FR2555356A1 - Direct-transfer parallelepipedal capacitor and its method of manufacture - Google Patents
Direct-transfer parallelepipedal capacitor and its method of manufacture Download PDFInfo
- Publication number
- FR2555356A1 FR2555356A1 FR8318403A FR8318403A FR2555356A1 FR 2555356 A1 FR2555356 A1 FR 2555356A1 FR 8318403 A FR8318403 A FR 8318403A FR 8318403 A FR8318403 A FR 8318403A FR 2555356 A1 FR2555356 A1 FR 2555356A1
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- FR
- France
- Prior art keywords
- capacitor
- profiles
- metallized
- profile
- capacitors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 61
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims description 6
- 239000002184 metal Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 239000011140 metalized polyester Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
CONDENSATEUR PARALLELEPIPEDIQUE A REPORT
DIRECT ET SON PROCEDE DE FABRICATION
La présente invention un condensateur parallélépipédique à report direct et son procédé de fabrication.PARALLELEPIPEDIC CAPACITOR WITH REPORT
DIRECT AND ITS MANUFACTURING PROCESS
The present invention a direct transfer parallelepiped capacitor and its manufacturing process.
Les condensateurs de ce type mieux connu sous l'appellation anglo-saxonne condensateur "chip" sont des condensateurs de forme parallélépipédique comportant des connexions métallisées situées sur deux faces opposées du parallélépipède et qui sont directement reportées sur les circuits imprimés par collage puis passage dans une vague de soudure à environ 2600 durant quelques secondes. Capacitors of this type better known by the English term "chip" capacitor are capacitors of parallelepiped shape having metallized connections located on two opposite faces of the parallelepiped and which are directly transferred to the printed circuits by bonding and then passing through a solder wave at around 2600 for a few seconds.
La réalisation de condensateurs chip à partir de film diélectrique métallisé pose un certain nombre de problèmes. I1 est connu, par exemple du BF 2 011 553, de réaliser des condensateurs parallélépipédiques du type empilé à partir de diélectriques plastiques métallisés. Après bobinage sur une roue de grand diamètre de manière à former des condensateurs-mères superposés, puis schoopage des faces latérales desdits condensateurs-mères, ceux-ci sont découpés en condensateurs individuels, perpendiculairement aux schoopages latéraux. De tels condensateurs, bien qu'ayant la forme requise, ne sont pas en pratique utilisables en tant que condensateurs chip soudables selon le procédé mentionné plus haut.En effet, on constate que de tels condensateurs, en polyester métallisé, par exemple, sont dégradés par suite des déformations mécaniques dues au retrait des films utilisés, entre les deux faces non schoopées du parallélépipède correspondant aux faces de sciage du condensateur-mère. The production of chip capacitors from metallized dielectric film poses a certain number of problems. It is known, for example from BF 2 011 553, to produce parallelepipedic capacitors of the stacked type from metallized plastic dielectrics. After winding on a large diameter wheel so as to form superimposed mother capacitors, then schooping the side faces of said mother capacitors, these are cut into individual capacitors, perpendicular to the side schoopings. Such capacitors, although having the required shape, cannot in practice be used as solderable chip capacitors according to the process mentioned above. Indeed, it is found that such capacitors, made of metallized polyester, for example, are degraded as a result of mechanical deformations due to the shrinkage of the films used, between the two non-schooped faces of the parallelepiped corresponding to the sawing faces of the mother capacitor.
Le condensateur chip selon l'invention permet de résoudre le problème posé. Dans ce but, ce condensateur est caractérisé en ce qu'il comporte, en outre, un premier et un second profilés métalliques à section en forme de U orienté face aux connexions latérales métallisées, chaque profilé comportant un doigt de connexion métal lique solidaire d'une part du profilé dans le fond de la gorge en forme de U de celui-ci et d'autre part de la connexion latérale métallisée du condensateur située face au profilé, un matériau isolant de remplissage étant disposé entre les premier et second profilés de manière à enrober les couches diélectriques, les connexions latérales métallisées ainsi que les doigts de connexions métalliques. The chip capacitor according to the invention makes it possible to solve the problem posed. For this purpose, this capacitor is characterized in that it further comprises a first and a second metal section with a U-shaped section oriented opposite the metallized lateral connections, each section comprising a metal connection finger integral with one part of the profile in the bottom of the U-shaped groove thereof and on the other hand the metallized lateral connection of the capacitor located opposite the profile, an insulating filling material being disposed between the first and second profiles so to coat the dielectric layers, the metallic side connections as well as the metal connection fingers.
De préférence, le doigt de connexion métallique proviendra d'une découpe partielle du fond du profilé en U et d'un cambrage vers l'intérieur du U de cette découpe. Preferably, the metal connection finger will come from a partial cutting of the bottom of the U-shaped profile and from an inward bending of the U of this cutting.
On a en effet constaté que les connexions du condensateur selon l'invention consistent à définir dans les contacts électriques du condensateur, constitués par les profilés en U, des zones d'étranglement de manière à diminuer la conduction thermique au niveau des doigts de contact tout en assurant une conduction électrique satisfaisante. En effet, l'utilisation de doigts de contact, entre chaque schoopage latéral du parallélépipède et la connexion électrique extérieure du condensateur terminé réduit la conduction thermique entre le condensateur lui-même et la connexion électrique extérieure. De cette manière, au cours de l'étape de soudure à la vague, la transmission de chaleur est suffisamment faible pour n'entrainer aucune dégradation du condensateur lui-même. It has in fact been found that the connections of the capacitor according to the invention consist in defining in the electrical contacts of the capacitor, constituted by the U-shaped profiles, throttling zones so as to reduce the thermal conduction at the level of the contact fingers. ensuring satisfactory electrical conduction. Indeed, the use of contact fingers, between each lateral schooping of the parallelepiped and the external electrical connection of the finished capacitor reduces the thermal conduction between the capacitor itself and the external electrical connection. In this way, during the wave soldering step, the heat transmission is low enough to cause no degradation of the capacitor itself.
L'invention concerne également un procédé de fabrication d'un tel condensateur. The invention also relates to a method of manufacturing such a capacitor.
Selon une première variante de réalisation, les condensateurs individuels sont placés entre deux doigts opposés des deux profilés, enrobés ensemble d'un matériau isolant de remplissage puis découpés en condensateurs parallélépipédiques à report direct par sciage entre les condensateurs proprement dit. Dans cette première variante, toutes les faces du condensateur à report direct sont protégées par un matériau de remplissage. According to a first alternative embodiment, the individual capacitors are placed between two opposite fingers of the two profiles, coated together with an insulating filling material and then cut into parallelepipedal capacitors with direct transfer by sawing between the capacitors proper. In this first variant, all the faces of the direct transfer capacitor are protected by a filling material.
Dans une seconde variante de réalisation, le procédé selon l'invention consiste à placer un condensateur-mère plat entre les deux profilés disposés face à face munis chacun d'une pluralité de doigts tels que définis ci-dessus, à enrober l'ensemble à l'aide d'un matériau isolant de remplissage, puis à découper cet ensemble en condensateurs individuels. Dans cette seconde variante, les faces latérales des condensateurs à report direct ne sont pas protégées par le matériau isolant de remplissage. Celui-ci étant cependant disposé sous le condensateur dans la zone où celui-ci est collé sur le circuit imprimé, tandis que les doigts métalliques réduisent la conduction thermique, un condensateur réalisé selon cette seconde variante donne malgré tout satisfaction lors de la soudure à la vague sur circuit imprimé. In a second variant embodiment, the method according to the invention consists in placing a flat mother capacitor between the two profiles arranged face to face each provided with a plurality of fingers as defined above, to coat the assembly with using an insulating filling material, then cut this assembly into individual capacitors. In this second variant, the lateral faces of the direct transfer capacitors are not protected by the insulating filling material. However, the latter being placed under the capacitor in the area where it is glued to the printed circuit, while the metal fingers reduce thermal conduction, a capacitor produced according to this second variant is nevertheless satisfactory during soldering. wave on printed circuit.
Selon les deux variantes, mais plus particulièrement dans le cas de la seconde, on utilisera comme matériau isolant de remplissage qui résiste au traitement thermique à température élevée, (c1est-à-dire résistant sans déformation sensible à l'immersion à 2600 pendant environ 10 secondes), des matériaux qui seront par ailleurs mauvais conducteurs de la chaleur et à faible coefficient de dilatation. A titre d'exemple, on pourra utiliser des résines adaptées, par exemple époxy, chargées de billes de verre, de paillettes de mica, ou des résines alvéolées du type mousse de polyuréthane. Bien entendu, les doigts de contact en particulier seront de préférence en matériaux à faible conduction thermique (acier, bronze), l'ensemble du profilé en U étant généralement réalisé dans ces matériaux selon la variante préférentielle de l'invention. According to the two variants, but more particularly in the case of the second, use will be made as insulating filling material which resists heat treatment at high temperature, (that is to say resistant without deformation sensitive to immersion at 2600 for approximately 10 seconds), materials which will otherwise be poor conductors of heat and with a low coefficient of expansion. By way of example, suitable resins, for example epoxy, loaded with glass beads, mica flakes, or cellular resins of the polyurethane foam type may be used. Of course, the contact fingers in particular will preferably be made of materials with low thermal conduction (steel, bronze), the whole of the U-shaped profile being generally made of these materials according to the preferred variant of the invention.
L'invention sera mieux comprise à l'aide des exemples de réalisation suivants, donnés à titre non limitatif, conjointement avec les figures qui représentent:
- la figure I, une vue en coupe des différentes étapes de réalisation du condensateur selon l'invention;
- la figure 2, une vue d'un profilé utilisé pour la réalisation d'un condènsateur tel que décrit sur la figure 1.The invention will be better understood with the aid of the following exemplary embodiments, given without limitation, together with the figures which represent:
- Figure I, a sectional view of the various stages of production of the capacitor according to the invention;
- Figure 2, a view of a profile used for the production of a capacitor as described in Figure 1.
La figure 1 représente une vue en coupe des différentes étapes de réalisation d'un condensateur selon l'invention. La figure la représente une vue en coupe d'un condensateur par exemple du type constitué d'un empilement 1 de couches diélectriques métallisées (par exemple polyester métallisé) les couches métalliques de rangs pair et impair étant respectivement reliées entre elles par des connexions latérales métallisées du type schoopages 2 et 3. FIG. 1 represents a sectional view of the various stages of production of a capacitor according to the invention. FIG. 1a shows a sectional view of a capacitor, for example of the type consisting of a stack 1 of metallized dielectric layers (for example metallized polyester), the metallic layers of even and odd rows being respectively connected together by metallized lateral connections schoopage type 2 and 3.
La figure lb représente une vue en coupe du profilé représenté sur la figure 2 vue en coupe selon la ligne AA. Les profilés 4 et 5 comportent respectivement deux bras latéraux 6 et 7, 8 et 9, reliés entre eux par une base ou fond respectivement 10, 11. Reliés aux fonds 10 et 11 des profilés 4 et 5 dans un plan situé en avant ou en arrière de celui de la figure, sont placés des doigts d'interconnexion 12 et 13 comportant une partie plane 14, 15 qui vient s'appliquer (figure lc) sur les schoopages latéraux respectivement 2 et-3. La soudure des parties planes 14 et 15 de ces doigts sur les schoopages 2 et 3 s'effectue de manière connue en soi, par exemple soudure électrique, soudure laser, etc... Figure lb shows a sectional view of the profile shown in Figure 2 sectional view along line AA. Profiles 4 and 5 respectively have two lateral arms 6 and 7, 8 and 9, interconnected by a base or bottom respectively 10, 11. Connected to the bottoms 10 and 11 of profiles 4 and 5 in a plane located in front or in rear of that of the figure, are placed interconnection fingers 12 and 13 comprising a flat part 14, 15 which is applied (FIG. 1c) on the lateral schoopings 2 and -3 respectively. The welding of the flat parts 14 and 15 of these fingers on the schoopings 2 and 3 is carried out in a manner known per se, for example electric welding, laser welding, etc.
Lorsque les profilés 4 et 5 ont été rendus solidaires des condensateurs tels que 1, l'ensemble de l'espace délimité entre les deux profilés 4 et 5 se faisant face est alors rempli d'un matériau isolant 16 entourant complètement le condensateur 1, les schoopages 2 et 3, les doigts 12 et 13 jusqu'au fond des profilés 4 et 5 en forme de U. Ceux-å apparaissent alors sur le condensateur fini comme étant les zones de connexion du condensateur sur le circuit imprimé d'utilisation. Par exemple, les bras 7 et 9 seront fixés sur le circuit imprimé par soudure à la vague. Sur le circuit imprimé 17 (figure ld), a été fixé le condensateur tel que terminé 18 par l'intermédiaire d'un point de colle 19 avant soudure à la vague des bras 7 et 9 par dépôt de soudure en 20 et 21. When the sections 4 and 5 have been made integral with the capacitors such as 1, the entire space delimited between the two sections 4 and 5 facing each other is then filled with an insulating material 16 completely surrounding the capacitor 1, the schoopages 2 and 3, fingers 12 and 13 to the bottom of the U-shaped profiles 4 and 5. These then appear on the finished capacitor as being the connection zones of the capacitor on the printed circuit of use. For example, the arms 7 and 9 will be fixed to the printed circuit by wave soldering. On the printed circuit 17 (FIG. 1d), the capacitor was fixed as finished 18 by means of a point of glue 19 before welding to the wave of the arms 7 and 9 by depositing solder at 20 and 21.
La figure 2 est une vue du profilé utilisé pour la fabrication des condensateurs selon l'invention. Sur cette figure, les mêmes éléments que ceux des figures précédentes portent les mêmes références. Le profilé utilisé comporte une section en forme de U avec des bras latéraux 4 et 7 et un fond 10. Dans ce fond, sont découpés une pluralité de doigts tels que 14, cette découpe étant partielle, le doigt étant maintenu solidaire par une de ses extrémités au fond du profilé. Après cambrage du doigt vers l'intérieur du U, entre ces deux bras, la partie plane 14 du doigt 12 vient affleurer légèrement au-dessus du niveau supérieure déterminée par les bras 6 et 7. Figure 2 is a view of the profile used for the manufacture of capacitors according to the invention. In this figure, the same elements as those of the previous figures have the same references. The profile used has a U-shaped section with lateral arms 4 and 7 and a bottom 10. In this bottom, a plurality of fingers such as 14 are cut, this cutting being partial, the finger being held integral by one of its ends at the bottom of the profile. After bending the finger towards the inside of the U, between these two arms, the flat part 14 of the finger 12 comes to be exposed slightly above the upper level determined by the arms 6 and 7.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8318403A FR2555356B1 (en) | 1983-11-18 | 1983-11-18 | PARALLELEPIPEDIC CAPACITOR WITH DIRECT REPORT AND MANUFACTURING METHOD THEREOF |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8318403A FR2555356B1 (en) | 1983-11-18 | 1983-11-18 | PARALLELEPIPEDIC CAPACITOR WITH DIRECT REPORT AND MANUFACTURING METHOD THEREOF |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2555356A1 true FR2555356A1 (en) | 1985-05-24 |
| FR2555356B1 FR2555356B1 (en) | 1986-02-21 |
Family
ID=9294289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8318403A Expired FR2555356B1 (en) | 1983-11-18 | 1983-11-18 | PARALLELEPIPEDIC CAPACITOR WITH DIRECT REPORT AND MANUFACTURING METHOD THEREOF |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2555356B1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0206584A1 (en) * | 1985-06-07 | 1986-12-30 | American Precision Industries Inc | Surface mountable electronic device |
| EP0229286A1 (en) * | 1985-12-17 | 1987-07-22 | Siemens Aktiengesellschaft | Electrical component in the form of a chip |
| EP0289934A1 (en) * | 1987-05-05 | 1988-11-09 | Siemens Aktiengesellschaft | Chip-type electric component and method for its production |
| EP0359856A1 (en) * | 1988-04-09 | 1990-03-28 | Georg Sillner | Process and device for converting cylindrical electric components |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB436642A (en) * | 1935-05-01 | 1935-10-15 | Percy Archibald Sporing | Improvements in or relating to electrical condensers |
| GB2027274A (en) * | 1978-07-31 | 1980-02-13 | Sprague Electric Co | Encapsulated capacitor and method of assembling same |
| DE3134617A1 (en) * | 1981-09-01 | 1983-03-17 | Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut | Foil capacitor of chip construction, and a method for its production |
-
1983
- 1983-11-18 FR FR8318403A patent/FR2555356B1/en not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB436642A (en) * | 1935-05-01 | 1935-10-15 | Percy Archibald Sporing | Improvements in or relating to electrical condensers |
| GB2027274A (en) * | 1978-07-31 | 1980-02-13 | Sprague Electric Co | Encapsulated capacitor and method of assembling same |
| DE3134617A1 (en) * | 1981-09-01 | 1983-03-17 | Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut | Foil capacitor of chip construction, and a method for its production |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0206584A1 (en) * | 1985-06-07 | 1986-12-30 | American Precision Industries Inc | Surface mountable electronic device |
| EP0229286A1 (en) * | 1985-12-17 | 1987-07-22 | Siemens Aktiengesellschaft | Electrical component in the form of a chip |
| EP0289934A1 (en) * | 1987-05-05 | 1988-11-09 | Siemens Aktiengesellschaft | Chip-type electric component and method for its production |
| EP0359856A1 (en) * | 1988-04-09 | 1990-03-28 | Georg Sillner | Process and device for converting cylindrical electric components |
| US4968377A (en) * | 1988-04-09 | 1990-11-06 | Georg Sillner | Method and apparatus for shaping cylindrical electrical parts |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2555356B1 (en) | 1986-02-21 |
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