-08-09 | Diamond Electric Mfg Co Ltd | 放熱装置 |
US5570271A (en) * | 1995-03-03 | 1996-10-29 | Aavid Engineering, Inc. | Heat sink assemblies |
US5602719A (en) * | 1995-11-13 | 1997-02-11 | Intel Corporation | No handle zip socket |
-
1996
- 1996-06-19 US US08/668,629 patent/US5690468A/en not_active Expired - Fee Related
- 1996-06-19 GB GB9612747A patent/GB2314453B/en not_active Expired - Fee Related
- 1996-06-26 DE DE29611158U patent/DE29611158U1/de not_active Expired - Lifetime
- 1996-07-10 FR FR9608618A patent/FR2751164B3/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
GB9612747D0 (en) | 1996-08-21 |
GB2314453B (en) | 2001-03-14 |
US5690468A (en) | 1997-11-25 |
DE29611158U1 (de) | 1996-09-05 |
GB2314453A (en) | 1997-12-24 |
FR2751164A3 (fr) | 1998-01-16 |
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