FR2751131B1 - METHOD FOR MANUFACTURING A LIQUID CRYSTAL ACTIVE MATRIX DISPLAY DEVICE AND STRUCTURE OF THE DISPLAY DEVICE ACCORDING TO THIS METHOD - Google Patents

METHOD FOR MANUFACTURING A LIQUID CRYSTAL ACTIVE MATRIX DISPLAY DEVICE AND STRUCTURE OF THE DISPLAY DEVICE ACCORDING TO THIS METHOD

Info

Publication number
FR2751131B1
FR2751131B1 FR9708020A FR9708020A FR2751131B1 FR 2751131 B1 FR2751131 B1 FR 2751131B1 FR 9708020 A FR9708020 A FR 9708020A FR 9708020 A FR9708020 A FR 9708020A FR 2751131 B1 FR2751131 B1 FR 2751131B1
Authority
FR
France
Prior art keywords
display device
manufacturing
liquid crystal
active matrix
crystal active
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9708020A
Other languages
French (fr)
Other versions
FR2751131A1 (en
Inventor
Jeong Hyun Kim
Sung Il Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Electronics Inc
Original Assignee
LG Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1019960027655A external-priority patent/KR100213966B1/en
Priority claimed from KR1019960027653A external-priority patent/KR100213967B1/en
Application filed by LG Electronics Inc filed Critical LG Electronics Inc
Publication of FR2751131A1 publication Critical patent/FR2751131A1/en
Application granted granted Critical
Publication of FR2751131B1 publication Critical patent/FR2751131B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • H01L27/127Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136227Through-hole connection of the pixel electrode to the active element through an insulation layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046Dry cleaning only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008Making conductor-insulator-semiconductor electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/4908Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/6675Amorphous silicon or polysilicon transistors
    • H01L29/66765Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651Silicon transistors
    • H01L29/7866Non-monocrystalline silicon transistors
    • H01L29/78663Amorphous silicon transistors
    • H01L29/78669Amorphous silicon transistors with inverted-type structure, e.g. with bottom gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
FR9708020A 1996-07-09 1997-06-26 METHOD FOR MANUFACTURING A LIQUID CRYSTAL ACTIVE MATRIX DISPLAY DEVICE AND STRUCTURE OF THE DISPLAY DEVICE ACCORDING TO THIS METHOD Expired - Lifetime FR2751131B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019960027655A KR100213966B1 (en) 1996-07-09 1996-07-09 Active matrix liquid crystal display device and its manufacturing method
KR1019960027653A KR100213967B1 (en) 1996-07-09 1996-07-09 Manufacturing method of active matrix liquid crystal display device and active matrix liquid crystal display device

Publications (2)

Publication Number Publication Date
FR2751131A1 FR2751131A1 (en) 1998-01-16
FR2751131B1 true FR2751131B1 (en) 2001-11-09

Family

ID=26631999

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9708020A Expired - Lifetime FR2751131B1 (en) 1996-07-09 1997-06-26 METHOD FOR MANUFACTURING A LIQUID CRYSTAL ACTIVE MATRIX DISPLAY DEVICE AND STRUCTURE OF THE DISPLAY DEVICE ACCORDING TO THIS METHOD

Country Status (4)

Country Link
JP (1) JPH1082997A (en)
DE (1) DE19729176C2 (en)
FR (1) FR2751131B1 (en)
GB (1) GB2315158B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100251091B1 (en) * 1996-11-29 2000-04-15 구본준 Method of manufacturing liquid crystal display device and liquid crystal display device
US6541369B2 (en) * 1999-12-07 2003-04-01 Applied Materials, Inc. Method and apparatus for reducing fixed charges in a semiconductor device
JP2001196591A (en) 2000-01-13 2001-07-19 Internatl Business Mach Corp <Ibm> Thin-film transistor and manufacturing method therefor
US6794311B2 (en) 2000-07-14 2004-09-21 Applied Materials Inc. Method and apparatus for treating low k dielectric layers to reduce diffusion
KR100720099B1 (en) * 2001-06-21 2007-05-18 삼성전자주식회사 Thin film transistor plate and fabricating method thereof
JP2006178393A (en) * 2004-11-24 2006-07-06 Ricoh Co Ltd Image reader, and recording device with image reader
KR101213871B1 (en) * 2005-12-15 2012-12-18 엘지디스플레이 주식회사 Thin film transistor array substrate and manufacturing method of the same
KR101251351B1 (en) 2005-12-28 2013-04-05 삼성디스플레이 주식회사 Thin film transistor substrate, method for making the substrate and display panel having the substrate
KR101217182B1 (en) * 2006-07-28 2012-12-31 삼성디스플레이 주식회사 Thin film transistor substrate, method for making the same and display having the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4636038A (en) * 1983-07-09 1987-01-13 Canon Kabushiki Kaisha Electric circuit member and liquid crystal display device using said member
US4704783A (en) * 1986-05-05 1987-11-10 General Electric Company Method for passivating the back channel of amorphous silicon field effect transistors
JPS63157476A (en) * 1986-12-22 1988-06-30 Seiko Instr & Electronics Ltd Thin film transistor
JPH01241175A (en) * 1988-03-23 1989-09-26 Seikosha Co Ltd Manufacture of amolphous silicon thin film transistor
DE69125886T2 (en) * 1990-05-29 1997-11-20 Semiconductor Energy Lab Thin film transistors
DE69131570T2 (en) * 1990-11-16 2000-02-17 Seiko Epson Corp., Tokio/Tokyo Method of manufacturing a thin film semiconductor device
JPH04257826A (en) * 1991-02-13 1992-09-14 Sharp Corp Manufacture of active matrix substrate
US5177588A (en) * 1991-06-14 1993-01-05 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including nitride layer
US5281546A (en) * 1992-09-02 1994-01-25 General Electric Company Method of fabricating a thin film transistor using hydrogen plasma treatment of the intrinsic silicon/doped layer interface
JPH06267986A (en) * 1993-03-17 1994-09-22 Hitachi Ltd Method of manufacturing thin film transistor
KR100327086B1 (en) * 1994-06-15 2002-03-06 구사마 사부로 Fabrication method for a thin film semiconductor device, the thin film semiconductor device itself, liquid crystal dispaly, and electronic device

Also Published As

Publication number Publication date
GB2315158A (en) 1998-01-21
GB9714111D0 (en) 1997-09-10
DE19729176A1 (en) 1998-01-22
FR2751131A1 (en) 1998-01-16
JPH1082997A (en) 1998-03-31
DE19729176C2 (en) 2002-04-25
GB2315158B (en) 1999-02-10

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