FR2659344B1 - - Google Patents
Info
- Publication number
- FR2659344B1 FR2659344B1 FR9003037A FR9003037A FR2659344B1 FR 2659344 B1 FR2659344 B1 FR 2659344B1 FR 9003037 A FR9003037 A FR 9003037A FR 9003037 A FR9003037 A FR 9003037A FR 2659344 B1 FR2659344 B1 FR 2659344B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/751—Means for controlling the bonding environment, e.g. valves, vacuum pumps
- H01L2224/75101—Chamber
- H01L2224/75102—Vacuum chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75314—Auxiliary members on the pressing surface
- H01L2224/75315—Elastomer inlay
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75314—Auxiliary members on the pressing surface
- H01L2224/75317—Removable auxiliary member
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9003037A FR2659344A1 (fr) | 1990-03-09 | 1990-03-09 | Procede de collage instantane, sans bulles, notamment de surfaces d'elements rigides et non poreux, et dispositif de mise en óoeuvre. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9003037A FR2659344A1 (fr) | 1990-03-09 | 1990-03-09 | Procede de collage instantane, sans bulles, notamment de surfaces d'elements rigides et non poreux, et dispositif de mise en óoeuvre. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2659344A1 FR2659344A1 (fr) | 1991-09-13 |
| FR2659344B1 true FR2659344B1 (US20030204162A1-20031030-M00001.png) | 1995-01-06 |
Family
ID=9394579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9003037A Granted FR2659344A1 (fr) | 1990-03-09 | 1990-03-09 | Procede de collage instantane, sans bulles, notamment de surfaces d'elements rigides et non poreux, et dispositif de mise en óoeuvre. |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2659344A1 (US20030204162A1-20031030-M00001.png) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5556493A (en) * | 1995-01-13 | 1996-09-17 | Libbey-Owens-Ford Co. | Mounting an optical moisture sensor on a windshield using a vacuum chamber device |
| US5605547A (en) * | 1995-03-27 | 1997-02-25 | Micron Technology, Inc. | Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor |
| DE19616073A1 (de) * | 1996-04-23 | 1997-10-30 | Teves Gmbh Alfred | Vorrichtung zum blasenfreien Fixieren von zu klebenden Komponenten |
| DE19755088A1 (de) * | 1997-12-11 | 1999-06-17 | Daimler Chrysler Ag | Kalibriervorrichtung zum Verkleben von Scheiben |
| DE19946745C1 (de) * | 1999-09-29 | 2001-04-05 | Siemens Ag | Klebeverfahren |
| DE10102848B4 (de) * | 2000-05-31 | 2004-04-15 | Sebastian Erb | Verfahren zum formschlüssigen und blasenfreien Verkleben von bestückten oder unbestückten gedruckten Schaltung mit planen Kühlkörpern unter Verwendung von Klebefolien |
| DE10209615A1 (de) * | 2002-03-05 | 2003-09-18 | Bosch Gmbh Robert | Vorrichtung und Verfahren zur Fixierung eines Sensormittels |
| FR2873499B1 (fr) | 2004-07-23 | 2007-05-25 | Thales Sa | Procede d'encollage ou d'assemblage de plusieurs elements |
| US7416011B2 (en) * | 2005-01-27 | 2008-08-26 | Delphi Technologies, Inc. | Electronic assembly having a substrate laminated within a backplate cavity |
| DE102009049386B4 (de) * | 2009-10-14 | 2018-06-28 | Pierburg Pump Technology Gmbh | Verfahren und Vorrichtung zum Verkleben mit Hilfe von Vakuum |
| EP2521430A1 (de) * | 2011-05-06 | 2012-11-07 | Pierburg Pump Technology GmbH | Verfahren zur Befestigung einer Leiterplatte auf einem Körper sowie elektromotorisch angetriebene Pumpe |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS536341A (en) * | 1976-07-06 | 1978-01-20 | Nitto Electric Ind Co Ltd | Method for vacuum pressure application |
| JPS63238182A (ja) * | 1987-03-26 | 1988-10-04 | Chiyouwa Kogyo Kk | 接着シ−トの貼着方法および装置 |
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1990
- 1990-03-09 FR FR9003037A patent/FR2659344A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2659344A1 (fr) | 1991-09-13 |
