FR2518809A1 - Circuits integres a finesse de motif variable et procede de fabrication - Google Patents
Circuits integres a finesse de motif variable et procede de fabrication Download PDFInfo
- Publication number
- FR2518809A1 FR2518809A1 FR8123725A FR8123725A FR2518809A1 FR 2518809 A1 FR2518809 A1 FR 2518809A1 FR 8123725 A FR8123725 A FR 8123725A FR 8123725 A FR8123725 A FR 8123725A FR 2518809 A1 FR2518809 A1 FR 2518809A1
- Authority
- FR
- France
- Prior art keywords
- lines
- rectangle
- pattern
- corners
- intervals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000010354 integration Effects 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 title abstract description 3
- 238000000034 method Methods 0.000 claims description 7
- 238000005286 illumination Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 238000006073 displacement reaction Methods 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 230000004304 visual acuity Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- -1 transistors Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8123725A FR2518809A1 (fr) | 1981-12-18 | 1981-12-18 | Circuits integres a finesse de motif variable et procede de fabrication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8123725A FR2518809A1 (fr) | 1981-12-18 | 1981-12-18 | Circuits integres a finesse de motif variable et procede de fabrication |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2518809A1 true FR2518809A1 (fr) | 1983-06-24 |
| FR2518809B1 FR2518809B1 (https=) | 1984-04-06 |
Family
ID=9265179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8123725A Granted FR2518809A1 (fr) | 1981-12-18 | 1981-12-18 | Circuits integres a finesse de motif variable et procede de fabrication |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2518809A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0514094A3 (en) * | 1991-05-16 | 1992-12-30 | AT&T Corp. | Method of fabricating an integrated circuit |
| US5767949A (en) * | 1991-03-05 | 1998-06-16 | Hitachi, Ltd. | Exposure apparatus and method |
-
1981
- 1981-12-18 FR FR8123725A patent/FR2518809A1/fr active Granted
Non-Patent Citations (2)
| Title |
|---|
| EXBK/69 * |
| EXBK/78 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5767949A (en) * | 1991-03-05 | 1998-06-16 | Hitachi, Ltd. | Exposure apparatus and method |
| US6016187A (en) * | 1991-03-05 | 2000-01-18 | Hitachi, Ltd. | Exposure apparatus and method |
| EP0503472B1 (en) * | 1991-03-05 | 2001-10-24 | Hitachi, Ltd. | Exposure apparatus and method |
| US7012671B2 (en) | 1991-03-05 | 2006-03-14 | Renesas Technology Corp. | Exposure apparatus and method |
| US7277155B2 (en) | 1991-03-05 | 2007-10-02 | Renesas Technology Corp. | Exposure apparatus and method |
| US7598020B2 (en) | 1991-03-05 | 2009-10-06 | Renesas Technology Corporation | Exposure apparatus and method |
| US7604925B2 (en) | 1991-03-05 | 2009-10-20 | Renesas Technology Corporation | Exposure apparatus and method |
| EP0514094A3 (en) * | 1991-05-16 | 1992-12-30 | AT&T Corp. | Method of fabricating an integrated circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2518809B1 (https=) | 1984-04-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| D6 | Patent endorsed licences of rights |