FR2695531A1 - Electronic module comprising several double-sided housings - has several housings each with two metal frames mounted on base plate forming spaces for components and being joined without closure covers - Google Patents
Electronic module comprising several double-sided housings - has several housings each with two metal frames mounted on base plate forming spaces for components and being joined without closure covers Download PDFInfo
- Publication number
- FR2695531A1 FR2695531A1 FR9210796A FR9210796A FR2695531A1 FR 2695531 A1 FR2695531 A1 FR 2695531A1 FR 9210796 A FR9210796 A FR 9210796A FR 9210796 A FR9210796 A FR 9210796A FR 2695531 A1 FR2695531 A1 FR 2695531A1
- Authority
- FR
- France
- Prior art keywords
- housings
- boxes
- electronic module
- sided
- metal frames
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/023—Stackable modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
Module électronique composé de boîtiers double face.Electronic module composed of double-sided boxes.
La présente invention concerne un module électronique composé de boîtiers double face, et plus particulièrement un tel module du type comprenant une pluralité de boîtiers double face comportant chacun deux cadres métalliques montés de part et d'autre d'une plaque de fond de manière à former deux cavités de réception de composants.The present invention relates to an electronic module composed of double-sided boxes, and more particularly such a module of the type comprising a plurality of double-sided boxes each comprising two metal frames mounted on either side of a bottom plate so as to form two component receiving cavities.
L'intégration de fonctions électroniques en circuits hybrides utilise classiquement des boîtiers métalliques ou céramiques reportés à plat sur circuit imprimé.The integration of electronic functions in hybrid circuits conventionally uses metal or ceramic boxes transferred flat on printed circuit.
La recherche d'une plus grande intégration a conduit à l'utilisation de boîtiers assemblés sur une face ou sur deux faces d'un circuit imprimé connecté directement ou à l'aide d'un connecteur sur un autre circuit imprimé.The search for greater integration has led to the use of boxes assembled on one side or on two sides of a printed circuit connected directly or using a connector on another printed circuit.
On a également proposé de supprimer le premier circuit imprimé et de connecter directement des boîtiers de circuits hybrides verticalement sur un circuit imprimé.It has also been proposed to eliminate the first printed circuit and to connect hybrid circuit boxes directly vertically to a printed circuit.
Cette dernière solution présente toutefois des inconvénients tant en ce qui concerne le poids des modules ainsi obtenus qu'en ce qui concerne leur volume.This latter solution however has drawbacks both with regard to the weight of the modules thus obtained and with regard to their volume.
En effet, les boîtiers de circuits hybrides sont typiquement composés d'un cadre métallique monté sur une plaque de fond de manière à former une cavité de réception de composants électroniques, cette cavité étant elle-même fermée par un capot. In fact, the hybrid circuit boxes are typically composed of a metal frame mounted on a bottom plate so as to form a cavity for receiving electronic components, this cavity itself being closed by a cover.
Les modules réalisés comme décrit précédemment comportent donc autant de capots que de boîtiers.The modules produced as described above therefore have as many covers as there are housings.
Par ailleurs, il est nécessaire de prévoir un écartement minimum entre les boîtiers de manière à leur permettre certains déplacements sous l'effet des vibrations sans pour autant qu'ils viennent au contact l'un de l'autre.Furthermore, it is necessary to provide a minimum spacing between the housings so as to allow them certain displacements under the effect of vibrations without necessarily coming into contact with each other.
La présente invention vise à palier ces inconvénients.The present invention aims to overcome these drawbacks.
A cet effet, l'invention a pour objet un module électronique du type comprenant une pluralité de boîtiers double face, notamment montés sur un circuit d'interconnexion, lesdits boîtiers comportant chacun deux cadres métalliques montés de part et d'autre d'une plaque de fond de manière à former deux cavités de réception de composants, caractérisé par le fait qu'au moins certains desdits boîters sont assemblés par juxtaposition deux à deux des cadres métalliques et des cavités correspondantes, sans interposition de capots de fermeture, de manière à former un empilement.To this end, the subject of the invention is an electronic module of the type comprising a plurality of double-sided boxes, in particular mounted on an interconnection circuit, said boxes each comprising two metal frames mounted on either side of a plate. bottom so as to form two component receiving cavities, characterized in that at least some of said boxes are assembled by juxtaposition two by two of the metal frames and the corresponding cavities, without interposition of closing covers, so as to form a stack.
L'invention présente par conséquent par rapport à l'état de la technique des avantages tant du point de vue du poids que de point de vue du volume.The invention therefore has advantages over the state of the art both from the point of view of weight and from the point of view of volume.
En ce qui concerne le poids, celui-ci est diminué du fait de la suppression des capots entre boîtiers.As regards the weight, this is reduced due to the elimination of the covers between housings.
En ce qui concerne le volume, plus aucun écartement ne subsiste entre les boîtiers.As far as volume is concerned, there is no longer any gap between the boxes.
Enfin, un module selon l'invention présente l'avantage de posséder une grande rigidité du fait de l'assemblage des boîtiers entre eux. Finally, a module according to the invention has the advantage of having great rigidity due to the assembly of the boxes between them.
Dans le cas où un des boîtiers disposé à l'extrémité de l'empilement est un boîtier double face, la cavité de ce boîtier située à l'opposé des autres boîtiers est fermée de façon conventionnelle par un capot de fermeture.In the case where one of the boxes disposed at the end of the stack is a double-sided box, the cavity of this box located opposite the other boxes is closed in a conventional manner by a closing cover.
Mais il est également possible de prévoir à l'extrémité de l'empilement un boîter simple face, la fermeture de l'empilement du côté de ce boîtier étant par conséquent réalisé par le fond de ce dernier.However, it is also possible to provide a single-face box at the end of the stack, the closure of the stack on the side of this box therefore being produced by the bottom of the latter.
L'assemblage entre eux des boîtiers ainsi que l'assemblage éventuel des capots aux boîtiers d'extrémité peut être réalisé par liaison directe des cadres métalliques, par exemple par soudure laser, par bombardement électronique ou par collage, ou être au contraire réalisé par interposition d'un joint entre les cadres métalliques deux à deux et serrage, par exemple au moyen de vis ou de tiges filetées et d'écrous.The assembly between them of the boxes as well as the possible assembly of the covers to the end boxes can be carried out by direct connection of the metal frames, for example by laser welding, by electronic bombardment or by bonding, or be on the contrary carried out by interposition a joint between the metal frames two by two and tightening, for example by means of screws or threaded rods and nuts.
Les interconnexions entre cavités peuvent être assurées par circuit imprimé, par wrapping direct sur les broches ou par connecteur. Dans le cas du wrapping, on prévoit des moyens de fixation et de maintien du module distincts des moyens d'interconnexion.The interconnections between cavities can be ensured by printed circuit, by direct wrapping on the pins or by connector. In the case of wrapping, means are provided for fixing and holding the module separate from the interconnection means.
Les boîtiers peuvent par exemple être des boîtiers à fond métallique sur lesquels les composants sont montés par report sur un substrat d'interconnexion. Ils peuvent également être des boîtiers à fond céramique sur lequel les composants sont également montés par report sur un substrat d'interconnexion ou encore des boîtiers à fond céramique multicouche cocuit intégrant directement le circuit d'interconnexion.The boxes can for example be boxes with a metal bottom on which the components are mounted by transfer on an interconnection substrate. They can also be housings with a ceramic base on which the components are also mounted by transfer on an interconnection substrate or else housings with a multi-layer ceramic base co-cooked directly integrating the interconnection circuit.
On décrira maintenant à titre d'exemple non limitatif trois modes de réalisation de l'invention en référence aux dessins schématiques annexés dans lesquels les figures 1 à 3 représentent vus en coupe des modules électroniques selon l'invention.There will now be described, by way of nonlimiting example, three embodiments of the invention with reference to the appended schematic drawings in which FIGS. 1 to 3 show, in section, electronic modules according to the invention.
Si l'on se reporte à la figure 1 on voit un module selon l'invention composé de deux boîtiers double face 1 et de deux boîtiers simple face 2.Referring to FIG. 1, a module according to the invention is seen, composed of two double-sided boxes 1 and two single-sided boxes 2.
Chaque boîtier double face est composé de deux cadres métalliques 3 montés de part et d'autre d'un fond métallique 4.Each double-sided box is made up of two metal frames 3 mounted on either side of a metal bottom 4.
Le fond 4 porte en outre sur chacune de ses faces un circuit hybride 5 formé d'un substrat céramique d'interconnexion sur lequel sont reportés des composants élémentaires 7 électriquement reliés au substrat par des fils de connexion 8.The bottom 4 also carries on each of its faces a hybrid circuit 5 formed of a ceramic interconnection substrate on which are transferred elementary components 7 electrically connected to the substrate by connection wires 8.
Les boîtiers simple face sont montés aux extrémités de l'empilement constitué par les boîtiers double face avec leur fond métallique 9 tourné vers l'extérieur et leur cadre métallique 10 tourné en direction des boîtiers double face.The single-sided boxes are mounted at the ends of the stack formed by the double-sided boxes with their metal bottom 9 facing outwards and their metal frame 10 facing towards the double-sided boxes.
Les liaisons entre les cavités délimités par les fonds 4 et 9 des boîtiers sont reliés à l'extérieur par des liaisons 11 traversant les cadres métalliques 3 et 10 par des traversées du type "perle de verre" et connectées à un circuit imprimé 12 d'interconnexion.The connections between the cavities delimited by the bottoms 4 and 9 of the boxes are connected to the outside by connections 11 crossing the metal frames 3 and 10 by crossings of the "glass pearl" type and connected to a printed circuit 12 of interconnection.
L'empilement est réalisé par juxtaposition des cadres métalliques 3 et 10 avec, dans le cas présent, interposition de joints annulaires d'étanchéité 13. The stack is produced by juxtaposition of the metal frames 3 and 10 with, in the present case, interposition of annular seals 13.
L'assemblage des boîtiers entre eux ainsi que le serrage des joints 13 sont réalisés à l'aide de tiges filetées 14 et d'écrous 15.The assembling of the boxes together and the tightening of the seals 13 are carried out using threaded rods 14 and nuts 15.
La figure 2 représente un autre module selon l'invention.FIG. 2 represents another module according to the invention.
Ce module est ici constitué par l'empilement de quatre boîtiers double face 20, chaque boîtier étant formé d'un fond céramique 21 de part et d'autre duquel sont montés deux cadres métalliques 22. Chaque fond 21 porte par ailleurs sur chacune de ses faces un substrat d'interconnexion 23 sur lequel sont reportés les composants 24.This module is here constituted by the stack of four double-sided boxes 20, each box being formed from a ceramic bottom 21 on either side of which are mounted two metal frames 22. Each bottom 21 also bears on each of its faces an interconnection substrate 23 on which the components 24 are transferred.
Les substrats d'interconnexion sont électriquement reliés au fond 21 par des fils 25, les sorties des boîtiers jusqu'à des connecteurs 26 s'effectuant dans l'épaisseur des fonds 21. Les connecteurs 26 sont montés sur un circuit imprimé 27 assurant l'interconnexion entre les différentes cavités du module. The interconnection substrates are electrically connected to the bottom 21 by wires 25, the outputs of the housings up to connectors 26 taking place in the thickness of the bottoms 21. The connectors 26 are mounted on a printed circuit 27 ensuring the interconnection between the different cavities of the module.
Les boîtiers d'extrémités ont leur cavité extérieure fermée par un capot 28 soude sur le cadre métallique correspondant. Les boîtiers sont assemblés par soudure directe des cadres métalliques deux par deux. The end boxes have their outer cavity closed by a cap 28 welded on the corresponding metal frame. The boxes are assembled by direct welding of the metal frames two by two.
Le module de la figure 3 ne diffère de celui de la figure 2 qu'en ce que les boîtiers double face 30 ont leur fond 31 réalisé en céramique multicouche cocuit.The module of FIG. 3 differs from that of FIG. 2 only in that the double-sided housings 30 have their bottom 31 made of cured multilayer ceramic.
Les composants élémentaires 32 sont directement montés sur le fond 31 qui assure les interconnexions internes à chaque boîtier. The elementary components 32 are directly mounted on the bottom 31 which provides the internal interconnections to each box.
Le fond 31 assure également la liaison au connecteur 33 monté sur le circuit imprimé 34 d'interconnexion entre cavités.The bottom 31 also provides the connection to the connector 33 mounted on the printed circuit 34 for interconnection between cavities.
Le montage des capots 35 sur les cadres métalliques 36 et l'assemblage des cadres métalliques entre eux pour former l'empilement sont réalisés comme dans le cas de la figure 2. The mounting of the covers 35 on the metal frames 36 and the assembly of the metal frames together to form the stack are carried out as in the case of FIG. 2.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9210796A FR2695531B1 (en) | 1992-09-10 | 1992-09-10 | Electronic module composed of double-sided boxes. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9210796A FR2695531B1 (en) | 1992-09-10 | 1992-09-10 | Electronic module composed of double-sided boxes. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2695531A1 true FR2695531A1 (en) | 1994-03-11 |
| FR2695531B1 FR2695531B1 (en) | 1994-11-18 |
Family
ID=9433372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9210796A Expired - Fee Related FR2695531B1 (en) | 1992-09-10 | 1992-09-10 | Electronic module composed of double-sided boxes. |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2695531B1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996032746A1 (en) * | 1995-04-08 | 1996-10-17 | Hybrid Memory Products Limited | Integrated circuit packages |
| US6698851B1 (en) * | 2001-08-10 | 2004-03-02 | Ludl Electronic Products, Ltd. | Vertically stacked control unit |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0133301A2 (en) * | 1983-07-29 | 1985-02-20 | Termiflex Corporation | Modular packaging system, particularly for electronics |
-
1992
- 1992-09-10 FR FR9210796A patent/FR2695531B1/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0133301A2 (en) * | 1983-07-29 | 1985-02-20 | Termiflex Corporation | Modular packaging system, particularly for electronics |
Non-Patent Citations (1)
| Title |
|---|
| IBM TECHNICAL DISCLOSURE BULLETIN vol. 20, no. 11A, Avril 1978, pages 4393 - 4398 CRAWFORD 'HIGH-POWER ELECTRONIC PACKAGE' * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996032746A1 (en) * | 1995-04-08 | 1996-10-17 | Hybrid Memory Products Limited | Integrated circuit packages |
| US6698851B1 (en) * | 2001-08-10 | 2004-03-02 | Ludl Electronic Products, Ltd. | Vertically stacked control unit |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2695531B1 (en) | 1994-11-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |