FR2510803A1 - RESISTANCE DEVICE COMPRISING A RESISTANCE WITH A VARIABLE OHMIC VALUE AS A FUNCTION OF TEMPERATURE AND A HEATING RESISTANCE - Google Patents
RESISTANCE DEVICE COMPRISING A RESISTANCE WITH A VARIABLE OHMIC VALUE AS A FUNCTION OF TEMPERATURE AND A HEATING RESISTANCE Download PDFInfo
- Publication number
- FR2510803A1 FR2510803A1 FR8212974A FR8212974A FR2510803A1 FR 2510803 A1 FR2510803 A1 FR 2510803A1 FR 8212974 A FR8212974 A FR 8212974A FR 8212974 A FR8212974 A FR 8212974A FR 2510803 A1 FR2510803 A1 FR 2510803A1
- Authority
- FR
- France
- Prior art keywords
- resistance
- resistors
- temperature
- support
- ohmic value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 15
- 239000011224 oxide ceramic Substances 0.000 claims description 2
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims 1
- 230000008878 coupling Effects 0.000 abstract description 9
- 238000010168 coupling process Methods 0.000 abstract description 9
- 238000005859 coupling reaction Methods 0.000 abstract description 9
- 230000001419 dependent effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 241001076195 Lampsilis ovata Species 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
- H01C13/02—Structural combinations of resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/011—Heaters using laterally extending conductive material as connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
Abstract
Description
La présente invention se rapporte à un dispositif à résistances constitué par une résistance dont la valeur ohmique est fonction de la température et par une résistance chauffante qui sont reliées l'une avec l'autre au moyen d'une couche intermédiaire électriquement isolante mais thermiquement conductrice. The present invention relates to a resistance device constituted by a resistance whose ohmic value is a function of temperature and by a heating resistance which are connected to each other by means of an electrically insulating but thermally conductive intermediate layer .
Dans un dispositif à résistances de ce type et connu par le livre de poche se rapportant à la technique HF de Meike GUNDLACH, édition 1962, page ;79, la résistance dont la valeur ohmique dépend de la température est réalisée par un thermistor en perle présentant es fils de raccordement et entouré d'une couche intermédiaire isolante élecUri quement mais conductrice thermiquement. Sur la paroi exJcerieu~* de la couche intermédiaire est enroulée une résistance chauffante dont les fils de raccordement tont saillie librement. In a resistance device of this type and known by the pocket book relating to the HF technique of Meike GUNDLACH, 1962 edition, page; 79, the resistance whose ohmic value depends on the temperature is produced by a pearl thermistor having he connecting wires and surrounded by an electrically insulating but thermally conductive intermediate layer. On the exJcerieu ~ * wall of the intermediate layer is wound a heating resistor whose connection wires project freely.
Dans ce dispositif connu la couche d'enrobage intermédiaire doit être réalisée avec une trés grande précision afin d'obtenir un facteur de transmission reproductible pour des pièces différentes. Il existe en outre le risque que la résistance dont la valeur ohmique est fonction de la température, soit détériorée par les températures relativement élevées et nécessaires au procédé d'enrobage. L'enrobage peut également être détérioré lors du pliage des fils de raccordement ce qui peut provoquer le déroulement de quelques spires de la résistance chauffante et de ce fait une modification du facteur de couplage.In this known device, the intermediate coating layer must be produced with very high precision in order to obtain a reproducible transmission factor for different parts. There is also the risk that the resistance, the ohmic value of which is a function of temperature, may be deteriorated by the relatively high temperatures necessary for the coating process. The coating can also be deteriorated during the bending of the connection wires which can cause the unwinding of a few turns of the heating resistor and therefore a modification of the coupling factor.
La présente invention a pour objet de créer un dispositif à résistances du type défini ci-dessus qui peut être fabriqué en grande série et sans nécessiter une mise en oeuvre technique importante et qui, tout en permettant une bonne reproductibilité, présente une caractéristique de transmission électrique et thermique sensiblement linéaire. The object of the present invention is to create a resistance device of the type defined above which can be manufactured in large series and without requiring significant technical implementation and which, while allowing good reproducibility, has an electrical transmission characteristic. and substantially linear thermal.
Les problèmes exposés ci-dessus sont résolus, conformément à.l'invention par un dispositif à résistances qui est caractérisé en ce que la couche intermédiaire est constituée par un support plan, en ce qu'au moins une résistance dont la valeur ohmique est fonction de la tempé rature, est disposée sur l'une des surfaces principales du support tandis que sur la surface principale opposée est disposée au moins une résistance chauffante et en ce que les résistances sont formées par dépit en couches. The problems set out above are solved, in accordance with the invention by a resistance device which is characterized in that the intermediate layer consists of a flat support, in that at least one resistance whose ohmic value is a function temperature, is arranged on one of the main surfaces of the support while on the opposite main surface is arranged at least one heating resistor and in that the resistors are formed by layers despite.
Selon un perfectionnement de l'objet suivant l'invention,le facteur de couplage qui est fonction de la couche intermédiaire est prédéterminé de façon à présenter une valeur constante grâce au support plan pouvant être réalisé avec une très grande précision. Il est également possible d'obtenir des valeurs précises par suite de la disposition des deux résistances l'une exactement en face de l'autre. L'utilisation de la technique par couches permet de créer un dispositif à résistances dont la caractéristique présente une faible dérive et une faible dispersion et qui peut être fabriqué facilement en grande série.Lorsque les résistances sont, de plus, reliées par l'intermédiaire de voies de branchement à des composants également rapportés par le procédé par couches sur le support, toute modifica tionultérieure de la caractéristique résultant d'une manipulation du dispositif à résistance est évitée de façon sûre
Diverses autres caractéristiques de l'invention ressortent d'ailleurs de la description détaillée qui suit.According to an improvement of the object according to the invention, the coupling factor which is a function of the intermediate layer is predetermined so as to have a constant value thanks to the planar support which can be produced with very high precision. It is also possible to obtain precise values by virtue of the arrangement of the two resistors, one exactly opposite the other. The use of the layered technique makes it possible to create a resistance device whose characteristic has a low drift and a low dispersion and which can be easily manufactured in large series. When the resistors are, moreover, connected by means of ways of connection to components also reported by the process by layers on the support, any later modification of the characteristic resulting from a manipulation of the resistance device is surely avoided
Various other characteristics of the invention will also emerge from the detailed description which follows.
Une forme de réalisation de l'objet de l'invention est représentée,à titre d'exemple non limitatif, au dessin annexé. An embodiment of the object of the invention is shown, by way of nonlimiting example, in the accompanying drawing.
La figure unique montre en perspective le disposée tif à résistances suivant l'invention. The single figure shows a perspective view of the resistive arrangement according to the invention.
Un support 1 en forme de plaquette plane, réalisé en une matière bonne conductrice de la chaleur, de préférence en céramique d'oxyde d'aluminium, porte sur l'une de ses grandes surfaces principales 2 une résistance 3 dont la valeur ohmique est fqnction de la température et qui est rapportée selon la technique par couches. Sur la surface principale opposée du support 1 se trouve une résistance chauffante 4 indiquée en trait interrompu et également rapportée par le procédé par couches et qui est disposée exactement en face de la résistance 3. à valeur ohmique variable. Le support 1 forme alors une couche-intermédiaire électriquement isolante entre les résistances 3 et 4 et constitue en même temps un pont pour le couplage thermique étroit entre ces dernières.La résistance 3, dont la valeur dépend de la température, ainsi que la résistance chauffante 4 sont reliées à des languettes 8 servant à souder le disposée tif dans des circuits imprimés par l'intermédiaire de voies de contact 5 menant vers des surfaces .iffdrentes de raccordemant 6 prévues au bord 7 du support 1. De ce fait des forces exercées sur les languettes de branche!ent 8 ne peuvent pas agir sur le dispositif à résistances et nuire au facteur de couplage. Le facteur de couplage peut être prédéterminé grossièrement par l'épaisseur du support 1 tandis que son réglage précis peut être obtenu par des dimensions et un ajustement appropriés des résistances 3,4. A support 1 in the form of a flat wafer, made of a material which is good conductor of heat, preferably made of aluminum oxide ceramic, carries on one of its large main surfaces 2 a resistance 3 whose ohmic value is fqnction of temperature and which is reported using the layered technique. On the opposite main surface of the support 1 is a heating resistor 4 indicated in broken lines and also reported by the layer process and which is arranged exactly opposite the resistor 3. with variable ohmic value. The support 1 then forms an electrically insulating intermediate layer between the resistors 3 and 4 and at the same time constitutes a bridge for the close thermal coupling between the latter. The resistance 3, the value of which depends on the temperature, as well as the heating resistance 4 are connected to tabs 8 used to weld the tif disposed in printed circuits by means of contact channels 5 leading to .iffdrentes surfaces of connection 6 provided at the edge 7 of the support 1. Therefore forces exerted on the branch tabs! ent 8 cannot act on the resistance device and harm the coupling factor. The coupling factor can be roughly predetermined by the thickness of the support 1 while its precise adjustment can be obtained by appropriate dimensions and adjustment of the resistances 3,4.
Afin d'obtenir dans des circuits de compensation un bon synchronisme des caractéristiques des éléments de couplage thermiques ainsi réalisés, au moins deux dispositifs composés chacun d'une résistance 3 variable en fonction de la température et d'une résistance chauffante 4 sont disposés sur un support 1. Les couches qui sont alors appliquées en une seule opération subissent ensuite le mEme traitement et présentent de ce fait les mêmes caractéristiques. Il suffit alors, avant le montage, de séparer les différents dispositifs à résistances le long d'une ligne destinée à la, rupture afin d'éviter tout couplage réciproque. Lorsqu'on désire des couplages par exemple pour des circuits additionneurs, il n'est pas nécessaire de procéder à cette séparation. In order to obtain a good synchronism in the compensation circuits of the characteristics of the thermal coupling elements thus produced, at least two devices each composed of a resistance 3 variable as a function of the temperature and of a heating resistance 4 are arranged on a support 1. The layers which are then applied in a single operation then undergo the same treatment and therefore have the same characteristics. Before mounting, it suffices to separate the various resistance devices along a line intended for breaking, in order to avoid any reciprocal coupling. When couplings are desired, for example for adder circuits, it is not necessary to carry out this separation.
Il est en outre possible d'associer à une couche de résistance 3 ou 4 plusieurs couches de résistance 4 ou 3 prévues sur l'autre surface principale. De ce fait on peut par exemple mesurer, de façon intégrée, la puissance d'un roseau polyphasé au niveau d'une résistance 3 dont la valeur ohmique est fonction de la température. Il est également possible de commander, à partir d'une seule résistance chauffante 4, plusieurs résistances 3 variables en fonction de la température, et d'appliquer une puissance à plusieurs circuits de commande séparés galvaniquement. It is also possible to combine a resistance layer 3 or 4 with several resistance layers 4 or 3 provided on the other main surface. Therefore, for example, it is possible to measure, in an integrated manner, the power of a polyphase reed at the level of a resistor 3, the ohmic value of which is a function of the temperature. It is also possible to control, from a single heating resistor 4, several resistors 3 which are variable as a function of the temperature, and to apply a power to several galvanically separated control circuits.
Claims (8)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19813129862 DE3129862A1 (en) | 1981-07-29 | 1981-07-29 | Resistor arrangement |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2510803A1 true FR2510803A1 (en) | 1983-02-04 |
FR2510803B3 FR2510803B3 (en) | 1984-08-17 |
Family
ID=6137971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8212974A Granted FR2510803A1 (en) | 1981-07-29 | 1982-07-26 | RESISTANCE DEVICE COMPRISING A RESISTANCE WITH A VARIABLE OHMIC VALUE AS A FUNCTION OF TEMPERATURE AND A HEATING RESISTANCE |
Country Status (3)
Country | Link |
---|---|
AT (1) | ATA291182A (en) |
DE (1) | DE3129862A1 (en) |
FR (1) | FR2510803A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0174544A1 (en) * | 1984-09-07 | 1986-03-19 | Nippondenso Co., Ltd. | Self-temperature controlling type heating device |
EP0201967A1 (en) * | 1985-05-09 | 1986-11-20 | Ferro Techniek B.V. | Heating device |
FR2640803A1 (en) * | 1988-12-15 | 1990-06-22 | Neiman Sa | High temperature ceramic resistor |
FR2668876A1 (en) * | 1990-11-07 | 1992-05-07 | Alcatel Espace | ELECTRONIC TEMPERATURE CONTROL CIRCUIT. |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE8505911L (en) * | 1985-12-13 | 1987-06-14 | Kanthal Ab | Foil elements |
DE3827073A1 (en) * | 1988-08-10 | 1990-02-15 | Ego Elektro Blanc & Fischer | Electric hotplate |
DE4304436A1 (en) * | 1993-02-13 | 1994-08-18 | Ego Elektro Blanc & Fischer | Monitoring unit for a power load |
US5867086A (en) * | 1996-03-05 | 1999-02-02 | Calsonic Corporation | Resistor unit for a fan speed controller of an automotive air conditioning device |
DE102016101249A1 (en) * | 2015-11-02 | 2017-05-04 | Epcos Ag | Sensor element and method for producing a sensor element |
GB2605626B (en) * | 2021-04-08 | 2024-10-02 | Dyson Technology Ltd | A heater |
-
1981
- 1981-07-29 DE DE19813129862 patent/DE3129862A1/en not_active Ceased
-
1982
- 1982-07-26 FR FR8212974A patent/FR2510803A1/en active Granted
- 1982-07-28 AT AT291182A patent/ATA291182A/en not_active Application Discontinuation
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0174544A1 (en) * | 1984-09-07 | 1986-03-19 | Nippondenso Co., Ltd. | Self-temperature controlling type heating device |
US4716279A (en) * | 1984-09-07 | 1987-12-29 | Nippondenso Co., Ltd. | Self-temperature controlling type heating device |
EP0201967A1 (en) * | 1985-05-09 | 1986-11-20 | Ferro Techniek B.V. | Heating device |
FR2640803A1 (en) * | 1988-12-15 | 1990-06-22 | Neiman Sa | High temperature ceramic resistor |
FR2668876A1 (en) * | 1990-11-07 | 1992-05-07 | Alcatel Espace | ELECTRONIC TEMPERATURE CONTROL CIRCUIT. |
EP0484852A1 (en) * | 1990-11-07 | 1992-05-13 | Alcatel Espace | Temperature controlled electronical circuit |
US5268558A (en) * | 1990-11-07 | 1993-12-07 | France Telecom | Temperature-controlled electronic circuit |
Also Published As
Publication number | Publication date |
---|---|
FR2510803B3 (en) | 1984-08-17 |
ATA291182A (en) | 1984-08-15 |
DE3129862A1 (en) | 1983-02-17 |
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---|---|---|---|
ST | Notification of lapse |