FR2659886A1 - Procede et dispositif destines au chauffage d'une matiere de soudage. - Google Patents

Procede et dispositif destines au chauffage d'une matiere de soudage. Download PDF

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Publication number
FR2659886A1
FR2659886A1 FR9003833A FR9003833A FR2659886A1 FR 2659886 A1 FR2659886 A1 FR 2659886A1 FR 9003833 A FR9003833 A FR 9003833A FR 9003833 A FR9003833 A FR 9003833A FR 2659886 A1 FR2659886 A1 FR 2659886A1
Authority
FR
France
Prior art keywords
heating
heated
light beam
area
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR9003833A
Other languages
English (en)
French (fr)
Other versions
FR2659886B1 (enrdf_load_stackoverflow
Inventor
Lafond Luc
Bernard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MAFOND LUC
Original Assignee
MAFOND LUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MAFOND LUC filed Critical MAFOND LUC
Priority to FR9003833A priority Critical patent/FR2659886A1/fr
Priority to PCT/FR1991/000237 priority patent/WO1991014529A1/fr
Publication of FR2659886A1 publication Critical patent/FR2659886A1/fr
Application granted granted Critical
Publication of FR2659886B1 publication Critical patent/FR2659886B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)
FR9003833A 1990-03-26 1990-03-26 Procede et dispositif destines au chauffage d'une matiere de soudage. Granted FR2659886A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9003833A FR2659886A1 (fr) 1990-03-26 1990-03-26 Procede et dispositif destines au chauffage d'une matiere de soudage.
PCT/FR1991/000237 WO1991014529A1 (fr) 1990-03-26 1991-03-25 Procede et dispositif destines au chauffage d'une matiere de soudage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9003833A FR2659886A1 (fr) 1990-03-26 1990-03-26 Procede et dispositif destines au chauffage d'une matiere de soudage.

Publications (2)

Publication Number Publication Date
FR2659886A1 true FR2659886A1 (fr) 1991-09-27
FR2659886B1 FR2659886B1 (enrdf_load_stackoverflow) 1994-12-09

Family

ID=9395112

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9003833A Granted FR2659886A1 (fr) 1990-03-26 1990-03-26 Procede et dispositif destines au chauffage d'une matiere de soudage.

Country Status (2)

Country Link
FR (1) FR2659886A1 (enrdf_load_stackoverflow)
WO (1) WO1991014529A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003080282A1 (de) * 2002-03-26 2003-10-02 Siemens Aktiengesellschaft Verfahren zum simultanen laserstrahllöten

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19751487A1 (de) * 1997-11-20 1999-06-02 Pac Tech Gmbh Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate
FR2802764B1 (fr) * 1999-12-17 2002-11-08 Framatome Connectors Int Methode et dispositif de soudure de composants
DE102010016628A1 (de) * 2010-02-26 2011-09-29 Reis Group Holding Gmbh & Co. Kg Verfahren und Anordnung zum stoffschlüssigen Verbinden von Materialien
CN103418873A (zh) * 2012-05-17 2013-12-04 雷科股份有限公司 激光焊接机应用在对遮蔽屏解焊或焊接的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2360308A1 (de) * 1972-12-04 1974-06-12 Mishima Kosan Co Ltd Laserloetvorrichtung fuer miniaturloetstellen
WO1988005250A1 (en) * 1986-12-29 1988-07-14 Kabushiki Kaisha Toshiba Method and apparatus for soldering electronic component
EP0300873A1 (fr) * 1987-07-24 1989-01-25 Thomson Composants Militaires Et Spatiaux Four de soudure de puces de circuit intégré

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2360308A1 (de) * 1972-12-04 1974-06-12 Mishima Kosan Co Ltd Laserloetvorrichtung fuer miniaturloetstellen
WO1988005250A1 (en) * 1986-12-29 1988-07-14 Kabushiki Kaisha Toshiba Method and apparatus for soldering electronic component
EP0300873A1 (fr) * 1987-07-24 1989-01-25 Thomson Composants Militaires Et Spatiaux Four de soudure de puces de circuit intégré

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DESIGN ENGINEERING juin 1987, LONDON GB pages 25 - 28; "Sensor-based laser scanner links solder joint integrity to production line performance" *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003080282A1 (de) * 2002-03-26 2003-10-02 Siemens Aktiengesellschaft Verfahren zum simultanen laserstrahllöten

Also Published As

Publication number Publication date
FR2659886B1 (enrdf_load_stackoverflow) 1994-12-09
WO1991014529A1 (fr) 1991-10-03

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