FR2500712A1 - Procede d'epargne-soudure de carte imprimee et carte imprimee obtenue selon ce procede - Google Patents

Procede d'epargne-soudure de carte imprimee et carte imprimee obtenue selon ce procede Download PDF

Info

Publication number
FR2500712A1
FR2500712A1 FR8103400A FR8103400A FR2500712A1 FR 2500712 A1 FR2500712 A1 FR 2500712A1 FR 8103400 A FR8103400 A FR 8103400A FR 8103400 A FR8103400 A FR 8103400A FR 2500712 A1 FR2500712 A1 FR 2500712A1
Authority
FR
France
Prior art keywords
pellets
sheets
card
resin
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8103400A
Other languages
English (en)
French (fr)
Other versions
FR2500712B1 (OSRAM
Inventor
Lucien Bourdain
Jean-Michel Derocq
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8103400A priority Critical patent/FR2500712A1/fr
Publication of FR2500712A1 publication Critical patent/FR2500712A1/fr
Application granted granted Critical
Publication of FR2500712B1 publication Critical patent/FR2500712B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
FR8103400A 1981-02-20 1981-02-20 Procede d'epargne-soudure de carte imprimee et carte imprimee obtenue selon ce procede Granted FR2500712A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8103400A FR2500712A1 (fr) 1981-02-20 1981-02-20 Procede d'epargne-soudure de carte imprimee et carte imprimee obtenue selon ce procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8103400A FR2500712A1 (fr) 1981-02-20 1981-02-20 Procede d'epargne-soudure de carte imprimee et carte imprimee obtenue selon ce procede

Publications (2)

Publication Number Publication Date
FR2500712A1 true FR2500712A1 (fr) 1982-08-27
FR2500712B1 FR2500712B1 (OSRAM) 1983-06-17

Family

ID=9255453

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8103400A Granted FR2500712A1 (fr) 1981-02-20 1981-02-20 Procede d'epargne-soudure de carte imprimee et carte imprimee obtenue selon ce procede

Country Status (1)

Country Link
FR (1) FR2500712A1 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2551618A1 (fr) * 1983-09-02 1985-03-08 Inf Milit Spatiale Aeronaut Procede de fabrication d'un circuit imprime a couches enterrees et circuit imprime obtenu par un tel procede

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3628999A (en) * 1970-03-05 1971-12-21 Frederick W Schneble Jr Plated through hole printed circuit boards

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3628999A (en) * 1970-03-05 1971-12-21 Frederick W Schneble Jr Plated through hole printed circuit boards

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/66 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2551618A1 (fr) * 1983-09-02 1985-03-08 Inf Milit Spatiale Aeronaut Procede de fabrication d'un circuit imprime a couches enterrees et circuit imprime obtenu par un tel procede

Also Published As

Publication number Publication date
FR2500712B1 (OSRAM) 1983-06-17

Similar Documents

Publication Publication Date Title
US8156635B2 (en) Carrier for manufacturing a printed circuit board
KR100793454B1 (ko) 회로 보호 복합체
US20030188428A1 (en) Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board
US9706652B2 (en) Printed circuit board and method for manufacturing same
EP0352183A1 (fr) Procédé de montage de micro-composants électroniques sur un support et produit intermédiaire
FR2740648A1 (fr) Connexion sans brasure de contacts electriques utlisant un systeme a combinaison de laser et connexion a poussee par fibre optique
EP3166143A1 (fr) Procede de fabrication d'un dispositif a puce de circuit integre par depot direct de matiere conductrice
EP0044247B1 (fr) Procédé de fabrication d'un support de composants électroniques pour la connexion des supports de puces de circuits intégrés
FR2471726A1 (fr) Circuit electronique et procede de fabrication
FR2834180A1 (fr) Procede de fabrication d'un module multicouches a circuits imprimes a haute densite
EP0059206B1 (fr) Circuit imprime et son procede de fabrication
CN104538314A (zh) 三层封装基板及封装芯片的制作方法及三层封装基板
WO2006000694A1 (fr) Circuit imprime flex-rigide par collage
CN100414689C (zh) 电子部件的制造方法及电子部件
US12342470B2 (en) Methods to fill through-holes of a substrate with metal paste
FR2791471A1 (fr) Procede de fabrication de puces de circuits integres
FR2527956A1 (fr) Contreplaque de percage stratifiee et procede de fabrication et d'utilisation de celle-ci
EP0163581B1 (fr) Procédé de réalisation d'un dispositif de raccordement électrique entre deux cartes de circuits imprimés, dispositif ainsi obtenu, et procédé de raccordement électrique mettant en oeuvre ce dispositif
FR2551618A1 (fr) Procede de fabrication d'un circuit imprime a couches enterrees et circuit imprime obtenu par un tel procede
FR2571547A1 (fr) Circuit hybride reportable sur un support comportant un reseau d'interconnexion a haute densite
JP2549713B2 (ja) ブラインドスルーホールを有する多層プリント基板の製造方法
Moon et al. Stepwise via formation on multilayered metal/polymer structures by CO2 laser percussion drilling and its application to multilayered micro and nanoelectronic devices
WO2002051223A1 (fr) Procede de realisation d'interconnexion dans un circuit imprime multicouches
FR2473834A1 (fr) Procede de soudure automatique de microcomposants sur un circuit imprime, et circuit imprime equipe ainsi realise
US5151300A (en) Method for forming a carbon resistance in a printed wiring board

Legal Events

Date Code Title Description
ST Notification of lapse