FR2656494B1 - SHIELDING AND INSULATION DEVICE OF AN ELECTRONIC CIRCUIT BOARD. - Google Patents
SHIELDING AND INSULATION DEVICE OF AN ELECTRONIC CIRCUIT BOARD.Info
- Publication number
- FR2656494B1 FR2656494B1 FR8916986A FR8916986A FR2656494B1 FR 2656494 B1 FR2656494 B1 FR 2656494B1 FR 8916986 A FR8916986 A FR 8916986A FR 8916986 A FR8916986 A FR 8916986A FR 2656494 B1 FR2656494 B1 FR 2656494B1
- Authority
- FR
- France
- Prior art keywords
- shielding
- circuit board
- electronic circuit
- insulation device
- insulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009413 insulation Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Chemical And Physical Treatments For Wood And The Like (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8916986A FR2656494B1 (en) | 1989-12-21 | 1989-12-21 | SHIELDING AND INSULATION DEVICE OF AN ELECTRONIC CIRCUIT BOARD. |
DE4041071A DE4041071A1 (en) | 1989-12-21 | 1990-12-20 | DEVICE FOR SHIELDING AND INSULATING AN ELECTRONIC CIRCUIT BOARD |
IT68055A IT1241370B (en) | 1989-12-21 | 1990-12-21 | ELECTRONIC CIRCUIT BOARD FOR SCREENING AND INSULATION. |
GB9106487A GB2254193B (en) | 1989-12-21 | 1991-03-27 | Device for the screening and insulation of an electronic circuit board |
SG1995903902A SG30552G (en) | 1989-12-21 | 1991-03-27 | Device for the screening and insulation of an electronic circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8916986A FR2656494B1 (en) | 1989-12-21 | 1989-12-21 | SHIELDING AND INSULATION DEVICE OF AN ELECTRONIC CIRCUIT BOARD. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2656494A1 FR2656494A1 (en) | 1991-06-28 |
FR2656494B1 true FR2656494B1 (en) | 1992-04-30 |
Family
ID=9388817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8916986A Expired - Lifetime FR2656494B1 (en) | 1989-12-21 | 1989-12-21 | SHIELDING AND INSULATION DEVICE OF AN ELECTRONIC CIRCUIT BOARD. |
Country Status (5)
Country | Link |
---|---|
DE (1) | DE4041071A1 (en) |
FR (1) | FR2656494B1 (en) |
GB (1) | GB2254193B (en) |
IT (1) | IT1241370B (en) |
SG (1) | SG30552G (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05189084A (en) * | 1992-01-10 | 1993-07-30 | Toshiba Corp | Small-sized electric appliance |
US5519585A (en) * | 1993-04-12 | 1996-05-21 | Dell Usa, L.P. | Sandwiched insulative/conductive layer EMI shield structure for printed circuit board |
WO1995027341A1 (en) * | 1994-04-04 | 1995-10-12 | Motorola Inc. | Shielded circuit assembly and method for forming same |
US5597979A (en) * | 1995-05-12 | 1997-01-28 | Schlegel Corporation | EMI shielding having flexible condustive sheet and I/O Gasket |
FR2737068B1 (en) * | 1995-07-18 | 1997-10-03 | Alcatel Mobile Comm France | COMMUNICATION APPARATUS WITH ELECTROSTATIC PROTECTION |
FR2753335B1 (en) * | 1996-09-11 | 1998-11-27 | Siemens Automotive Sa | SHIELDING DEVICE OF AN ELECTRONIC CIRCUIT |
US5867371A (en) * | 1997-09-29 | 1999-02-02 | Ericsson Inc. | Cover member for sealed circuit board assembly |
DE10142655A1 (en) * | 2001-08-31 | 2003-04-03 | Epcos Ag | component assembly |
JP4096605B2 (en) * | 2002-04-23 | 2008-06-04 | 日本電気株式会社 | Semiconductor device and method for forming shield of semiconductor device |
DE10247676A1 (en) * | 2002-10-12 | 2004-07-15 | Hella Kg Hueck & Co. | Electronic circuit boards used in such as road vehicle equipment is protected by all over cover of plastic foil |
JP4690908B2 (en) * | 2006-02-22 | 2011-06-01 | ポリマテック株式会社 | Connector sheet and portable electronic device |
WO2018008657A1 (en) * | 2016-07-08 | 2018-01-11 | 住友ベークライト株式会社 | Sealing film, sealing method for electronic component mounted substrate, and electronic component mounted substrate coated with sealing film |
JP2018060991A (en) * | 2016-09-28 | 2018-04-12 | 住友ベークライト株式会社 | Sealing film, method for sealing electronic component-mounted substrate, and sealing film-covered electronic component-mounted substrate |
TWI669991B (en) * | 2018-01-11 | 2019-08-21 | 和碩聯合科技股份有限公司 | Circuit board with electrostatic discharge protection mechanism and electronic apparatus having the same |
JP2021086985A (en) * | 2019-11-29 | 2021-06-03 | 日立Astemo株式会社 | Electronic control device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3895267A (en) * | 1974-03-11 | 1975-07-15 | Analogic Corp | Electronic circuit module with printed circuit board and grounding means |
US4218578A (en) * | 1978-08-04 | 1980-08-19 | Burr-Brown Research Corp. | RF Shield for an electronic component |
-
1989
- 1989-12-21 FR FR8916986A patent/FR2656494B1/en not_active Expired - Lifetime
-
1990
- 1990-12-20 DE DE4041071A patent/DE4041071A1/en not_active Withdrawn
- 1990-12-21 IT IT68055A patent/IT1241370B/en active IP Right Grant
-
1991
- 1991-03-27 SG SG1995903902A patent/SG30552G/en unknown
- 1991-03-27 GB GB9106487A patent/GB2254193B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2656494A1 (en) | 1991-06-28 |
GB2254193B (en) | 1994-11-30 |
IT9068055A0 (en) | 1990-12-21 |
IT9068055A1 (en) | 1991-06-22 |
IT1241370B (en) | 1994-01-10 |
SG30552G (en) | 1995-09-18 |
GB9106487D0 (en) | 1991-05-15 |
GB2254193A (en) | 1992-09-30 |
DE4041071A1 (en) | 1991-06-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |