FR2751164A3 - Ventilation appts. for integrated circuit - Google Patents

Ventilation appts. for integrated circuit

Info

Publication number
FR2751164A3
FR2751164A3 FR9608618A FR9608618A FR2751164A3 FR 2751164 A3 FR2751164 A3 FR 2751164A3 FR 9608618 A FR9608618 A FR 9608618A FR 9608618 A FR9608618 A FR 9608618A FR 2751164 A3 FR2751164 A3 FR 2751164A3
Authority
FR
France
Prior art keywords
integrated circuit
rib plate
plate
appts
ribs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR9608618A
Other languages
French (fr)
Other versions
FR2751164B3 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to GB9612747A priority Critical patent/GB2314453B/en
Priority to US08/668,629 priority patent/US5690468A/en
Priority to DE29611158U priority patent/DE29611158U1/en
Application filed by Individual filed Critical Individual
Priority to FR9608618A priority patent/FR2751164B3/en
Publication of FR2751164A3 publication Critical patent/FR2751164A3/en
Application granted granted Critical
Publication of FR2751164B3 publication Critical patent/FR2751164B3/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Amplifiers (AREA)

Abstract

The appts. includes a rib plate (3), an upper plate (1), and a ventilator unit (2). Also provided is a heat conductor (4) connected to an integrated circuit (5) or the rib plate. The rib plate has ribs (31) provided in rows and columns with a central space (32) and intermediate spaces (33) between the ribs within which the heat conductor may be placed. The rib plate possesses a flat undersurface for making good contact with the integrated circuit and is made of material with a high coefficient of thermal conductivity, such as aluminium or copper. The ribs should be integral with the plate. The ventilator unit has an air wheel that is rotatable in the central space of the rib plate and it has several pegs which are held in holes in the upper plate.
FR9608618A 1996-06-19 1996-07-10 FAN ASSEMBLY FOR INTEGRATED CIRCUIT Expired - Lifetime FR2751164B3 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB9612747A GB2314453B (en) 1996-06-19 1996-06-19 Fan assembly for an integrated circuit
US08/668,629 US5690468A (en) 1996-06-19 1996-06-19 Fan assembly for an integrated circuit
DE29611158U DE29611158U1 (en) 1996-06-19 1996-06-26 Fan arrangement for an integrated circuit
FR9608618A FR2751164B3 (en) 1996-06-19 1996-07-10 FAN ASSEMBLY FOR INTEGRATED CIRCUIT

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB9612747A GB2314453B (en) 1996-06-19 1996-06-19 Fan assembly for an integrated circuit
US08/668,629 US5690468A (en) 1996-06-19 1996-06-19 Fan assembly for an integrated circuit
DE29611158U DE29611158U1 (en) 1996-06-19 1996-06-26 Fan arrangement for an integrated circuit
FR9608618A FR2751164B3 (en) 1996-06-19 1996-07-10 FAN ASSEMBLY FOR INTEGRATED CIRCUIT

Publications (2)

Publication Number Publication Date
FR2751164A3 true FR2751164A3 (en) 1998-01-16
FR2751164B3 FR2751164B3 (en) 1998-05-29

Family

ID=27439126

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9608618A Expired - Lifetime FR2751164B3 (en) 1996-06-19 1996-07-10 FAN ASSEMBLY FOR INTEGRATED CIRCUIT

Country Status (4)

Country Link
US (1) US5690468A (en)
DE (1) DE29611158U1 (en)
FR (1) FR2751164B3 (en)
GB (1) GB2314453B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6352103B1 (en) * 1996-05-22 2002-03-05 Intel Corporation High performance notebook PC cooling system
JP3206436B2 (en) * 1996-07-03 2001-09-10 松下電器産業株式会社 Heat sink device
JP3942248B2 (en) 1997-02-24 2007-07-11 富士通株式会社 Heat sink and information processing apparatus equipped with the same
US6501652B2 (en) 1997-02-24 2002-12-31 Fujitsu Limited Heat sink and information processor using it
JP4290232B2 (en) 1997-02-24 2009-07-01 富士通株式会社 Heat sink and information processing device using it
DE19712723A1 (en) * 1997-03-26 1998-10-01 Ego Elektro Geraetebau Gmbh Electronic component cooler
US6152213A (en) * 1997-03-27 2000-11-28 Fujitsu Limited Cooling system for electronic packages
USD418216S (en) * 1997-10-07 1999-12-28 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipation fan
GB2330901B (en) * 1997-11-04 2001-05-09 Sunonwealth Electr Mach Ind Co Heat dissipation device
US6848499B1 (en) * 1998-02-23 2005-02-01 Intel Corporation Heat exchanger for a portable computing device utilizing active and passive heat dissipation mechanisms
US6311767B1 (en) * 1999-05-26 2001-11-06 Intel Corporation Computer fan assembly
US6108206A (en) * 1999-06-21 2000-08-22 General Electric Company Semiconductor thermal protection arrangement
US6249435B1 (en) 1999-08-16 2001-06-19 General Electric Company Thermally efficient motor controller assembly
US6154959A (en) * 1999-08-16 2000-12-05 Chromalloy Gas Turbine Corporation Laser cladding a turbine engine vane platform
US6394175B1 (en) * 2000-01-13 2002-05-28 Lucent Technologies Inc. Top mounted cooling device using heat pipes
US6328097B1 (en) * 2000-06-30 2001-12-11 Intel Corporation Integrated heat dissipation apparatus
US6621698B2 (en) * 2001-05-29 2003-09-16 Intel Corporation Computer assembly providing cooling for more than one electronic component

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3069819B2 (en) * 1992-05-28 2000-07-24 富士通株式会社 Heat sink, heat sink fixture used for the heat sink, and portable electronic device using the heat sink
JP2938704B2 (en) * 1993-03-19 1999-08-25 富士通株式会社 Integrated circuit package
US5377745A (en) * 1993-11-30 1995-01-03 Hsieh; Hsin M. Cooling device for central processing unit
GB2293487B (en) * 1994-09-21 1998-08-12 Hewlett Packard Co Method and apparatus for attaching a heat sink and a fan to an intergrated circuit package
JPH08204373A (en) * 1995-01-27 1996-08-09 Diamond Electric Mfg Co Ltd Radiator
US5570271A (en) * 1995-03-03 1996-10-29 Aavid Engineering, Inc. Heat sink assemblies
US5602719A (en) * 1995-11-13 1997-02-11 Intel Corporation No handle zip socket

Also Published As

Publication number Publication date
GB9612747D0 (en) 1996-08-21
DE29611158U1 (en) 1996-09-05
GB2314453A (en) 1997-12-24
US5690468A (en) 1997-11-25
GB2314453B (en) 2001-03-14
FR2751164B3 (en) 1998-05-29

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