FR2703827B1 - Réseau de microplaquettes reconnues bonnes et procédé de fabrication de ce réseau. - Google Patents

Réseau de microplaquettes reconnues bonnes et procédé de fabrication de ce réseau.

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Publication number
FR2703827B1
FR2703827B1 FR9403967A FR9403967A FR2703827B1 FR 2703827 B1 FR2703827 B1 FR 2703827B1 FR 9403967 A FR9403967 A FR 9403967A FR 9403967 A FR9403967 A FR 9403967A FR 2703827 B1 FR2703827 B1 FR 2703827B1
Authority
FR
France
Prior art keywords
network
microchips
recognized
manufacturing
good
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9403967A
Other languages
English (en)
Other versions
FR2703827A1 (fr
Inventor
Kim Il Ung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of FR2703827A1 publication Critical patent/FR2703827A1/fr
Application granted granted Critical
Publication of FR2703827B1 publication Critical patent/FR2703827B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FR9403967A 1993-04-07 1994-04-05 Réseau de microplaquettes reconnues bonnes et procédé de fabrication de ce réseau. Expired - Fee Related FR2703827B1 (fr)

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KR1019930005769A KR960000793B1 (ko) 1993-04-07 1993-04-07 노운 굳 다이 어레이 및 그 제조방법

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FR2703827A1 FR2703827A1 (fr) 1994-10-14
FR2703827B1 true FR2703827B1 (fr) 1996-01-19

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US (1) US5548884A (fr)
JP (1) JP2882747B2 (fr)
KR (1) KR960000793B1 (fr)
CN (1) CN1041149C (fr)
DE (1) DE4411973C2 (fr)
FR (1) FR2703827B1 (fr)

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US6121358A (en) * 1997-09-22 2000-09-19 The Dexter Corporation Hydrophobic vinyl monomers, formulations containing same, and uses therefor
US5924003A (en) * 1997-11-14 1999-07-13 Kinetrix, Inc. Method of manufacturing ball grid arrays for improved testability
KR19990065532A (ko) * 1998-01-14 1999-08-05 구본준 Cob형 반도체 패키지의 제조방법
US6241907B1 (en) * 1998-12-09 2001-06-05 Advanced Micro Devices, Inc. Method and system for providing a package for decapsulating a chip-scale package
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JP2002033362A (ja) * 2000-07-17 2002-01-31 Matsushita Electric Ind Co Ltd 半導体検査装置
US6787708B1 (en) 2000-11-21 2004-09-07 Unisys Corporation Printed circuit board debug technique
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Also Published As

Publication number Publication date
FR2703827A1 (fr) 1994-10-14
JPH077057A (ja) 1995-01-10
DE4411973C2 (de) 2003-07-03
US5548884A (en) 1996-08-27
KR960000793B1 (ko) 1996-01-12
JP2882747B2 (ja) 1999-04-12
DE4411973A1 (de) 1994-10-20
CN1098226A (zh) 1995-02-01
CN1041149C (zh) 1998-12-09

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