FR2558643B1 - Substrat de cablage a couches multiples - Google Patents

Substrat de cablage a couches multiples

Info

Publication number
FR2558643B1
FR2558643B1 FR8500926A FR8500926A FR2558643B1 FR 2558643 B1 FR2558643 B1 FR 2558643B1 FR 8500926 A FR8500926 A FR 8500926A FR 8500926 A FR8500926 A FR 8500926A FR 2558643 B1 FR2558643 B1 FR 2558643B1
Authority
FR
France
Prior art keywords
wiring substrate
layer wiring
layer
substrate
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8500926A
Other languages
English (en)
Other versions
FR2558643A1 (fr
Inventor
Mitsuru Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of FR2558643A1 publication Critical patent/FR2558643A1/fr
Application granted granted Critical
Publication of FR2558643B1 publication Critical patent/FR2558643B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR8500926A 1984-01-23 1985-01-23 Substrat de cablage a couches multiples Expired FR2558643B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1074784A JPS60154596A (ja) 1984-01-23 1984-01-23 多層配線基板

Publications (2)

Publication Number Publication Date
FR2558643A1 FR2558643A1 (fr) 1985-07-26
FR2558643B1 true FR2558643B1 (fr) 1987-11-13

Family

ID=11758897

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8500926A Expired FR2558643B1 (fr) 1984-01-23 1985-01-23 Substrat de cablage a couches multiples

Country Status (2)

Country Link
JP (1) JPS60154596A (fr)
FR (1) FR2558643B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5127986A (en) * 1989-12-01 1992-07-07 Cray Research, Inc. High power, high density interconnect method and apparatus for integrated circuits
US5185502A (en) * 1989-12-01 1993-02-09 Cray Research, Inc. High power, high density interconnect apparatus for integrated circuits

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029382A1 (de) * 1980-08-01 1982-03-04 Siemens AG, 1000 Berlin und 8000 München Aufbau von metallschichten und verfahren zur herstellung dieses aufbaus
JPS57126154A (en) * 1981-01-30 1982-08-05 Nec Corp Lsi package

Also Published As

Publication number Publication date
FR2558643A1 (fr) 1985-07-26
JPS60154596A (ja) 1985-08-14

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Legal Events

Date Code Title Description
ST Notification of lapse