FR2511193B1 - - Google Patents

Info

Publication number
FR2511193B1
FR2511193B1 FR8115361A FR8115361A FR2511193B1 FR 2511193 B1 FR2511193 B1 FR 2511193B1 FR 8115361 A FR8115361 A FR 8115361A FR 8115361 A FR8115361 A FR 8115361A FR 2511193 B1 FR2511193 B1 FR 2511193B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8115361A
Other languages
French (fr)
Other versions
FR2511193A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8115361A priority Critical patent/FR2511193A1/fr
Publication of FR2511193A1 publication Critical patent/FR2511193A1/fr
Application granted granted Critical
Publication of FR2511193B1 publication Critical patent/FR2511193B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H10W40/22—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H10W40/257—
    • H10W76/134—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H10W72/932—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8115361A 1981-08-07 1981-08-07 Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique Granted FR2511193A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8115361A FR2511193A1 (fr) 1981-08-07 1981-08-07 Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8115361A FR2511193A1 (fr) 1981-08-07 1981-08-07 Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique

Publications (2)

Publication Number Publication Date
FR2511193A1 FR2511193A1 (fr) 1983-02-11
FR2511193B1 true FR2511193B1 (enExample) 1984-11-30

Family

ID=9261288

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8115361A Granted FR2511193A1 (fr) 1981-08-07 1981-08-07 Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique

Country Status (1)

Country Link
FR (1) FR2511193A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2544917B1 (fr) * 1983-04-21 1986-09-26 Metalimphy Support allege pour composants electroniques
DE3722119A1 (de) * 1987-07-03 1989-01-12 Siemens Ag Schaltungsmodul mit einem plattenfoermigen schaltungstraeger aus glas oder keramik
US4914551A (en) * 1988-07-13 1990-04-03 International Business Machines Corporation Electronic package with heat spreader member
US5073840A (en) * 1988-10-06 1991-12-17 Microlithics Corporation Circuit board with coated metal support structure and method for making same
CA1316303C (en) * 1988-12-23 1993-04-20 Thijs Eerkes Composite structure
JPH02231751A (ja) * 1989-03-03 1990-09-13 Sumitomo Special Metals Co Ltd リードフレーム用材料
US5469329A (en) 1994-08-08 1995-11-21 Ford Motor Company Printed circuit board with bi-metallic heat spreader
JP3933014B2 (ja) * 2002-08-27 2007-06-20 松下電工株式会社 植物育成貯蔵装置
FR2940521B1 (fr) 2008-12-19 2011-11-11 3D Plus Procede de fabrication collective de modules electroniques pour montage en surface
US20160254210A1 (en) * 2013-10-18 2016-09-01 Griset Support for electronic power components, power module provided with such a support, and corresponding production method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7801658A (nl) * 1977-02-17 1978-08-21 Varian Associates Pakket voor halfgeleider inrichtingen van groot vermogen.
CA1083263A (en) * 1977-06-29 1980-08-05 Norman Hascoe Prefabricated composite metallic heat-transmitting plate unit

Also Published As

Publication number Publication date
FR2511193A1 (fr) 1983-02-11

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Legal Events

Date Code Title Description
ST Notification of lapse