FR2529386B1 - ELECTRONIC CIRCUIT BOX HAVING A CAPACITOR - Google Patents

ELECTRONIC CIRCUIT BOX HAVING A CAPACITOR

Info

Publication number
FR2529386B1
FR2529386B1 FR8211402A FR8211402A FR2529386B1 FR 2529386 B1 FR2529386 B1 FR 2529386B1 FR 8211402 A FR8211402 A FR 8211402A FR 8211402 A FR8211402 A FR 8211402A FR 2529386 B1 FR2529386 B1 FR 2529386B1
Authority
FR
France
Prior art keywords
capacitor
electronic circuit
circuit box
box
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8211402A
Other languages
French (fr)
Other versions
FR2529386A1 (en
Inventor
Christian Val
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INF MILIT SPATIALE AERONAUT
Original Assignee
INF MILIT SPATIALE AERONAUT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INF MILIT SPATIALE AERONAUT filed Critical INF MILIT SPATIALE AERONAUT
Priority to FR8211402A priority Critical patent/FR2529386B1/en
Publication of FR2529386A1 publication Critical patent/FR2529386A1/en
Application granted granted Critical
Publication of FR2529386B1 publication Critical patent/FR2529386B1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/647—Resistive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
FR8211402A 1982-06-29 1982-06-29 ELECTRONIC CIRCUIT BOX HAVING A CAPACITOR Expired FR2529386B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8211402A FR2529386B1 (en) 1982-06-29 1982-06-29 ELECTRONIC CIRCUIT BOX HAVING A CAPACITOR

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8211402A FR2529386B1 (en) 1982-06-29 1982-06-29 ELECTRONIC CIRCUIT BOX HAVING A CAPACITOR

Publications (2)

Publication Number Publication Date
FR2529386A1 FR2529386A1 (en) 1983-12-30
FR2529386B1 true FR2529386B1 (en) 1985-12-13

Family

ID=9275516

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8211402A Expired FR2529386B1 (en) 1982-06-29 1982-06-29 ELECTRONIC CIRCUIT BOX HAVING A CAPACITOR

Country Status (1)

Country Link
FR (1) FR2529386B1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2550009B1 (en) * 1983-07-29 1986-01-24 Inf Milit Spatiale Aeronaut ELECTRONIC COMPONENT HOUSING PROVIDED WITH A CAPACITOR
LU85135A1 (en) * 1983-12-14 1985-09-12 Bonameau Jean Marie PROTECTION DEVICE AGAINST DISTURBANCES AND / OR PARASITES IN THE VICINITY OF INTEGRATED CIRCUITS
FR2565032B1 (en) * 1984-05-25 1987-02-20 Inf Milit Spatiale Aeronaut ELECTRICAL POTENTIAL DISTRIBUTION DEVICE AND ELECTRONIC COMPONENT PACKAGE INCORPORATING SUCH A DEVICE
DE3679627D1 (en) * 1985-09-24 1991-07-11 Contraves Ag MULTILAYER PRINTED CIRCUIT BOARD.
US4918571A (en) * 1987-03-31 1990-04-17 Amp Incorporated Chip carrier with energy storage means
EP0285277A1 (en) * 1987-03-31 1988-10-05 Amp Incorporated Chip carrier with energy storage means
FR2802706B1 (en) * 1999-12-15 2002-03-01 3D Plus Sa METHOD AND DEVICE FOR THREE-DIMENSIONAL INTERCONNECTION OF ELECTRONIC COMPONENTS
FR2940521B1 (en) 2008-12-19 2011-11-11 3D Plus COLLECTIVE MANUFACTURING METHOD OF ELECTRONIC MODULES FOR SURFACE MOUNTING

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2376520A1 (en) * 1976-12-31 1978-07-28 Radiotechnique Compelec Semiconductive diode with externally connected electrodes - using conductive film of cycloaliphatic resin contg. e.g. carbon black or metal powder
US4249196A (en) * 1978-08-21 1981-02-03 Burroughs Corporation Integrated circuit module with integral capacitor
FR2495837A1 (en) * 1980-12-09 1982-06-11 Thomson Csf Miniature packing for hybrid integrated circuit - provides capacitative coupling for certain connections using deposited electrode plates

Also Published As

Publication number Publication date
FR2529386A1 (en) 1983-12-30

Similar Documents

Publication Publication Date Title
FR2620296B1 (en) ELECTRONIC CIRCUIT BOX
DE3481107D1 (en) ELECTRONIC CIRCUIT ARRANGEMENT.
FR2550009B1 (en) ELECTRONIC COMPONENT HOUSING PROVIDED WITH A CAPACITOR
KR850009741U (en) Case for electronic devices
KR850009742U (en) Case for electronic devices
HK99586A (en) A circuit board assembly
IT1183713B (en) ELECTRONIC CIRCUIT BREAKER
FR2629665B1 (en) ELECTRONIC CIRCUIT BOX
AT377136B (en) ELECTRONIC SWITCH
DE3166286D1 (en) Electronic switching circuit
IT1168827B (en) BOX FOR ELECTRICAL OR ELECTRONIC COMPONENTS
FR2529386B1 (en) ELECTRONIC CIRCUIT BOX HAVING A CAPACITOR
FR2501377B1 (en) ELECTRONIC WATTHEMETER
KR850700100A (en) Electronic circuit assembly
DE3382730D1 (en) Inexpensive design process for electronic devices.
KR840000815U (en) Electronic switchgear
JPS5720500A (en) Electronic circuit module
BE886375R (en) ELECTRONIC MOUNTING OF CIRCUIT BREAKDOWN
FR2584865B1 (en) ELECTRONIC COMPONENT HAVING A CAPACITOR
GB8315265D0 (en) Electronic circuits
ES533205A0 (en) A CIRCUIT BREAKER
GB8332221D0 (en) Electronic circuits
JPS57112098A (en) Electronic circuit element
GB2072984B (en) Electronic circuits
KR840003494U (en) Electronic tuner

Legal Events

Date Code Title Description
ST Notification of lapse