FR2599131B1 - Panneau et systeme de transfert thermique a pompage par capillarite - Google Patents

Panneau et systeme de transfert thermique a pompage par capillarite

Info

Publication number
FR2599131B1
FR2599131B1 FR868607288A FR8607288A FR2599131B1 FR 2599131 B1 FR2599131 B1 FR 2599131B1 FR 868607288 A FR868607288 A FR 868607288A FR 8607288 A FR8607288 A FR 8607288A FR 2599131 B1 FR2599131 B1 FR 2599131B1
Authority
FR
France
Prior art keywords
capillarity
heat transfer
pump heat
transfer panel
panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR868607288A
Other languages
English (en)
Other versions
FR2599131A1 (fr
Inventor
Fred Edelstein
Robert A Haslett
Robert L Kosson
William Harwell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Grumman Corp
Original Assignee
Grumman Aerospace Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grumman Aerospace Corp filed Critical Grumman Aerospace Corp
Publication of FR2599131A1 publication Critical patent/FR2599131A1/fr
Application granted granted Critical
Publication of FR2599131B1 publication Critical patent/FR2599131B1/fr
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24S—SOLAR HEAT COLLECTORS; SOLAR HEAT SYSTEMS
    • F24S10/00—Solar heat collectors using working fluids
    • F24S10/90—Solar heat collectors using working fluids using internal thermosiphonic circulation
    • F24S10/95—Solar heat collectors using working fluids using internal thermosiphonic circulation having evaporator sections and condenser sections, e.g. heat pipes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/40—Solar thermal energy, e.g. solar towers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/40—Solar thermal energy, e.g. solar towers
    • Y02E10/44—Heat exchange systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Sustainable Energy (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
FR868607288A 1982-03-22 1986-05-22 Panneau et systeme de transfert thermique a pompage par capillarite Expired FR2599131B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/360,321 US4602679A (en) 1982-03-22 1982-03-22 Capillary-pumped heat transfer panel and system

Publications (2)

Publication Number Publication Date
FR2599131A1 FR2599131A1 (fr) 1987-11-27
FR2599131B1 true FR2599131B1 (fr) 1989-12-01

Family

ID=23417498

Family Applications (1)

Application Number Title Priority Date Filing Date
FR868607288A Expired FR2599131B1 (fr) 1982-03-22 1986-05-22 Panneau et systeme de transfert thermique a pompage par capillarite

Country Status (3)

Country Link
US (1) US4602679A (fr)
DE (1) DE3617762C2 (fr)
FR (1) FR2599131B1 (fr)

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US4830097A (en) * 1987-07-15 1989-05-16 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Space vehicle thermal rejection system
US4931905A (en) * 1989-01-17 1990-06-05 Grumman Aerospace Corporation Heat pipe cooled electronic circuit card
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US5664427A (en) * 1989-03-08 1997-09-09 Rocky Research Rapid sorption cooling or freezing appliance
US5271239A (en) * 1990-11-13 1993-12-21 Rocky Research Cooling apparatus for electronic and computer components
US5174121A (en) * 1991-09-19 1992-12-29 Environmental Water Technology Purified liquid storage receptacle and a heat transfer assembly and method of heat transfer
US5697428A (en) * 1993-08-24 1997-12-16 Actronics Kabushiki Kaisha Tunnel-plate type heat pipe
CA2186488C (fr) * 1995-01-25 2000-01-18 Henry F. Villaume Systeme de gestion thermique
US5725049A (en) * 1995-10-31 1998-03-10 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Capillary pumped loop body heat exchanger
JP3164518B2 (ja) 1995-12-21 2001-05-08 古河電気工業株式会社 平面型ヒートパイプ
KR100211058B1 (ko) * 1995-12-23 1999-07-15 이계철 멀티칩 모듈의 냉각장치 및 방법
US5848637A (en) * 1997-04-29 1998-12-15 Lee; Richard Quick defrosting pad
US5975841A (en) * 1997-10-03 1999-11-02 Thermal Corp. Heat pipe cooling for turbine stators
FR2776764B1 (fr) * 1998-03-30 2000-06-30 Atmostat Etudes Et Rech Dispositif d'echanges thermiques a fluide biphasique actif et procede de fabrication d'un tel dispositif
FR2776763B1 (fr) * 1998-03-30 2000-07-21 Atmostat Etudes Et Rech Dispositif d'echanges thermiques a fluide biphasique actif et procede de fabrication d'un tel dispositif
US5953930A (en) * 1998-03-31 1999-09-21 International Business Machines Corporation Evaporator for use in an extended air cooling system for electronic components
US6230790B1 (en) 1999-05-10 2001-05-15 Lockheed Martin Corporation Thermal control system for spacecraft
US6382309B1 (en) * 2000-05-16 2002-05-07 Swales Aerospace Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction
US6843308B1 (en) 2000-12-01 2005-01-18 Atmostat Etudes Et Recherches Heat exchanger device using a two-phase active fluid, and a method of manufacturing such a device
US6657121B2 (en) * 2001-06-27 2003-12-02 Thermal Corp. Thermal management system and method for electronics system
US6536510B2 (en) 2001-07-10 2003-03-25 Thermal Corp. Thermal bus for cabinets housing high power electronics equipment
US6388882B1 (en) 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
WO2003050466A1 (fr) * 2001-12-13 2003-06-19 Sony Corporation Dispositif de refroidissement, dispositif materiel electronique et procede de fabrication du dispositif de refroidissement
US6819561B2 (en) * 2002-02-22 2004-11-16 Satcon Technology Corporation Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same
US6827134B1 (en) * 2002-04-30 2004-12-07 Sandia Corporation Parallel-plate heat pipe apparatus having a shaped wick structure
JP4032954B2 (ja) * 2002-07-05 2008-01-16 ソニー株式会社 冷却装置、電子機器装置、音響装置及び冷却装置の製造方法
TW540989U (en) * 2002-10-04 2003-07-01 Via Tech Inc Thin planar heat distributor
US20050039888A1 (en) * 2003-08-21 2005-02-24 Pfahnl Andreas C. Two-phase cooling apparatus and method for automatic test equipment
US20050045278A1 (en) * 2003-08-26 2005-03-03 Shu-Ju Lin Plate evaporator
CN1713376A (zh) * 2004-06-25 2005-12-28 鸿富锦精密工业（深圳）有限公司 液冷散热装置
TWI236870B (en) * 2004-06-29 2005-07-21 Ind Tech Res Inst Heat dissipation apparatus with microstructure layer and manufacture method thereof
US7219628B1 (en) 2004-11-17 2007-05-22 Texaco Inc. Vaporizer and methods relating to same
KR100659582B1 (ko) * 2004-12-10 2006-12-20 한국전자통신연구원 루프형 마이크로 열이송 장치
CN1913137B (zh) * 2005-08-12 2010-05-26 鸿富锦精密工业（深圳）有限公司 散热模组
US20080225489A1 (en) * 2006-10-23 2008-09-18 Teledyne Licensing, Llc Heat spreader with high heat flux and high thermal conductivity
US8482921B2 (en) 2006-10-23 2013-07-09 Teledyne Scientific & Imaging, Llc. Heat spreader with high heat flux and high thermal conductivity
TW200829852A (en) * 2007-01-09 2008-07-16 Univ Tamkang Loop heat pipe with a flat plate evaporator structure
US20080310116A1 (en) * 2007-06-15 2008-12-18 O'connor Kurt F Heatsink having an internal plenum
US8100170B2 (en) * 2007-08-01 2012-01-24 Advanced Thermal Device Inc. Evaporator, loop heat pipe module and heat generating apparatus
US8919426B2 (en) * 2007-10-22 2014-12-30 The Peregrine Falcon Corporation Micro-channel pulsating heat pipe
US8353334B2 (en) * 2007-12-19 2013-01-15 Teledyne Scientific & Imaging, Llc Nano tube lattice wick system
US8356657B2 (en) * 2007-12-19 2013-01-22 Teledyne Scientific & Imaging, Llc Heat pipe system
TWI413887B (zh) * 2008-01-07 2013-11-01 Compal Electronics Inc 熱管結構
US20100071880A1 (en) * 2008-09-22 2010-03-25 Chul-Ju Kim Evaporator for looped heat pipe system
US8579018B1 (en) 2009-03-23 2013-11-12 Hrl Laboratories, Llc Lightweight sandwich panel heat pipe
ATE554361T1 (de) * 2009-04-28 2012-05-15 Abb Research Ltd Wärmerohr mit gewundenem rohr
EP2246654B1 (fr) * 2009-04-29 2013-12-11 ABB Research Ltd. Échangeur thermique à thermosiphon à rangs multiples
US8573289B1 (en) 2009-07-20 2013-11-05 Hrl Laboratories, Llc Micro-architected materials for heat exchanger applications
US8453717B1 (en) 2009-07-20 2013-06-04 Hrl Laboratories, Llc Micro-architected materials for heat sink applications
JP5455503B2 (ja) * 2009-08-11 2014-03-26 モレックス インコーポレイテド 熱輸送ユニット、電子機器
US8921702B1 (en) 2010-01-21 2014-12-30 Hrl Laboratories, Llc Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments
US9546826B1 (en) 2010-01-21 2017-01-17 Hrl Laboratories, Llc Microtruss based thermal heat spreading structures
US8771330B1 (en) 2010-05-19 2014-07-08 Hrl Laboratories, Llc Personal artificial transpiration cooling system
US8857182B1 (en) 2010-05-19 2014-10-14 Hrl Laboratories, Llc Power generation through artificial transpiration
US10209003B2 (en) 2012-02-21 2019-02-19 Thermal Corp. Electronics cabinet and rack cooling system and method
US9405067B2 (en) 2013-03-13 2016-08-02 Hrl Laboratories, Llc Micro-truss materials having in-plane material property variations
CN105758240A (zh) * 2014-12-19 2016-07-13 富葵精密组件(深圳)有限公司 均温板及其制作方法
US10502498B2 (en) * 2015-07-20 2019-12-10 Delta Electronics, Inc. Slim vapor chamber
US10746475B2 (en) * 2016-08-01 2020-08-18 California Institute Of Technology Multi-phase thermal control apparatus, evaporators and methods of manufacture thereof
JP7163725B2 (ja) * 2018-01-12 2022-11-01 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、並びに、ベーパーチャンバシート及びベーパーチャンバの製造方法
US11114713B2 (en) 2018-06-21 2021-09-07 California Institute Of Technology Thermal management systems for battery cells and methods of their manufacture
US11408683B1 (en) * 2019-08-30 2022-08-09 Advanced Cooling Technologies, Inc. Heat transfer device having an enclosure and a non-permeable barrier inside the enclosure
US11745264B2 (en) 2019-11-14 2023-09-05 Rolls-Royce Corporation Fused filament fabrication of thermal management article
US11707788B2 (en) 2019-11-14 2023-07-25 Rolls-Royce Corporation Fused filament fabrication of vacuum insulator
US11680753B2 (en) * 2019-11-14 2023-06-20 Rolls-Royce Corporation Fused filament fabrication of heat pipe
CN111121510A (zh) * 2019-12-27 2020-05-08 东莞赛诺高德蚀刻科技有限公司 一种均温板及其制备方法
US12018892B2 (en) 2020-11-02 2024-06-25 California Institute Of Technology Systems and methods for thermal management using separable heat pipes and methods of manufacture thereof

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FR2216537B1 (fr) * 1973-02-06 1975-03-07 Gaz De France
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US4602679A (en) * 1982-03-22 1986-07-29 Grumman Aerospace Corporation Capillary-pumped heat transfer panel and system

Also Published As

Publication number Publication date
US4602679A (en) 1986-07-29
DE3617762A1 (de) 1987-12-03
FR2599131A1 (fr) 1987-11-27
DE3617762C2 (de) 1997-02-13

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Legal Events

Date Code Title Description
ST Notification of lapse