FR2716968A1 - Sensor mounting process - Google Patents

Sensor mounting process Download PDF

Info

Publication number
FR2716968A1
FR2716968A1 FR9502358A FR9502358A FR2716968A1 FR 2716968 A1 FR2716968 A1 FR 2716968A1 FR 9502358 A FR9502358 A FR 9502358A FR 9502358 A FR9502358 A FR 9502358A FR 2716968 A1 FR2716968 A1 FR 2716968A1
Authority
FR
France
Prior art keywords
rigid structure
support
sensor
adhesive
rigid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR9502358A
Other languages
French (fr)
Other versions
FR2716968B1 (en
Inventor
De Lambilly Herve
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre Suisse dElectronique et Microtechnique SA CSEM
Original Assignee
Centre Suisse dElectronique et Microtechnique SA CSEM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre Suisse dElectronique et Microtechnique SA CSEM filed Critical Centre Suisse dElectronique et Microtechnique SA CSEM
Publication of FR2716968A1 publication Critical patent/FR2716968A1/en
Application granted granted Critical
Publication of FR2716968B1 publication Critical patent/FR2716968B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/10—Elements for damping the movement of parts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/30—Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/83138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Sensors (AREA)
  • Details Of Measuring And Other Instruments (AREA)

Abstract

The process uses a rigid structure (40) such as a metallic grid or network of fibres with precise dimensions placed on the supporting material (40). The sensor (10) is held against the rigid structure (20) while a bed of adhesive (50) is laid which fills the gaps in the rigid structure (40). The adhesive is polymerised to fix the sensor permanently in position. The sensor can be connected electrically by wires to an adjacent electronic circuit (30). The complete assembly is encapsulated for mechanical protection.

Description

Procédé de fixation d'un dispositif sensible sur un support
et produit obtenu par le procédé
La présente invention se rapporte, de manière générale, au montage de dispositifs sensibles tels des capteurs, sur un support et concerne, plus particulièrement, un procédé pour fixer de tels capteurs sur un support de manière à assurer une liaison souple selon une première et une deuxième directions et une liaison rigide selon une troisième direction, ainsi que le produit résultant du procédé.Method of fixing a sensitive device to a support
and product obtained by the process
The present invention relates, in general, to the mounting of sensitive devices such as sensors, on a support and relates, more particularly, to a method for fixing such sensors on a support so as to ensure a flexible connection according to a first and a second directions and a rigid connection in a third direction, as well as the product resulting from the process.

De nos jours, un nombre de plus en plus grand de capteurs sont réalisés en faisant appel aux technologies de fabrication des circuits intégrés ou à des techniques dérivées, telles celles du microusinage du silicium ou d'autres maténaux comme le quartz ou le verre. De tels capteurs allient des performances élevées à de faibles dimensions et un coût de fabrication très bas. Pour pouvoir être utilisés, ils doivent, au préalable, être montés sur un support qui assurera leur positionnement dans leur environnement d'application, voire leur connexion électrique à d'autres composants. La fixation des capteurs sur un support pose, souvent, plusieurs problèmes contradictoires. D'une part, il y peut y avoir lieu d'assurer un positionnement précis par rapport au support1 comme c'est le cas des capteurs optiques ou accélérométriques ou de permettre l'application d'une pression selon une direction, pour réaliser une opération de gbondingw (connexion électrique); d'autre part, il est, souvent, nécessaire d'assurer un découplage mécanique entre le support et le capteur. Ce découplage mécanique est notamment requis lorsque l'on désire que les dilatations du support, ou les vibrations dont il peut être le siège, ne soient pas transmises au capteur. Nowadays, an increasing number of sensors are made using technologies for manufacturing integrated circuits or derived techniques, such as micromachining of silicon or other materials such as quartz or glass. Such sensors combine high performance with small dimensions and a very low manufacturing cost. To be able to be used, they must first be mounted on a support which will ensure their positioning in their application environment, or even their electrical connection to other components. The mounting of the sensors on a support often poses several contradictory problems. On the one hand, it may be necessary to ensure precise positioning relative to the support1 as is the case with optical or accelerometric sensors or to allow the application of pressure in a direction, to perform an operation gbondingw (electrical connection); on the other hand, it is often necessary to provide mechanical decoupling between the support and the sensor. This mechanical decoupling is notably required when it is desired that the expansions of the support, or the vibrations of which it may be the seat, are not transmitted to the sensor.

Les techniques couramment utilisées pour réaliser l'assemblage du capteur et de son support sont, principalement, de deux types. La première technique est une brasure avec apport de métal qui peut être pratiquée à température relativement basse, (de l'ordre de 170 à 300 "C), avec des alliages à base de plomb, d'indium ou d'étain.The techniques commonly used to assemble the sensor and its support are mainly of two types. The first technique is a brazing with metal contribution which can be practiced at relatively low temperature, (of the order of 170 to 300 "C), with alloys based on lead, indium or tin.

Ces alliages sont assez souples mais présentent l'inconvénient de se fissurer avec le temps. D'autres brasures à base de cuivre ou d'or peuvent également être utilisées. Elles nécessitent des températures plus élevées, de l'ordre de 600 à 800 "C, et sont plus dures que les premières; ce qui ne permet pas de les utiliser lorsqu'un découplage mécanique important doit exister entre le capteur et son support. Lautre technique est le collage; il permet de réaliser une liaison isolante ou conductrice selon les composants de la colle utilisée. Plusieurs types de colle peuvent être employés selon l'application envisagée. Les colles de type époxyS sont souvent choisies en raison de leur stabilité, de leur facilité de mise en oeuvre, du faible dégagement de vapeurs lors de leur polymérisation et de leur bonne capacité d'adhérence à la plupart des matériaux. D'autres colles peuvent également être employées, tels les acrylates, les polyimides ou les polyuréthanes. Les inconvénients majeurs de ces dernières sont leur manque d'élasticité, d'une part, et leur grand coefficient de dilatation thermique, d'autre part. Ces inconvénients peuvent conduire à la dégradation des signaux ou à la détérioration des capteurs euxmêmes lorsque ceux-ci, montés sur leur support, sont soumis à de grandes variations de température.These alloys are quite flexible but have the drawback of cracking over time. Other solders based on copper or gold can also be used. They require higher temperatures, of the order of 600 to 800 "C, and are harder than the former; which does not allow them to be used when a significant mechanical decoupling must exist between the sensor and its support. technique is bonding; it allows an insulating or conductive connection to be made depending on the components of the adhesive used. Several types of adhesive can be used depending on the application envisaged. Epoxy type adhesives are often chosen because of their stability, their ease of use, the low evolution of vapors during their polymerization and their good ability to adhere to most materials, other adhesives can also be used, such as acrylates, polyimides or polyurethanes. major disadvantages of the latter are their lack of elasticity, on the one hand, and their large coefficient of thermal expansion, on the other hand. wind lead to degradation of signals or deterioration of the sensors themselves when these, mounted on their support, are subjected to large temperature variations.

Aussi un objet de la présente invention est un procédé de montage d'un dispositif sensible, tel un capteur, sur un support ne présentant pas les inconvénients mentionnés précédemment.Also an object of the present invention is a method of mounting a sensitive device, such as a sensor, on a support not having the drawbacks mentioned above.

Un autre objet de l'invention est un procédé de montage qui, tout en réalisant un découplage mécanique entre le capteur et son support, permet d'assurer le positionnement précis de l'un par rapport à l'autre selon, au moins, une direction donnée. Another object of the invention is a mounting method which, while providing mechanical decoupling between the sensor and its support, makes it possible to ensure the precise positioning of one relative to the other according to, at least, one direction given.

Encore un autre objet de l'invention est un procédé de montage, qui permet d'assurer une liaison rigide, selon au moins une direction donnée, entre le capteur et son support et une liaison souple selon les autres directions.Yet another object of the invention is a mounting method, which ensures a rigid connection, in at least one given direction, between the sensor and its support and a flexible connection in the other directions.

Encore un autre objet de l'invention est le produit résultant de l'application du procédé de montage.Yet another object of the invention is the product resulting from the application of the mounting method.

Ces objets sont réalisés par l'invention, telle que décrite ci-après.These objects are achieved by the invention, as described below.

Grince à la combinaison d'une structure rigide, de dimensions contrôlées, avec l'utilisation d'une colle souple, il est possible de garantir un positionnement précis du caFteur par rapport à une face du support et de s'affranchir des problèmes que pourrait poser une dilatation dudit support sous l'effet de la température. Par un choix appropné de la colle souple, celle-ci peut également faire office de filtre de vibrations ou de chocs, d'isclant ou, au contraire, de conducteur thermique. Par ailleurs, selon l'application envisagée, la colle souple peut être rendue électriquement isolante ou conductrice. Squeaks with the combination of a rigid structure, of controlled dimensions, with the use of a flexible adhesive, it is possible to guarantee a precise positioning of the factor relative to a face of the support and to be freed from the problems that could pose an expansion of said support under the effect of temperature. By a suitable choice of flexible adhesive, it can also act as a vibration or shock filter, an isolator or, on the contrary, a thermal conductor. Furthermore, depending on the application envisaged, the flexible adhesive can be made electrically insulating or conductive.

La structure rigide est en matériau thermiquement conducteur.The rigid structure is made of thermally conductive material.

L'utilisation d'une structure rigide apporte, en outre, l'avantage de permettre l'application d'une force sur le capteur, une fois celui-ci fixé sur son support. Cela est notamment nécessaire lors d'une opération de "bonding", c' est-à-dire une opération de connexion électrique par fils, entre ledit capteur et son support.The use of a rigid structure brings, moreover, the advantage of allowing the application of a force on the sensor, once the latter is fixed on its support. This is in particular necessary during a "bonding" operation, that is to say an operation of electrical connection by wires, between said sensor and its support.

D'autres objets, caractéristiques et avantages de la présente invention apparaîtront à la lecture de la description suivante d'un mode de réalisation préféré; ladite description étant faite à titre purement illustratif et en relation avec le dessin joint qui représente:
- un capteur de pression monté sur un support auquel il est
électriquement relié (Figure 1).Other objects, characteristics and advantages of the present invention will appear on reading the following description of a preferred embodiment; said description being given purely by way of illustration and in relation to the attached drawing which represents:
- a pressure sensor mounted on a support to which it is
electrically connected (Figure 1).

La figure 1 montre un capteur de pression 10 réalisé, par exemple, à l'aide d'une technique de micro-usinage d'un substrat de silicium.FIG. 1 shows a pressure sensor 10 produced, for example, using a micromachining technique of a silicon substrate.

Ce capteur de pression comporte une membrane mince 12 qui est susceptible de se déformer sous l'action d'une pression extérieure.This pressure sensor comprises a thin membrane 12 which is liable to deform under the action of an external pressure.

La déformation de la membrane est détectée par la mesure de la variation correspondante de la capacité formée par la membrane, d'une part et une électrode fixe, d'autre part. L'électrode fixe ainsi que le volume de référence font partie intégrante de la partie 11 du capteur. Ce demier doit être monté sur un support 20, qui peut être un circuit imprimé, une piaque rigide ou tout autre élément dicté par l'application. Selon le procédé de l'invention, est disposée sur le support 20 une structure rigide 40, qui est destinée à assurer le positionnement précis du capteur par rapport au support et sa rigidité, au moins selon une direction perpendiculaire à ce dernier.The deformation of the membrane is detected by measuring the corresponding variation in the capacitance formed by the membrane, on the one hand and a fixed electrode, on the other. The fixed electrode and the reference volume are an integral part of part 11 of the sensor. The latter must be mounted on a support 20, which can be a printed circuit, a rigid plate or any other element dictated by the application. According to the method of the invention, is arranged on the support 20 a rigid structure 40, which is intended to ensure the precise positioning of the sensor relative to the support and its rigidity, at least in a direction perpendicular to the latter.

Cette structure rigide peut, par exemple, être constituée par une trame ou une grille métallique, un réseau de fibres synthétiques, des billes ou, de façon générale, de tout autre élément rigide de dimensions calibrées et qui est structure de manière à laisser des espaces vides. Après le dépôt de la structure rigide, le capteur est positionné et est maintenu en contact avec celle-ci, par l'application d'une force de maintien perpendiculaire au plan du support, et une couche 50 de colle souple est appliquée et polymérisée. La colle 50 doit présenter une grande élasticité1 des propriétés d'adhérence suffisantes et n'être chimiquement agressive, ni par rapport au capteur, ni par rapport au support. Sa viscosité sera choisie de manière à pouvoir ne remplir que les espaces laissés libres par la structure rigide 40 et à ne pas se répandre ailleurs sur le substrat, d'une part, et en fonction du type d'application voulu, d'autre part.This rigid structure may, for example, be constituted by a metallic frame or grid, a network of synthetic fibers, balls or, in general, any other rigid element of calibrated dimensions and which is structured so as to leave spaces empty. After the rigid structure has been deposited, the sensor is positioned and kept in contact with it, by the application of a holding force perpendicular to the plane of the support, and a layer 50 of flexible adhesive is applied and polymerized. The adhesive 50 must have a high elasticity1 with sufficient adhesion properties and not be chemically aggressive, either with respect to the sensor or with respect to the support. Its viscosity will be chosen so as to be able to fill only the spaces left free by the rigid structure 40 and not to spread elsewhere on the substrate, on the one hand, and according to the type of application desired, on the other hand .

Les billes sont incorporées à la colle souple de manière à obtenir un mélange homogène et les étapes consistant à disposer la structure rigide et à déposer la colle souple sont effectuées en une seule et même opération, préalablement au positionnement et au maintien du dispositif sensible. The balls are incorporated into the flexible adhesive so as to obtain a homogeneous mixture and the steps consisting in placing the rigid structure and in depositing the flexible adhesive are carried out in one and the same operation, before positioning and maintaining the sensitive device.

A titre d'exemple, - ont été utilisées avec succès une trame de polyéthylène résistante à 120 "C comme structure rigide et une colle silicone commercialisée par la firme Dow Coming sous l'appellation XHIPEC Q1 92". Cette colle présente une viscosité de 150'000 mPa.s et une densité de 1,15 et elle polyménse en une heure à une température de 150 "C. For example, - have been successfully used a polyethylene frame resistant to 120 "C as a rigid structure and a silicone adhesive sold by the company Dow Coming under the name XHIPEC Q1 92". This adhesive has a viscosity of 150,000 mPa.s and a density of 1.15 and it polymerizes in one hour at a temperature of 150 "C.

Selon une variante du procédé de l'invention, la structure rigide 40
peut être auto-collante afin de faciliter le positionnement et le
maintien du boîtier du capteur pendant les opérations ultérieures.According to a variant of the method of the invention, the rigid structure 40
can be self-adhesive in order to facilitate positioning and
maintenance of the sensor housing during subsequent operations.

Selon une autre variante du procédé de l'invention, la structure rigide est partie intégrante du boîtier du capteur 10 ou du support 20. Ceci peut être réalisé, par exemple, par attaque chimique, à travers un masque, des surfaces respectives ou par tout autre moyen approprié.According to another variant of the method of the invention, the rigid structure is an integral part of the sensor housing 10 or of the support 20. This can be achieved, for example, by chemical attack, through a mask, on the respective surfaces or by any other appropriate means.

Une fois la colle souple 50 polymérisée1 il est possible d'effectuer un "bonding", c'est-à-dire une connexion électrique par fils 13, entre des bornes de contact du capteur et les plages correspondantes d'un circuit, tel le circuit 30, ou du support lui-même. Cette opération de "bonding", qui nécessite de pouvoir appliquer une force sur le capteur, est rendue possible grâce à la présence de la structure rigide entre le capteur et son support.Once the flexible adhesive 50 has polymerized1 it is possible to perform a "bonding", that is to say an electrical connection by wires 13, between contact terminals of the sensor and the corresponding pads of a circuit, such as the circuit 30, or of the support itself. This “bonding” operation, which requires the ability to apply a force to the sensor, is made possible by the presence of the rigid structure between the sensor and its support.

Dans certains cas, la connexion électrique du capteur à son environnement pourra avantageusement être réalisée par le biais de la structure rigide 40, pour autant que celle-ci soit en un matériau conducteur et que le fond du boîtier du capteur 10 soit, au moins partiellement, métallisé. Bien entendu, une pression suffisante sur le boîtier sera nécessaire pendant toute l'opération de collage, afin de pouvoir garantir un bon contact électrique et prévenir tout dépôt de colle entre la structure rigide et le boîtier, d'une part, et entre la structure rigide et le substrat, d'autre part.In some cases, the electrical connection of the sensor to its environment may advantageously be made by means of the rigid structure 40, provided that the latter is made of a conductive material and that the bottom of the sensor housing 10 is, at least partially , metallic. Of course, sufficient pressure on the housing will be necessary during the entire bonding operation, in order to be able to guarantee good electrical contact and prevent any deposit of adhesive between the rigid structure and the housing, on the one hand, and between the structure. rigid and the substrate, on the other hand.

Enfin, lorsque le capteur a été fixé à son support et, éventuellement, électriquement connecté, l'ensemble peut être enrobé (à l'exception, toutefois, des parties sensibles du capteur, telle la membrane 12) à l'aide d'un matériau 60, par exemple plastique ou gel de silicone, résistant à l'humidité. Ces techniques d'enrobage sont bien connues de l'homme du métier et ne seront pas décrites plus avant
Le procédé de l'invention sera avantageusement utilisé pour améliorer les performances et la stabilité des capteurs montés et disposés, notamment, dans un environnement perturbé; par exemple, dans le cas où le support subit des variations importantes de température ou peut être sujet à des chocs ou le siège de vibrations mécaniques. Le procédé de l'invention constitue, également, un avantage lorsque le capteur doit être précisément positionné par rapport à une surface de référence. C'est souvent le cas, par exemple, des capteurs d'accélération ou encore des détecteurs optiques. Finally, when the sensor has been fixed to its support and possibly electrically connected, the assembly can be coated (with the exception, however, of sensitive parts of the sensor, such as the membrane 12) using a material 60, for example plastic or silicone gel, resistant to humidity. These coating techniques are well known to those skilled in the art and will not be described further.
The method of the invention will be advantageously used to improve the performance and stability of the sensors mounted and arranged, in particular, in a disturbed environment; for example, in the case where the support undergoes significant temperature variations or may be subject to shocks or the seat of mechanical vibrations. The method of the invention also constitutes an advantage when the sensor must be precisely positioned with respect to a reference surface. This is often the case, for example, with acceleration sensors or even optical detectors.

Claims (12)

RevendicationsClaims 1. Procédé de fixation d'un dispositif sensible sur un support,1. Method for attaching a sensitive device to a support, permettant d'assurer le positionnement précis et rigide dudit ensuring precise and rigid positioning of said dispositif par rapport au support selon une direction et une device relative to the support in a direction and a liaison souple selon les autres directions, caractérisé en ce qu'il flexible connection in other directions, characterized in that it comprend les étapes consistant à: includes the steps of: - disposer une structure rigide de dimensions calibrées sur - have a rigid structure of calibrated dimensions on une face dudit support à l'emplacement de fixation prévu, one face of said support at the intended fixing location, - positionner et maintenir ledit dispositif sensible sur ladite - position and maintain said sensitive device on said structure rigide, et rigid structure, and - déposer et polymériser une colle souple dans les - deposit and polymerize a flexible adhesive in the interstices de ladite structure rigide de façon à assurer la interstices of said rigid structure so as to ensure the liaison entre ledit dispositif sensible, ladite structure rigide connection between said sensitive device, said rigid structure et ledit support. and said support. 2. Procédé selon la revendication 1, caractérisé en ce que ladite2. Method according to claim 1, characterized in that said structure rigide est auto-collante.  rigid structure is self-adhesive. 3. Procédé selon la revendication 1, caractérisé en ce que ladite3. Method according to claim 1, characterized in that said structure rigide est une trame métallique. rigid structure is a metallic frame. 4. Procédé selon la revendication 1, caractérisé en ce que ladite4. Method according to claim 1, characterized in that said structure rigide est un réseau de fibres. rigid structure is a network of fibers. 5. Procédé selon la revendication 1, caractérisé en ce que ladite5. Method according to claim 1, characterized in that said structure ngide est réalisée par structuration de la surface dudit ngide structure is produced by structuring the surface of said support. support. 6. Procédé selon la revendication 1, caractérisé en ce que ladite6. Method according to claim 1, characterized in that said structure rigide est réalisée par structuration de la surface rigid structure is achieved by structuring the surface boîtier dudit dispositif sensible. housing of said sensitive device. 7. Procédé selon la revendication 1, caractérisé en ce que ladite7. Method according to claim 1, characterized in that said structure rigide est constituée par des billes.  rigid structure consists of balls. 8. Procédé selon la revendication 4, caractérisé en ce que8. Method according to claim 4, characterized in that lesdites billes sont incorporées à ladite colle souple de manière said balls are incorporated into said flexible adhesive so à obtenir un mélange homogène et en ce que les étapes to obtain a homogeneous mixture and in that the steps consistant à disposer ladite structure rigide et à déposer ladite consisting in placing said rigid structure and depositing said colle souple sont effectuées en une seule et même opération, flexible glue are carried out in a single operation, préalablement au positionnement et au maintien dudit dispositif prior to positioning and maintaining said device sensible. sensitive. 9. Procédé selon la revendication 1, caractérisé en ce que ladite9. Method according to claim 1, characterized in that said structure rigide est en un matériau électriquement conducteur. rigid structure is made of an electrically conductive material. 10. Procédé selon la revendication 1, caractérisé en ce que ladite10. Method according to claim 1, characterized in that said structure rigide est en un matériau thermiquement conducteur. rigid structure is made of a thermally conductive material. 11. Procédé selon la revendication 1, caractérisé en ce qu'il11. Method according to claim 1, characterized in that it comporte, en outre, une étape d'enrobage à l'aide d'un further includes a coating step using a matériau isolant et résistant à l'humidité. insulating and moisture resistant material. 12. Produit obtenu à l'aide du procédé selon l'une quelconque des12. Product obtained using the process according to any one of revendications 1à10.  claims 1 to 10.
FR9502358A 1994-03-02 1995-03-01 Method for fixing a sensitive device to a support and product obtained by the method. Expired - Lifetime FR2716968B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH60994A CH689701A5 (en) 1994-03-02 1994-03-02 A method of attaching a sensing device on a support and the product obtained by the method.

Publications (2)

Publication Number Publication Date
FR2716968A1 true FR2716968A1 (en) 1995-09-08
FR2716968B1 FR2716968B1 (en) 1997-08-08

Family

ID=4190975

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9502358A Expired - Lifetime FR2716968B1 (en) 1994-03-02 1995-03-01 Method for fixing a sensitive device to a support and product obtained by the method.

Country Status (2)

Country Link
CH (1) CH689701A5 (en)
FR (1) FR2716968B1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4954215A (en) * 1987-07-21 1990-09-04 Mitsubishi Denki Kabushiki Kaisha Method for manufacture stress detector
US5107325A (en) * 1989-04-17 1992-04-21 Seiko Epson Corporation Structure and method of packaging a semiconductor device
WO1992022090A1 (en) * 1991-06-03 1992-12-10 Motorola, Inc. Thermally conductive electronic assembly
GB2266152A (en) * 1992-04-08 1993-10-20 Danfoss As Pressure sensor and a method for the manufacture thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4954215A (en) * 1987-07-21 1990-09-04 Mitsubishi Denki Kabushiki Kaisha Method for manufacture stress detector
US5107325A (en) * 1989-04-17 1992-04-21 Seiko Epson Corporation Structure and method of packaging a semiconductor device
WO1992022090A1 (en) * 1991-06-03 1992-12-10 Motorola, Inc. Thermally conductive electronic assembly
GB2266152A (en) * 1992-04-08 1993-10-20 Danfoss As Pressure sensor and a method for the manufacture thereof

Also Published As

Publication number Publication date
FR2716968B1 (en) 1997-08-08
CH689701A5 (en) 1999-08-31

Similar Documents

Publication Publication Date Title
EP0230336B1 (en) Optoelectronic device for surface mounting
EP0638933B1 (en) Interconnection process of stacked semi-conductors chips and devices
EP2425203B1 (en) Strain gauge and method for manufacturing the same
JP2943760B2 (en) Hermetic sealing method and hermetic sealing structure for optical fiber introduction section
EP0321340B1 (en) Electronic-component support, especially for a memory card, and product so obtained
FR2491259A1 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
FR2737566A1 (en) METHOD FOR REALIZING THE ASSEMBLY OF AN ELECTROMAGNETIC WAVE DETECTION BLOCK, ESPECIALLY INFRARED, WITH A THERMAL CONDUCTIVE SUPPORT, AND ELECTROMAGNETIC WAVE DETECTOR USING THE SAME
FR2486755A1 (en) SUPPORT FOR ELECTRONIC COMPONENTS FOR HIGH-DIMENSIONAL HYBRID CIRCUITS
FR2580111A1 (en)
FR2716968A1 (en) Sensor mounting process
FR2769100A1 (en) Casing for photosemiconductor device
EP1624493A2 (en) Method of fabricating an optical module for semiconductor imaging device package
EP0419371B1 (en) Device for infrared detection
FR2714254A1 (en) Thermal transfer element, usable especially in electronics as printed circuit board or component support and its manufacturing method.
FR2511193A1 (en) Laminated support for cooling semiconductor - has three metal layers including one rigid layer to avoid bi-metallic bending with changing temp.
EP1938863A1 (en) Method for mechanical assembly and electrical interconnection of the functional elements of an active implantable medical device
EP1147557B1 (en) Integrated circuit device, electronic module for chip card using said device and method for making same
FR2771551A1 (en) Micro-electromechanical device, such as micro-sensor or micro-actuator
EP0616724B1 (en) Electronic device and production method therefor
FR2972595A1 (en) METHOD FOR INTERCONNECTING BY REVERSING AN ELECTRONIC COMPONENT
EP0484853A1 (en) A method for protecting the electronic components of a circuit against the radiations and device using the same
FR2554275A1 (en) Connection device for a power semiconductor
FR2569052A1 (en) Method of interconnecting integrated circuits
FR2809533A1 (en) Monolithic microsystem with mosaic of components and manufacturing method, for use in microelectronics
FR3124888A1 (en) INTEGRATED CIRCUIT BOX

Legal Events

Date Code Title Description
TP Transmission of property