FR2611550B3 - Moyen d'entrainement pour une installation de soudage de fil travaillant a grande vitesse, par exemple les points de branchement pour la fixation des plaquettes semi-conductrices - Google Patents

Moyen d'entrainement pour une installation de soudage de fil travaillant a grande vitesse, par exemple les points de branchement pour la fixation des plaquettes semi-conductrices

Info

Publication number
FR2611550B3
FR2611550B3 FR878718302A FR8718302A FR2611550B3 FR 2611550 B3 FR2611550 B3 FR 2611550B3 FR 878718302 A FR878718302 A FR 878718302A FR 8718302 A FR8718302 A FR 8718302A FR 2611550 B3 FR2611550 B3 FR 2611550B3
Authority
FR
France
Prior art keywords
high speed
drive means
connection points
semiconductor wafers
speed working
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR878718302A
Other languages
English (en)
Other versions
FR2611550A1 (fr
Inventor
Wolfgang Schoepe
Horst Podeschwa
Wolfgang Kraiss
Joachim Gerard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Elektromat Dresden VEB
Elektromat VEB
Original Assignee
Elektromat Dresden VEB
Elektromat VEB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elektromat Dresden VEB, Elektromat VEB filed Critical Elektromat Dresden VEB
Publication of FR2611550A1 publication Critical patent/FR2611550A1/fr
Application granted granted Critical
Publication of FR2611550B3 publication Critical patent/FR2611550B3/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Resistance Welding (AREA)
FR878718302A 1987-03-02 1987-12-29 Moyen d'entrainement pour une installation de soudage de fil travaillant a grande vitesse, par exemple les points de branchement pour la fixation des plaquettes semi-conductrices Expired FR2611550B3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD87300353A DD258193A1 (de) 1987-03-02 1987-03-02 Antrieb fuer eine hochgeschwindigkeitsdrahtkontaktiereinrichtung

Publications (2)

Publication Number Publication Date
FR2611550A1 FR2611550A1 (fr) 1988-09-09
FR2611550B3 true FR2611550B3 (fr) 1989-06-30

Family

ID=5587174

Family Applications (1)

Application Number Title Priority Date Filing Date
FR878718302A Expired FR2611550B3 (fr) 1987-03-02 1987-12-29 Moyen d'entrainement pour une installation de soudage de fil travaillant a grande vitesse, par exemple les points de branchement pour la fixation des plaquettes semi-conductrices

Country Status (6)

Country Link
US (1) US4856699A (fr)
CH (1) CH675793A5 (fr)
DD (1) DD258193A1 (fr)
DE (1) DE3739954A1 (fr)
FR (1) FR2611550B3 (fr)
HU (1) HU200861B (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5653375A (en) * 1994-10-29 1997-08-05 Samsung Aerospace Industries, Ltd. Wire bonding apparatus
US6870454B1 (en) * 2003-09-08 2005-03-22 Com Dev Ltd. Linear switch actuator
DE102007006214B4 (de) 2007-02-08 2018-11-29 Schäfer Werkzeug- und Sondermaschinenbau GmbH Kabelbearbeitungseinrichtung

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5329475B2 (fr) * 1973-09-12 1978-08-21
JPS5258551A (en) * 1975-11-10 1977-05-14 Hitachi Ltd Object observation device
SU760505A1 (ru) * 1978-05-26 1980-08-30 Veniamin K Kamenshchikov Устройство для подачи микропроволоки i........ . .
US4230925A (en) * 1978-08-28 1980-10-28 Mcdonnell Douglas Corporation Circuit board wire bonding and cutting apparatus
JPS58137221A (ja) * 1982-02-10 1983-08-15 Hitachi Ltd ワイヤボンデイング装置
US4445633A (en) * 1982-02-11 1984-05-01 Rockwell International Corporation Automatic bonder for forming wire interconnections of automatically controlled configuration
US4603803A (en) * 1982-08-24 1986-08-05 Asm Assembly Automation, Ltd. Wire bonding apparatus
JPS61191042A (ja) * 1985-02-20 1986-08-25 Nec Corp 半導体集積回路の製造方法
US4718591A (en) * 1986-12-19 1988-01-12 Hughes Aircraft Company Wire bonder with open center of motion

Also Published As

Publication number Publication date
HU200861B (en) 1990-08-28
HUT45710A (en) 1988-08-29
DD258193A1 (de) 1988-07-13
CH675793A5 (fr) 1990-10-31
US4856699A (en) 1989-08-15
DE3739954A1 (de) 1988-09-15
FR2611550A1 (fr) 1988-09-09

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Legal Events

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