FR2583921B1 - Module de refroidissement par liquide de composants electroniques - Google Patents

Module de refroidissement par liquide de composants electroniques

Info

Publication number
FR2583921B1
FR2583921B1 FR868608866A FR8608866A FR2583921B1 FR 2583921 B1 FR2583921 B1 FR 2583921B1 FR 868608866 A FR868608866 A FR 868608866A FR 8608866 A FR8608866 A FR 8608866A FR 2583921 B1 FR2583921 B1 FR 2583921B1
Authority
FR
France
Prior art keywords
electronic components
liquid cooling
cooling module
module
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR868608866A
Other languages
English (en)
French (fr)
Other versions
FR2583921A1 (fr
Inventor
Yoshikatsu Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of FR2583921A1 publication Critical patent/FR2583921A1/fr
Application granted granted Critical
Publication of FR2583921B1 publication Critical patent/FR2583921B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
FR868608866A 1985-06-20 1986-06-19 Module de refroidissement par liquide de composants electroniques Expired FR2583921B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60134842A JPS61292944A (ja) 1985-06-20 1985-06-20 集積回路パツケ−ジの液体冷却構造

Publications (2)

Publication Number Publication Date
FR2583921A1 FR2583921A1 (fr) 1986-12-26
FR2583921B1 true FR2583921B1 (fr) 1989-04-07

Family

ID=15137738

Family Applications (1)

Application Number Title Priority Date Filing Date
FR868608866A Expired FR2583921B1 (fr) 1985-06-20 1986-06-19 Module de refroidissement par liquide de composants electroniques

Country Status (3)

Country Link
US (1) US4693303A (https=)
JP (1) JPS61292944A (https=)
FR (1) FR2583921B1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1303238C (en) * 1988-05-09 1992-06-09 Kazuhiko Umezawa Flat cooling structure of integrated circuit
US4882654A (en) * 1988-12-22 1989-11-21 Microelectronics And Computer Technology Corporation Method and apparatus for adjustably mounting a heat exchanger for an electronic component
US6665184B2 (en) 2001-07-13 2003-12-16 Lytron, Inc. Tapered cold plate
US7849914B2 (en) * 2006-05-02 2010-12-14 Clockspeed, Inc. Cooling apparatus for microelectronic devices
SG181180A1 (en) * 2010-11-12 2012-06-28 Semicaps Pte Ltd Apparatus and method for cooling a semiconductor device
US10049959B2 (en) 2011-03-25 2018-08-14 Philips Lighting Holding B.V. Thermal interface pad material with perforated liner
US9917034B2 (en) 2014-09-26 2018-03-13 Semicaps Pte Ltd Method and apparatus for cooling a semiconductor device
JP7334433B2 (ja) * 2019-03-19 2023-08-29 日本電気株式会社 放熱構造及び電子部品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4093971A (en) * 1976-12-10 1978-06-06 Burroughs Corporation D-I-P On island
US4226281A (en) * 1979-06-11 1980-10-07 International Business Machines Corporation Thermal conduction module
US4341432A (en) * 1979-08-06 1982-07-27 Cutchaw John M Liquid cooled connector for integrated circuit packages
US4381032A (en) * 1981-04-23 1983-04-26 Cutchaw John M Apparatus for cooling high-density integrated circuit packages

Also Published As

Publication number Publication date
JPS61292944A (ja) 1986-12-23
FR2583921A1 (fr) 1986-12-26
US4693303A (en) 1987-09-15
JPH0426549B2 (https=) 1992-05-07

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Legal Events

Date Code Title Description
ST Notification of lapse