FR2745214B1 - Systeme optique pour le traitement des materiaux - Google Patents

Systeme optique pour le traitement des materiaux

Info

Publication number
FR2745214B1
FR2745214B1 FR9602257A FR9602257A FR2745214B1 FR 2745214 B1 FR2745214 B1 FR 2745214B1 FR 9602257 A FR9602257 A FR 9602257A FR 9602257 A FR9602257 A FR 9602257A FR 2745214 B1 FR2745214 B1 FR 2745214B1
Authority
FR
France
Prior art keywords
optical system
processing materials
materials
processing
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9602257A
Other languages
English (en)
Other versions
FR2745214A1 (fr
Inventor
Gilles Brassart
Boisson Christophe Simon
Jean Pierre Huignard
Henri Rajbenbach
Christophe Nicolas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR9602257A priority Critical patent/FR2745214B1/fr
Publication of FR2745214A1 publication Critical patent/FR2745214A1/fr
Application granted granted Critical
Publication of FR2745214B1 publication Critical patent/FR2745214B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Liquid Crystal (AREA)
  • Lasers (AREA)
  • Laser Beam Processing (AREA)
FR9602257A 1996-02-23 1996-02-23 Systeme optique pour le traitement des materiaux Expired - Lifetime FR2745214B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9602257A FR2745214B1 (fr) 1996-02-23 1996-02-23 Systeme optique pour le traitement des materiaux

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9602257A FR2745214B1 (fr) 1996-02-23 1996-02-23 Systeme optique pour le traitement des materiaux

Publications (2)

Publication Number Publication Date
FR2745214A1 FR2745214A1 (fr) 1997-08-29
FR2745214B1 true FR2745214B1 (fr) 1998-03-27

Family

ID=9489509

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9602257A Expired - Lifetime FR2745214B1 (fr) 1996-02-23 1996-02-23 Systeme optique pour le traitement des materiaux

Country Status (1)

Country Link
FR (1) FR2745214B1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9922082D0 (en) * 1999-09-17 1999-11-17 Isis Innovation Laser apparatus for use in material processing
TW546684B (en) * 2000-11-27 2003-08-11 Univ Columbia Process and mask projection system for laser crystallization processing of semiconductor film regions on a substrate
JP7105639B2 (ja) * 2018-07-05 2022-07-25 浜松ホトニクス株式会社 レーザ加工装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734558A (en) * 1983-05-16 1988-03-29 Nec Corporation Laser machining apparatus with controllable mask
JPH0658466B2 (ja) * 1985-11-28 1994-08-03 日本電気株式会社 レ−ザマ−カ装置
US5111312A (en) * 1989-07-18 1992-05-05 Stewart Bob W Coupling mechanism for efficient conversion of axisymmetric beam profiles into profiles suitable for diffraction-free transmission in free space
JPH0484686A (ja) * 1990-07-27 1992-03-17 Advantest Corp レーザ加工装置
WO1992021050A1 (fr) * 1991-05-21 1992-11-26 Seiko Epson Corporation Dispositif optique et systeme d'usinage optique l'utilisant
FR2664712B1 (fr) * 1991-10-30 1994-04-15 Thomson Csf Dispositif de modulation optique a cellules deformables.

Also Published As

Publication number Publication date
FR2745214A1 (fr) 1997-08-29

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