FR2558645B1 - Organe de serrage pour montage de semi-conducteur de puissance - Google Patents

Organe de serrage pour montage de semi-conducteur de puissance

Info

Publication number
FR2558645B1
FR2558645B1 FR8400985A FR8400985A FR2558645B1 FR 2558645 B1 FR2558645 B1 FR 2558645B1 FR 8400985 A FR8400985 A FR 8400985A FR 8400985 A FR8400985 A FR 8400985A FR 2558645 B1 FR2558645 B1 FR 2558645B1
Authority
FR
France
Prior art keywords
clamp
power semiconductor
semiconductor mounting
mounting
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8400985A
Other languages
English (en)
Other versions
FR2558645A1 (fr
Inventor
Rene Lecomte
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telemecanique SA
Original Assignee
Telemecanique Electrique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telemecanique Electrique SA filed Critical Telemecanique Electrique SA
Priority to FR8400985A priority Critical patent/FR2558645B1/fr
Publication of FR2558645A1 publication Critical patent/FR2558645A1/fr
Application granted granted Critical
Publication of FR2558645B1 publication Critical patent/FR2558645B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR8400985A 1984-01-23 1984-01-23 Organe de serrage pour montage de semi-conducteur de puissance Expired FR2558645B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8400985A FR2558645B1 (fr) 1984-01-23 1984-01-23 Organe de serrage pour montage de semi-conducteur de puissance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8400985A FR2558645B1 (fr) 1984-01-23 1984-01-23 Organe de serrage pour montage de semi-conducteur de puissance

Publications (2)

Publication Number Publication Date
FR2558645A1 FR2558645A1 (fr) 1985-07-26
FR2558645B1 true FR2558645B1 (fr) 1986-09-19

Family

ID=9300380

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8400985A Expired FR2558645B1 (fr) 1984-01-23 1984-01-23 Organe de serrage pour montage de semi-conducteur de puissance

Country Status (1)

Country Link
FR (1) FR2558645B1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101155498B (zh) * 2006-09-29 2010-05-12 台达电子工业股份有限公司 电子组件与散热装置的组合结构

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI339789B (en) * 2006-09-29 2011-04-01 Delta Electronics Inc Device and heat sink

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2451632A1 (fr) * 1979-03-12 1980-10-10 Alsthom Atlantique Montage de semi-conducteurs de puissance refroidis par un flugene

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101155498B (zh) * 2006-09-29 2010-05-12 台达电子工业股份有限公司 电子组件与散热装置的组合结构

Also Published As

Publication number Publication date
FR2558645A1 (fr) 1985-07-26

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Legal Events

Date Code Title Description
ST Notification of lapse