FR2533796B1 - Procede de mise en place automatique de composants semi-conducteurs integres sur des plaques de circuit imprime et dispositif pour sa mise en oeuvre - Google Patents

Procede de mise en place automatique de composants semi-conducteurs integres sur des plaques de circuit imprime et dispositif pour sa mise en oeuvre

Info

Publication number
FR2533796B1
FR2533796B1 FR8314936A FR8314936A FR2533796B1 FR 2533796 B1 FR2533796 B1 FR 2533796B1 FR 8314936 A FR8314936 A FR 8314936A FR 8314936 A FR8314936 A FR 8314936A FR 2533796 B1 FR2533796 B1 FR 2533796B1
Authority
FR
France
Prior art keywords
printed circuit
semiconductor components
integrated semiconductor
circuit plates
automatically placing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8314936A
Other languages
English (en)
Other versions
FR2533796A1 (fr
Inventor
Dieter List
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schwarzwalder Elektronik Werke GmbH
Original Assignee
Schwarzwalder Elektronik Werke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schwarzwalder Elektronik Werke GmbH filed Critical Schwarzwalder Elektronik Werke GmbH
Publication of FR2533796A1 publication Critical patent/FR2533796A1/fr
Application granted granted Critical
Publication of FR2533796B1 publication Critical patent/FR2533796B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0439—Feeding one by one by other means than belts incorporating means for treating the terminal leads only before insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
FR8314936A 1982-09-23 1983-09-20 Procede de mise en place automatique de composants semi-conducteurs integres sur des plaques de circuit imprime et dispositif pour sa mise en oeuvre Expired FR2533796B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823235139 DE3235139A1 (de) 1982-09-23 1982-09-23 Verfahren zum automatischen bestuecken von leiterplatten mit halbleiterbauteilen mit integrierten schaltungen und vorrichtungen zur durchfuehrung der verfahren

Publications (2)

Publication Number Publication Date
FR2533796A1 FR2533796A1 (fr) 1984-03-30
FR2533796B1 true FR2533796B1 (fr) 1987-11-20

Family

ID=6173898

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8314936A Expired FR2533796B1 (fr) 1982-09-23 1983-09-20 Procede de mise en place automatique de composants semi-conducteurs integres sur des plaques de circuit imprime et dispositif pour sa mise en oeuvre

Country Status (3)

Country Link
JP (1) JPS59130500A (fr)
DE (1) DE3235139A1 (fr)
FR (1) FR2533796B1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4731923A (en) * 1986-03-15 1988-03-22 Tdk Corporation Apparatus and method for mounting circuit element on printed circuit board
DE3631774A1 (de) * 1986-09-18 1988-03-31 Siemens Ag Verfahren und vorrichtung zum ausrichten und fixieren einer halbleiter-wafer auf einer traegervorrichtung
FR2668878B1 (fr) * 1990-11-05 1992-11-20 Renouf Gilbert Machine a former des composants electroniques.
US5146661A (en) * 1990-11-07 1992-09-15 At&T Bell Laboratories Packaged device handling method and apparatus
DE10130015B4 (de) * 2000-07-01 2014-03-13 Marquardt Gmbh Handhabungsvorrichtung

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3442432A (en) * 1967-06-15 1969-05-06 Western Electric Co Bonding a beam-leaded device to a substrate
FR2365209A1 (fr) * 1976-09-20 1978-04-14 Cii Honeywell Bull Procede pour le montage de micro-plaquettes de circuits integres sur un substrat et installation pour sa mise en oeuvre

Also Published As

Publication number Publication date
FR2533796A1 (fr) 1984-03-30
DE3235139A1 (de) 1984-03-29
JPS59130500A (ja) 1984-07-27

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Legal Events

Date Code Title Description
ST Notification of lapse