FR2511193A1 - Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique - Google Patents
Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique Download PDFInfo
- Publication number
- FR2511193A1 FR2511193A1 FR8115361A FR8115361A FR2511193A1 FR 2511193 A1 FR2511193 A1 FR 2511193A1 FR 8115361 A FR8115361 A FR 8115361A FR 8115361 A FR8115361 A FR 8115361A FR 2511193 A1 FR2511193 A1 FR 2511193A1
- Authority
- FR
- France
- Prior art keywords
- layer
- copper
- colamine
- substrate
- support according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 title claims description 17
- 239000002184 metal Substances 0.000 title claims description 17
- 239000004065 semiconductor Substances 0.000 title claims description 3
- 238000005452 bending Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- 229910001374 Invar Inorganic materials 0.000 claims abstract description 14
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 16
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 210000000056 organ Anatomy 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 239000004411 aluminium Substances 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 229910000863 Ferronickel Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8115361A FR2511193A1 (fr) | 1981-08-07 | 1981-08-07 | Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8115361A FR2511193A1 (fr) | 1981-08-07 | 1981-08-07 | Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2511193A1 true FR2511193A1 (fr) | 1983-02-11 |
| FR2511193B1 FR2511193B1 (enrdf_load_stackoverflow) | 1984-11-30 |
Family
ID=9261288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8115361A Granted FR2511193A1 (fr) | 1981-08-07 | 1981-08-07 | Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2511193A1 (enrdf_load_stackoverflow) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2544917A1 (fr) * | 1983-04-21 | 1984-10-26 | Metalimphy | Support allege pour composants electroniques |
| US4907125A (en) * | 1987-07-03 | 1990-03-06 | Siemens Aktiengesellschaft | Circuit module including a plate-shaped circuit carrier of glass or ceramic |
| US4914551A (en) * | 1988-07-13 | 1990-04-03 | International Business Machines Corporation | Electronic package with heat spreader member |
| EP0392109A3 (en) * | 1989-03-03 | 1991-01-09 | Sumitomo Special Metal Co., Ltd. | Heat-conductive composite material |
| EP0437656A1 (en) * | 1988-12-23 | 1991-07-24 | Inco Limited | Composite structure having a specific thermal coefficient of expansion |
| US5073840A (en) * | 1988-10-06 | 1991-12-17 | Microlithics Corporation | Circuit board with coated metal support structure and method for making same |
| US5469329A (en) * | 1994-08-08 | 1995-11-21 | Ford Motor Company | Printed circuit board with bi-metallic heat spreader |
| FR2844097A1 (fr) * | 2002-08-27 | 2004-03-05 | Toyota Jidoshokki Kk | Plaque a faible dilatation, procede de fabrication de celle-ci et dispositif a semi-conducteur utilisant la plaque a faible dilatation |
| US8359740B2 (en) | 2008-12-19 | 2013-01-29 | 3D Plus | Process for the wafer-scale fabrication of electronic modules for surface mounting |
| WO2015055899A1 (fr) * | 2013-10-18 | 2015-04-23 | Griset | Support pour composants électroniques de puissance, module de puissance doté d'un tel support, et procédé de fabrication correspondant |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2381388A1 (fr) * | 1977-02-17 | 1978-09-15 | Varian Associates | Empaquetage pour dispositifs a semi-conducteur a grande puissance |
| FR2396263A1 (fr) * | 1977-06-29 | 1979-01-26 | Semi Alloys Inc | Plaque de transmission de la chaleur, metallique, composite et prefabriquee |
-
1981
- 1981-08-07 FR FR8115361A patent/FR2511193A1/fr active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2381388A1 (fr) * | 1977-02-17 | 1978-09-15 | Varian Associates | Empaquetage pour dispositifs a semi-conducteur a grande puissance |
| FR2396263A1 (fr) * | 1977-06-29 | 1979-01-26 | Semi Alloys Inc | Plaque de transmission de la chaleur, metallique, composite et prefabriquee |
Non-Patent Citations (2)
| Title |
|---|
| EXBK/71 * |
| EXBK/78 * |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2544917A1 (fr) * | 1983-04-21 | 1984-10-26 | Metalimphy | Support allege pour composants electroniques |
| EP0124428A1 (fr) * | 1983-04-21 | 1984-11-07 | Imphy S.A. | Support allégé pour composants électroniques |
| US4907125A (en) * | 1987-07-03 | 1990-03-06 | Siemens Aktiengesellschaft | Circuit module including a plate-shaped circuit carrier of glass or ceramic |
| US4914551A (en) * | 1988-07-13 | 1990-04-03 | International Business Machines Corporation | Electronic package with heat spreader member |
| US5073840A (en) * | 1988-10-06 | 1991-12-17 | Microlithics Corporation | Circuit board with coated metal support structure and method for making same |
| EP0437656A1 (en) * | 1988-12-23 | 1991-07-24 | Inco Limited | Composite structure having a specific thermal coefficient of expansion |
| EP0392109A3 (en) * | 1989-03-03 | 1991-01-09 | Sumitomo Special Metal Co., Ltd. | Heat-conductive composite material |
| US5469329A (en) * | 1994-08-08 | 1995-11-21 | Ford Motor Company | Printed circuit board with bi-metallic heat spreader |
| EP0696882A1 (en) | 1994-08-08 | 1996-02-14 | Ford Motor Company | Printed circuit board with bi-metallic heat spreader |
| FR2844097A1 (fr) * | 2002-08-27 | 2004-03-05 | Toyota Jidoshokki Kk | Plaque a faible dilatation, procede de fabrication de celle-ci et dispositif a semi-conducteur utilisant la plaque a faible dilatation |
| US8359740B2 (en) | 2008-12-19 | 2013-01-29 | 3D Plus | Process for the wafer-scale fabrication of electronic modules for surface mounting |
| WO2015055899A1 (fr) * | 2013-10-18 | 2015-04-23 | Griset | Support pour composants électroniques de puissance, module de puissance doté d'un tel support, et procédé de fabrication correspondant |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2511193B1 (enrdf_load_stackoverflow) | 1984-11-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |