FR2751164B3 - Ensemble de ventilateur pour circuit integre - Google Patents

Ensemble de ventilateur pour circuit integre

Info

Publication number
FR2751164B3
FR2751164B3 FR9608618A FR9608618A FR2751164B3 FR 2751164 B3 FR2751164 B3 FR 2751164B3 FR 9608618 A FR9608618 A FR 9608618A FR 9608618 A FR9608618 A FR 9608618A FR 2751164 B3 FR2751164 B3 FR 2751164B3
Authority
FR
France
Prior art keywords
integrated circuit
fan assembly
fan
assembly
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9608618A
Other languages
English (en)
Other versions
FR2751164A3 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US08/668,629 priority Critical patent/US5690468A/en
Priority to GB9612747A priority patent/GB2314453B/en
Priority to DE29611158U priority patent/DE29611158U1/de
Application filed by Individual filed Critical Individual
Priority to FR9608618A priority patent/FR2751164B3/fr
Publication of FR2751164A3 publication Critical patent/FR2751164A3/fr
Application granted granted Critical
Publication of FR2751164B3 publication Critical patent/FR2751164B3/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR9608618A 1996-06-19 1996-07-10 Ensemble de ventilateur pour circuit integre Expired - Lifetime FR2751164B3 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US08/668,629 US5690468A (en) 1996-06-19 1996-06-19 Fan assembly for an integrated circuit
GB9612747A GB2314453B (en) 1996-06-19 1996-06-19 Fan assembly for an integrated circuit
DE29611158U DE29611158U1 (de) 1996-06-19 1996-06-26 Lüfteranordnung für einen integrierten Schaltkreis
FR9608618A FR2751164B3 (fr) 1996-06-19 1996-07-10 Ensemble de ventilateur pour circuit integre

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/668,629 US5690468A (en) 1996-06-19 1996-06-19 Fan assembly for an integrated circuit
GB9612747A GB2314453B (en) 1996-06-19 1996-06-19 Fan assembly for an integrated circuit
DE29611158U DE29611158U1 (de) 1996-06-19 1996-06-26 Lüfteranordnung für einen integrierten Schaltkreis
FR9608618A FR2751164B3 (fr) 1996-06-19 1996-07-10 Ensemble de ventilateur pour circuit integre

Publications (2)

Publication Number Publication Date
FR2751164A3 FR2751164A3 (fr) 1998-01-16
FR2751164B3 true FR2751164B3 (fr) 1998-05-29

Family

ID=27439126

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9608618A Expired - Lifetime FR2751164B3 (fr) 1996-06-19 1996-07-10 Ensemble de ventilateur pour circuit integre

Country Status (4)

Country Link
US (1) US5690468A (fr)
DE (1) DE29611158U1 (fr)
FR (1) FR2751164B3 (fr)
GB (1) GB2314453B (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6352103B1 (en) * 1996-05-22 2002-03-05 Intel Corporation High performance notebook PC cooling system
JP3206436B2 (ja) * 1996-07-03 2001-09-10 松下電器産業株式会社 ヒートシンク装置
JP4290232B2 (ja) 1997-02-24 2009-07-01 富士通株式会社 ヒートシンクとそれを使用する情報処理装置
US6501652B2 (en) 1997-02-24 2002-12-31 Fujitsu Limited Heat sink and information processor using it
JP3942248B2 (ja) * 1997-02-24 2007-07-11 富士通株式会社 ヒートシンクおよびそれを搭載した情報処理装置
DE19712723A1 (de) * 1997-03-26 1998-10-01 Ego Elektro Geraetebau Gmbh Kühlkörper
US6152213A (en) * 1997-03-27 2000-11-28 Fujitsu Limited Cooling system for electronic packages
USD418216S (en) * 1997-10-07 1999-12-28 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipation fan
GB2330901B (en) * 1997-11-04 2001-05-09 Sunonwealth Electr Mach Ind Co Heat dissipation device
US6848499B1 (en) * 1998-02-23 2005-02-01 Intel Corporation Heat exchanger for a portable computing device utilizing active and passive heat dissipation mechanisms
US6311767B1 (en) * 1999-05-26 2001-11-06 Intel Corporation Computer fan assembly
US6108206A (en) * 1999-06-21 2000-08-22 General Electric Company Semiconductor thermal protection arrangement
US6249435B1 (en) 1999-08-16 2001-06-19 General Electric Company Thermally efficient motor controller assembly
US6154959A (en) * 1999-08-16 2000-12-05 Chromalloy Gas Turbine Corporation Laser cladding a turbine engine vane platform
US6394175B1 (en) * 2000-01-13 2002-05-28 Lucent Technologies Inc. Top mounted cooling device using heat pipes
US6328097B1 (en) * 2000-06-30 2001-12-11 Intel Corporation Integrated heat dissipation apparatus
US6621698B2 (en) * 2001-05-29 2003-09-16 Intel Corporation Computer assembly providing cooling for more than one electronic component

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3069819B2 (ja) * 1992-05-28 2000-07-24 富士通株式会社 ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置
JP2938704B2 (ja) * 1993-03-19 1999-08-25 富士通株式会社 集積回路パッケージ
US5377745A (en) * 1993-11-30 1995-01-03 Hsieh; Hsin M. Cooling device for central processing unit
GB2293487B (en) * 1994-09-21 1998-08-12 Hewlett Packard Co Method and apparatus for attaching a heat sink and a fan to an intergrated circuit package
JPH08204373A (ja) * 1995-01-27 1996-08-09 Diamond Electric Mfg Co Ltd 放熱装置
US5570271A (en) * 1995-03-03 1996-10-29 Aavid Engineering, Inc. Heat sink assemblies
US5602719A (en) * 1995-11-13 1997-02-11 Intel Corporation No handle zip socket

Also Published As

Publication number Publication date
GB2314453B (en) 2001-03-14
DE29611158U1 (de) 1996-09-05
GB2314453A (en) 1997-12-24
GB9612747D0 (en) 1996-08-21
FR2751164A3 (fr) 1998-01-16
US5690468A (en) 1997-11-25

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