FR2523775A1 - Support de composant electronique pour essais climatiques, agence pour etre reutilisable - Google Patents
Support de composant electronique pour essais climatiques, agence pour etre reutilisable Download PDFInfo
- Publication number
- FR2523775A1 FR2523775A1 FR8204527A FR8204527A FR2523775A1 FR 2523775 A1 FR2523775 A1 FR 2523775A1 FR 8204527 A FR8204527 A FR 8204527A FR 8204527 A FR8204527 A FR 8204527A FR 2523775 A1 FR2523775 A1 FR 2523775A1
- Authority
- FR
- France
- Prior art keywords
- sockets
- card
- columns
- socket
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 12
- 230000007613 environmental effect Effects 0.000 title 1
- 230000008707 rearrangement Effects 0.000 title 1
- 238000004088 simulation Methods 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 6
- 239000004809 Teflon Substances 0.000 claims description 4
- 229920006362 Teflon® Polymers 0.000 claims description 4
- 229910000906 Bronze Inorganic materials 0.000 claims description 3
- 229910052790 beryllium Inorganic materials 0.000 claims description 3
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000010974 bronze Substances 0.000 claims description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 244000245420 ail Species 0.000 claims 1
- 210000001072 colon Anatomy 0.000 claims 1
- 235000004611 garlic Nutrition 0.000 claims 1
- 239000011159 matrix material Substances 0.000 abstract description 5
- 239000003990 capacitor Substances 0.000 abstract description 3
- 238000003466 welding Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10212—Programmable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10606—Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8204527A FR2523775A1 (fr) | 1982-03-17 | 1982-03-17 | Support de composant electronique pour essais climatiques, agence pour etre reutilisable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8204527A FR2523775A1 (fr) | 1982-03-17 | 1982-03-17 | Support de composant electronique pour essais climatiques, agence pour etre reutilisable |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2523775A1 true FR2523775A1 (fr) | 1983-09-23 |
| FR2523775B1 FR2523775B1 (enExample) | 1985-01-18 |
Family
ID=9272100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8204527A Granted FR2523775A1 (fr) | 1982-03-17 | 1982-03-17 | Support de composant electronique pour essais climatiques, agence pour etre reutilisable |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2523775A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114389099A (zh) * | 2020-10-16 | 2022-04-22 | 中航光电科技股份有限公司 | 一种能够传输瞬态超大电流的电源连接器 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3002169A (en) * | 1957-03-06 | 1961-09-26 | Gen Dynamics Corp | Electrical interconnection device |
| DE1938514A1 (de) * | 1969-07-29 | 1971-02-18 | Standard Elek K Lorenz Ag | Steckbare Rangiervorrichtung zum Durchschalten von Leitungen,insbesondere in Eisenbahnsicherungsanlagen |
| BE817634A (fr) * | 1973-07-13 | 1974-11-04 | Dispositif pour la connexion programmee de systemes telephoniques d'intercommunication | |
| DE2900838A1 (de) * | 1979-01-11 | 1980-07-24 | Bruno M Hess | Leiterplatte |
-
1982
- 1982-03-17 FR FR8204527A patent/FR2523775A1/fr active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3002169A (en) * | 1957-03-06 | 1961-09-26 | Gen Dynamics Corp | Electrical interconnection device |
| DE1938514A1 (de) * | 1969-07-29 | 1971-02-18 | Standard Elek K Lorenz Ag | Steckbare Rangiervorrichtung zum Durchschalten von Leitungen,insbesondere in Eisenbahnsicherungsanlagen |
| BE817634A (fr) * | 1973-07-13 | 1974-11-04 | Dispositif pour la connexion programmee de systemes telephoniques d'intercommunication | |
| DE2900838A1 (de) * | 1979-01-11 | 1980-07-24 | Bruno M Hess | Leiterplatte |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114389099A (zh) * | 2020-10-16 | 2022-04-22 | 中航光电科技股份有限公司 | 一种能够传输瞬态超大电流的电源连接器 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2523775B1 (enExample) | 1985-01-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6069482A (en) | Ball grid array package emulator | |
| EP0239494A1 (fr) | Boîtier de circuit intégré | |
| US5489854A (en) | IC chip test socket with double-ended spring biased contacts | |
| KR19980701964A (ko) | 볼 그리드 어레이 소자용 탑 로드 소켓 | |
| US5325081A (en) | Supported strain gauge and joy stick assembly and method of making | |
| US4952529A (en) | Method of coupling a terminal to a thick film circuit board | |
| CN209690357U (zh) | 多功能芯片固定装置 | |
| JP2008309787A (ja) | プローブカード用プローブ組立体 | |
| US7119561B2 (en) | Electrical connecting apparatus | |
| FR2489611A1 (fr) | Procede de fabrication d'un support d'affichage pour diode electroluminescente | |
| FR2594603A1 (fr) | Connecteur pour bus informatique | |
| CA1183229A (fr) | Connecteur electrique a couplage multiple et connecteurs multiples de mesure pour cartes de circuits d'equipement electronique monte en chassis en faisant application | |
| US5475224A (en) | Infrared detector substrate with breakaway test tabs | |
| FR2524649A1 (fr) | Dispositif de controle de cartes de circuits imprimes | |
| JPH07113840A (ja) | 半導体ダイの試験に使用される交換可能な基板を備えたキャリア | |
| US6027354A (en) | High temperature test fixture | |
| US3898535A (en) | Mounting frame for electronic components | |
| US5924876A (en) | High density electrical connector having an alignment feature | |
| CN111474465A (zh) | 用于emmi分析的扁平封装半导体器件夹具及分析方法 | |
| FR2827964A1 (fr) | Dispositif de montage d'un boitier lga et procede d'etablissement de contacts avec le boitier | |
| JP3734992B2 (ja) | 多光軸光電スイッチ | |
| TWI811005B (zh) | 可拆式測試裝置 | |
| JPH08136601A (ja) | バックボード用布線試験治具 | |
| EP0023165A1 (fr) | Plate-forme support de grille de connexion, notamment pour boîtier de circuits intégrés, et boîtier comportant une telle plate-forme | |
| JP2000030825A (ja) | Icソケット及びロケータ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |